{"id":289,"date":"2026-03-19T08:40:00","date_gmt":"2026-03-19T00:40:00","guid":{"rendered":"https:\/\/www.han-sphere.com\/?p=289"},"modified":"2026-03-18T22:37:20","modified_gmt":"2026-03-18T14:37:20","slug":"flexible-pcb-manufacturing-yield-optimization","status":"publish","type":"post","link":"https:\/\/www.han-sphere.com\/de\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/","title":{"rendered":"Flexible PCB-Herstellung: Bew\u00e4hrte Strategien zur Optimierung der Ausbeute"},"content":{"rendered":"<p>Herstellung <strong>Flexible PCBs (FPC)<\/strong> ist wesentlich schwieriger als bei herk\u00f6mmlichen starren Platten. Da das Substrat - in der Regel Polyimid (PI) - d\u00fcnn und mechanisch instabil ist, k\u00f6nnen schon geringe Prozessschwankungen zu Dimensionsverschiebungen, Spurenbr\u00fcchen oder Delamination f\u00fchren.<\/p>\n\n\n\n<p>F\u00fcr Ingenieure und Beschaffungsteams, <strong>Optimierung der Ausbeute<\/strong> ist der effektivste Weg, um die hohen St\u00fcckkosten von Flexschaltungen zu senken. Hier ist, wie <strong><a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/\">Hansphere<\/a><\/strong> n\u00e4hert sich der ertragsstarken FPC-Produktion.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"440\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-14.jpg\" alt=\"Flex-Leiterplatten-Design\" class=\"wp-image-291\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-14.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-14-300x220.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">1. Die zentrale Herausforderung: Dimensionsstabilit\u00e4t<\/h2>\n\n\n\n<p>Im Gegensatz zu FR-4 absorbiert Polyimid Feuchtigkeit und schrumpft\/dehnt sich w\u00e4hrend der thermischen Zyklen (Laminieren und L\u00f6ten). Diese \u201cMaterialbewegung\u201d ist der #1 Feind der Registrierungsgenauigkeit.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Expertenstrategie:<\/strong> Verwenden Sie <strong>Erweiterte Skalierungsfaktoren<\/strong>. Erfahrene Hersteller wenden einen nichtlinearen Kompensationsfaktor auf die fotolithografische Vorlage an, um die Materialschrumpfung zu ber\u00fccksichtigen.<\/li>\n\n\n\n<li><strong>Profi-Tipp:<\/strong> Entscheiden Sie sich f\u00fcr <strong>Klebstofflose Grundmaterialien<\/strong>. PI ohne Klebstoff bietet eine \u00fcberlegene Dimensionsstabilit\u00e4t und ein niedrigeres Profil als herk\u00f6mmliche Laminate auf Klebstoffbasis, was die Ausbeute f\u00fcr <a href=\"https:\/\/www.han-sphere.com\/hdi-pcb\/\" target=\"_blank\" rel=\"noreferrer noopener\">HDI-PCB<\/a> Flex-Ausf\u00fchrungen.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">2. DFM Best Practices f\u00fcr Flex Yield<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">\u00dcbergangszonenmanagement<\/h3>\n\n\n\n<p>Der Punkt, an dem eine flexible Schaltung auf eine <a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/rigid-pcb\/\">Starre PCB<\/a> oder eine Versteifung ist ein \u201cStress Riser\u201d. Ohne geeignete Konstruktion werden die Leiterbahnen hier beim Biegen rei\u00dfen.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Die L\u00f6sung:<\/strong> Umsetzung <strong>Teardrops<\/strong> auf allen Pads und verwenden <strong>Allm\u00e4hliche \u00dcberg\u00e4nge der Spurbreite<\/strong>.<\/li>\n\n\n\n<li><strong>Die \u201cRadius\u201d-Regel:<\/strong> Vermeiden Sie scharfe 90-Grad-Ecken im Umriss der Platte. Verwenden Sie einen Mindestradius von 1,5 mm, um ein Ausrei\u00dfen der Kanten zu verhindern.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Kupfermerkmale &amp; \u00c4tzen<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>I-Beam-Effekt:<\/strong> Stapeln Sie bei doppelseitigen Flex-Platinen niemals Leiterbahnen direkt \u00fcbereinander, wenn die Platine gefaltet werden soll. Eine Staffelung der Leiterbahnen verringert die mechanische Belastung des Kupfers.<\/li>\n\n\n\n<li><strong>Kreuzschraffur:<\/strong> F\u00fcr gro\u00dfe Grundfl\u00e4chen verwenden Sie eine <strong>Kreuzschraffur-Muster<\/strong> anstelle von massivem Kupfer. Dadurch bleibt die Flexibilit\u00e4t erhalten und der \u201cBimetallstreifen\u201d-Effekt, der zu Rollneigung f\u00fchrt, wird verhindert.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"451\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-15.jpg\" alt=\"Flex-Leiterplatten-Design\" class=\"wp-image-292\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-15.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-15-300x226.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">5 Schritte zur Optimierung der Ausbeute Ihrer Flex-PCB<\/h2>\n\n\n\n<div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\"><strong>Ziel:<\/strong> Entwicklungsingenieure und Qualit\u00e4tsmanager <br><strong>Das Ziel:<\/strong> Minimierung der Ausschussrate bei der Massenproduktion<\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1773844469276\"><strong class=\"schema-how-to-step-name\">Schritt 1: Optimierung der Panelauslastung<\/strong> <p class=\"schema-how-to-step-text\">Flexible Materialien sind teuer. Arbeiten Sie mit Ihrem <a href=\"https:\/\/www.han-sphere.com\/pcb-manufacturing\/\" target=\"_blank\" rel=\"noreferrer noopener\">PCB-Herstellung<\/a> Partner, um Ihre Entw\u00fcrfe auf der Produktionsplatte effizient zu verschachteln. Selbst eine Verbesserung der Verschachtelung um 5% kann Tausende von Materialkosten einsparen.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773844485946\"><strong class=\"schema-how-to-step-name\">Schritt 2: Auswahl der richtigen Versteifung<\/strong> <p class=\"schema-how-to-step-text\">Ob FR-4, Polyimid oder Edelstahlversteifungen verwendet werden, die Ausrichtung ist entscheidend.<br\/><strong>Hansphere-Strategie:<\/strong> Wir verwenden eine automatische optische Ausrichtung f\u00fcr die Versteifungslaminierung, um sicherzustellen, dass der \u00dcbergang von flexibel zu starr spannungsfrei bleibt.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773844495775\"><strong class=\"schema-how-to-step-name\">Schritt 3: Implementieren von \u201cPads-Only\u201d-Abdeck\u00f6ffnungen<\/strong> <p class=\"schema-how-to-step-text\">Vermeiden Sie gro\u00dfe, gruppenartige \u00d6ffnungen f\u00fcr die Abdeckung. Einzelne \u00d6ffnungen f\u00fcr jede Unterlage sorgen f\u00fcr eine bessere Abdichtung und verhindern das Einschlie\u00dfen von Chemie w\u00e4hrend <a href=\"https:\/\/www.han-sphere.com\/pcb-assembly\/\" target=\"_blank\" rel=\"noreferrer noopener\">PCB-Montage<\/a>, was sonst zu langfristiger Korrosion f\u00fchrt.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773844505973\"><strong class=\"schema-how-to-step-name\">Schritt 4: Kontrolle des Biegeradius<\/strong> <p class=\"schema-how-to-step-text\">Achten Sie bei Ihrem Entwurf auf die <strong>Minimaler Biegeradius<\/strong> (in der Regel das 6- bis 10-fache der Dicke bei statischer Biegung und das 20-fache und mehr bei dynamischer Biegung). Ein \u00dcberschreiten dieser Grenze ist der schnellste Weg, um die Ausbeute auf Null zu senken.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773844516057\"><strong class=\"schema-how-to-step-name\">Schritt 5: Erweiterte elektrische Pr\u00fcfung<\/strong> <p class=\"schema-how-to-step-text\">Unter <a href=\"https:\/\/www.han-sphere.com\/high-frequency-pcb\/\" target=\"_blank\" rel=\"noreferrer noopener\">Hochfrequenz-PCBs<\/a><br\/>die flexibel sind, reichen Standard-Durchgangspr\u00fcfungen nicht aus. Verwenden Sie <strong>Flying Probe Testing<\/strong> mit Niederdruckspitzen, um eine Besch\u00e4digung der weichen PI-Oberfl\u00e4che zu vermeiden.<\/p> <\/li><\/ol><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">3. Warum Materialhandhabung wichtig ist<\/h2>\n\n\n\n<p>Die Ausbeute wird in der Werkstatt gewonnen oder verloren. Da Flexboards so d\u00fcnn sind, sind sie anf\u00e4llig f\u00fcr \u201cHandhabungssch\u00e4den\u201d (Knicke und Kratzer).<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Der Ansatz von Hansphere:<\/strong> Wir verwenden spezialisierte <strong>Vakuum-Handhabungsgestelle<\/strong> und Zwischenlagen in der gesamten Produktionslinie, um sicherzustellen, dass die blanken Schaltkreise nicht mechanisch belastet werden.<\/li>\n\n\n\n<li><strong>Erfahren Sie mehr:<\/strong> Entdecken Sie unser spezialisiertes <a href=\"https:\/\/www.han-sphere.com\/flex-pcb\/\" target=\"_blank\" rel=\"noreferrer noopener\">Flex-PCB<\/a> und <a href=\"https:\/\/www.han-sphere.com\/rigid-flex-pcb\/\" target=\"_blank\" rel=\"noreferrer noopener\">Starr-Flex-Leiterplatte<\/a> F\u00e4higkeiten.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"468\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-16.jpg\" alt=\"Flex-Leiterplatten-Design\" class=\"wp-image-293\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-16.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-16-300x234.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Flexible PCB-Herstellung &amp; Ausbeute FAQ<\/h2>\n\n\n\n<div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1769697757200\"><strong class=\"schema-faq-question\"><strong>Q1: Warum verzieht sich meine flexible Leiterplatte nach dem Reflow-Prozess?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong> Dies ist in der Regel auf eine unausgewogene Kupferverteilung oder Feuchtigkeitsaufnahme in der PI zur\u00fcckzuf\u00fchren. Das Vorbacken der Platten bei $120$\u00b0C f\u00fcr 2-4 Stunden vor der Montage kann Verzug und Delaminierung erheblich reduzieren.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1769697772209\"><strong class=\"schema-faq-question\"><strong>F2: Kann ich normale Durchgangsl\u00f6cher im Biegebereich verwenden?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong> <strong>Auf keinen Fall.<\/strong> Vias und plattierte L\u00f6cher sind starre Strukturen. Wenn sie in einem gebogenen Bereich platziert werden, wird die Beschichtung fast sofort rei\u00dfen. Bringen Sie Durchkontaktierungen immer in eine \u201cneutrale\u201d oder versteifte Zone.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1769697789609\"><strong class=\"schema-faq-question\"><strong>F3: Wie gew\u00e4hrleistet Hansphere eine hohe Ausbeute bei komplexen Flex-Designs?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong> Wir f\u00fchren eine umfassende <strong>DFM-Pr\u00fcfung vor der CAM<\/strong>. Unsere Ingenieure analysieren Ihr <a href=\"https:\/\/www.han-sphere.com\/pcb-design\/\" target=\"_blank\" rel=\"noreferrer noopener\">PCB-Entwurf<\/a> auf potenzielle Belastungspunkte und schlagen \u00c4nderungen vor, bevor wir mit der ersten Produktionsserie beginnen.<\/p> <\/div> <\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Schlussfolgerung<\/h2>\n\n\n\n<p>Bei der Optimierung der Ausbeute in der flexiblen Leiterplattenfertigung geht es nicht nur um bessere Maschinen, sondern auch um eine enge Partnerschaft zwischen dem Designer und dem Hersteller. Durch die Ber\u00fccksichtigung der mechanischen Grenzen von Polyimid und die Implementierung eines DFM-gerechten Routings k\u00f6nnen Sie eine stabile, kosteneffiziente Produktion selbst f\u00fcr die komplexesten Anwendungen erreichen.<\/p>\n\n\n\n<p><strong>Sie m\u00f6chten Ihre Flex PCB-Produktion erweitern?<\/strong> Unter <strong><a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/about\/\">Hansphere<\/a><\/strong>, Wir haben uns auf die Herstellung von Produkten mit hohem Ertrag f\u00fcr die Medizintechnik, die Luft- und Raumfahrt und die Unterhaltungselektronik spezialisiert. <strong><a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/contact\/\">Kontakt zu unserem technischen Team<\/a><\/strong> heute f\u00fcr eine Beratung zur Ertragsoptimierung.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Erfahren Sie, was bei der Herstellung flexibler Leiterplatten zu beachten ist, welche Probleme bei der Ausbeute h\u00e4ufig auftreten und mit welchen Designstrategien die Produktionsstabilit\u00e4t verbessert und der Ausschuss reduziert werden kann.<\/p>","protected":false},"author":1,"featured_media":290,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[4],"tags":[28],"class_list":["post-289","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-flexible-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Flexible PCB Yield Optimization: A 2026 Manufacturing Guide<\/title>\n<meta name=\"description\" content=\"Maximize your Flex PCB production yield. Learn expert strategies for material stability, trace routing, stiffener alignment, and DFM to reduce costs and defects.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Flexible PCB Yield Optimization: A 2026 Manufacturing Guide\" \/>\n<meta property=\"og:description\" content=\"Maximize your Flex PCB production yield. Learn expert strategies for material stability, trace routing, stiffener alignment, and DFM to reduce costs and defects.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/\" \/>\n<meta property=\"og:site_name\" content=\"hansphere\" \/>\n<meta property=\"article:published_time\" content=\"2026-03-19T00:40:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-13.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"478\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"hansphere01\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Verfasst von\" \/>\n\t<meta name=\"twitter:data1\" content=\"hansphere01\" \/>\n\t<meta name=\"twitter:label2\" content=\"Gesch\u00e4tzte Lesezeit\" \/>\n\t<meta name=\"twitter:data2\" content=\"5\u00a0Minuten\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":[\"WebPage\",\"FAQPage\"],\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/\",\"name\":\"Flexible PCB Yield Optimization: A 2026 Manufacturing Guide\",\"isPartOf\":{\"@id\":\"https:\/\/www.han-sphere.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/01\/flex-pcb-design-13.jpg\",\"datePublished\":\"2026-03-19T00:40:00+00:00\",\"author\":{\"@id\":\"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422\"},\"description\":\"Maximize your Flex PCB production yield. 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Pre-baking the boards at $120$\u00b0C for 2-4 hours before assembly can significantly reduce warping and delamination.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/#faq-question-1769697772209\",\"position\":2,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/#faq-question-1769697772209\",\"name\":\"Q2: Can I use standard through-holes in the bend area?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<strong>A:<\/strong> <strong>Absolutely not.<\/strong> Vias and plated holes are rigid structures. Placing them in a bend area will cause the plating to crack almost immediately. Always move vias to a \\\"neutral\\\" or stiffened zone.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/#faq-question-1769697789609\",\"position\":3,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/#faq-question-1769697789609\",\"name\":\"Q3: How does Hansphere ensure high yield for complex flex designs?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<strong>A:<\/strong> We perform a comprehensive <strong>Pre-CAM DFM review<\/strong>. Our engineers analyze your <a href=\\\"https:\/\/www.han-sphere.com\/pcb-design\/\\\" target=\\\"_blank\\\" rel=\\\"noreferrer noopener\\\">PCB Design<\/a> for potential stress points and suggest modifications before we start the first production run.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"HowTo\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/#howto-1\",\"name\":\"Flexible PCB Manufacturing: Proven Strategies for Yield Optimization\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/\"},\"description\":\"&lt;strong>Target:&lt;\/strong> Design Engineers &amp; Quality Managers &lt;br>&lt;strong>Goal:&lt;\/strong> Minimizing Scrap Rates during Mass Production\",\"step\":[{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/#how-to-step-1773844469276\",\"name\":\"Step 1: Optimize Panel Utilization\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Flex materials are expensive. 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Pre-baking the boards at $120$\u00b0C for 2-4 hours before assembly can significantly reduce warping and delamination.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/#faq-question-1769697772209","position":2,"url":"https:\/\/www.han-sphere.com\/blog\/news\/flexible-pcb-manufacturing-yield-optimization\/#faq-question-1769697772209","name":"F2: Kann ich normale Durchgangsl\u00f6cher im Biegebereich verwenden?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"<strong>A:<\/strong> <strong>Absolutely not.<\/strong> Vias and plated holes are rigid structures. Placing them in a bend area will cause the plating to crack almost immediately. 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