{"id":303,"date":"2026-03-23T08:03:00","date_gmt":"2026-03-23T00:03:00","guid":{"rendered":"https:\/\/www.han-sphere.com\/?p=303"},"modified":"2026-03-22T23:32:08","modified_gmt":"2026-03-22T15:32:08","slug":"hdi-pcb-design-technology-overview","status":"publish","type":"post","link":"https:\/\/www.han-sphere.com\/de\/blog\/news\/hdi-pcb-design-technology-overview\/","title":{"rendered":"HDI PCB Design und Technologie: Die Grenzen der Miniaturisierung verschieben"},"content":{"rendered":"<p>In der Welt von 5G, KI und Wearable Tech ist Platz das teuerste Gut auf einer Leiterplatte. Die Standard-Durchstecktechnologie ist bei BGA-Komponenten mit kleinem Raster (0,4 mm oder weniger) oft nicht ausreichend. Das ist der Punkt <strong><a href=\"https:\/\/www.han-sphere.com\/hdi-pcb\/\">HDI<\/a> (High-Density Interconnect)<\/strong> Technologie unverzichtbar wird.<\/p>\n\n\n\n<p>Unter <strong><a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/\">Hansphere<\/a><\/strong>, sind wir auf die komplexen Aufbauprozesse spezialisiert, die f\u00fcr die Herstellung zuverl\u00e4ssiger HDI-Platinen erforderlich sind. Es geht nicht nur um kleinere L\u00f6cher, sondern um eine grundlegende Ver\u00e4nderung der Art und Weise, wie Schichten verbunden werden.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"376\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design.jpg\" alt=\"HDI PCB Design\" class=\"wp-image-304\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-300x188.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><a href=\"https:\/\/www.han-sphere.com\/hdi-pcb\/\">Was ist eine HDI-Leiterplatte?<\/a>?<\/h2>\n\n\n\n<p>Eine HDI-Leiterplatte ist gekennzeichnet durch:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Microvias (lasergebohrte Vias \u2264150 \u00b5m)<\/li>\n\n\n\n<li>Blinde und vergrabene Durchkontaktierungen<\/li>\n\n\n\n<li>Feine Linien \/ feine Abst\u00e4nde fr\u00e4sen<\/li>\n\n\n\n<li>Sequentielle Laminierungsverfahren<\/li>\n<\/ul>\n\n\n\n<p>Die HDI-Technologie erh\u00f6ht die Verbindungsdichte, ohne die Leiterplattengr\u00f6\u00dfe zu erh\u00f6hen.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">1. Die Kernkomponenten der HDI-Architektur<\/h2>\n\n\n\n<p>Das entscheidende Merkmal einer HDI-Karte ist die Verwendung von <strong>Microvias<\/strong>-Lasergebohrte L\u00f6cher mit einem Durchmesser von typischerweise weniger als 150\u00b5m.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Key Via Structures:<\/h3>\n\n\n\n<p><strong>ELIC (Every Layer Interconnect):<\/strong> Die Kr\u00f6nung von HDI, bei der alle Schichten \u00fcber kupfergef\u00fcllte Microvias verbunden sind, was eine maximale Designflexibilit\u00e4t erm\u00f6glicht.<\/p>\n\n\n\n<p><strong>Blinde Vias:<\/strong> Verbinden Sie eine \u00e4u\u00dfere Lage mit mindestens einer inneren Lage, aber gehen Sie nicht durch die gesamte Platte.<\/p>\n\n\n\n<p><strong>Vergrabene Vias:<\/strong> Verbinden zwei oder mehr innere Schichten, ohne jemals eine \u00e4u\u00dfere Oberfl\u00e4che zu erreichen.<\/p>\n\n\n\n<p><strong>Gestapelte vs. gestaffelte Vias:<\/strong> Bei extrem dichten Designs k\u00f6nnen Microvias direkt \u00fcbereinander gestapelt (mit Kupfer gef\u00fcllt) oder \u00fcber die Lagen hinweg versetzt werden, um Platz zu sparen und das Routing zu verbessern.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">2. Warum HDI w\u00e4hlen? Mehr als nur Gr\u00f6\u00dfe<\/h2>\n\n\n\n<p>Der offensichtliche Vorteil ist die Miniaturisierung, <a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/hdi-pcb\/\">HDI-PCB<\/a> Technologie bietet erhebliche elektrische Vorteile:<\/p>\n\n\n\n<p><strong>Verbesserte RFI\/EMI:<\/strong> K\u00fcrzere Verbindungswege und eine bessere Integrit\u00e4t der Grundplatte f\u00fchren zu einer besseren elektromagnetischen Leistung.<\/p>\n\n\n\n<p><strong>Reduzierte parasit\u00e4re Kapazit\u00e4t:<\/strong> Kleinere Durchkontaktierungen haben weniger parasit\u00e4re Effekte, was entscheidend ist f\u00fcr <a href=\"https:\/\/www.han-sphere.com\/blog\/news\/high-speed-pcb-design\/\" target=\"_blank\" rel=\"noreferrer noopener\">Hochgeschwindigkeits-PCB-Design<\/a>.<\/p>\n\n\n\n<p><strong>Eliminierung von Stubs:<\/strong> Im Gegensatz zu Durchgangsl\u00f6chern entstehen bei Microvias keine \u201cStubs\u201d, die Signalreflexionen verursachen.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"510\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-1.jpg\" alt=\"HDI PCB Design\" class=\"wp-image-305\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-1.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-1-300x255.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">5 Schritte zum \u00dcbergang vom Standard- zum HDI-Design<\/h2>\n\n\n\n<div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\"><strong>Ziel:<\/strong> Hardware-Ingenieure und PCB-Layout-Spezialisten <br><strong>Schwerpunkt:<\/strong> Die Microvia-Strategie meistern<\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1774193328214\"><strong class=\"schema-how-to-step-name\">Schritt 1: Analysieren von BGA-Teilung und Fan-out<\/strong> <p class=\"schema-how-to-step-text\">Wenn Ihr BGA-Abstand $\\le 0,5mm$ betr\u00e4gt, ist das Standard-Via-in-Pad keine Option mehr. Sie m\u00fcssen auf die Microvia-in-Pad-Technologie umsteigen, um das Escape-Routing zu verwalten.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1774193341208\"><strong class=\"schema-how-to-step-name\">Schritt 2: W\u00e4hlen Sie den korrekten Aufbau (z. B. 1+N+1)<\/strong> <p class=\"schema-how-to-step-text\">Definieren Sie die Anzahl der lasergebohrten Schichten. Eine \u201c1+N+1\u201d-Struktur bedeutet eine Schicht von Microvias auf jeder Seite eines herk\u00f6mmlichen Kerns. F\u00fcr mehr Komplexit\u00e4t gehen Sie zu 2+N+2 oder ELIC \u00fcber.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1774193350934\"><strong class=\"schema-how-to-step-name\">Schritt 3: Materialkompatibilit\u00e4t f\u00fcr das Laserbohren<\/strong> <p class=\"schema-how-to-step-text\">Nicht alle FR-4-Materialien sind f\u00fcr den Laserabtrag geeignet. W\u00e4hlen Sie \u201cLaserbohrbare\u201d Prepregs mit gleichbleibendem Harzgehalt, um saubere Durchgangsl\u00f6cher und eine zuverl\u00e4ssige Beschichtung zu gew\u00e4hrleisten.<br\/><em>Verwandt:<\/em> Siehe unser <a href=\"https:\/\/www.han-sphere.com\/blog\/news\/high-speed-pcb-stackup-material-selection\/\" target=\"_blank\" rel=\"noreferrer noopener\">High-Speed PCB Materialauswahl<\/a> f\u00fcr Laminat-Ideen.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1774193369510\"><strong class=\"schema-how-to-step-name\">Schritt 4: Verwalten des Seitenverh\u00e4ltnisses<\/strong> <p class=\"schema-how-to-step-text\">Um eine zuverl\u00e4ssige Verkupferung zu gew\u00e4hrleisten, sollte das Seitenverh\u00e4ltnis (Tiefe zu Durchmesser) einer Microvia idealerweise $0,75:1$ oder $1:1$ betragen. Ein \u00dcberschreiten dieses Wertes erschwert den chemischen Fl\u00fcssigkeitsaustausch w\u00e4hrend <a href=\"https:\/\/www.han-sphere.com\/pcb-manufacturing\/\" target=\"_blank\" rel=\"noreferrer noopener\">PCB-Herstellung<\/a>.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1774193387222\"><strong class=\"schema-how-to-step-name\">Schritt 5: Koordinierung mit Hansphere DFM<\/strong> <p class=\"schema-how-to-step-text\">Die HDI-Fertigung erfordert pr\u00e4zise sequenzielle Laminierungszyklen. Wenden Sie sich an unser Team, um Ihren Stackup zu \u00fcberpr\u00fcfen und sicherzustellen, dass der Via-F\u00fcllprozess (VIPPO - Via In Pad Plated Over) unseren Produktionsstandards entspricht.<\/p> <\/li><\/ol><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">3. Herausforderungen bei der Herstellung von HDI<\/h2>\n\n\n\n<p><strong>\u00dcber die F\u00fcllung:<\/strong> Gestapelte Durchkontaktierungen m\u00fcssen vollst\u00e4ndig mit leitf\u00e4higem oder nicht leitf\u00e4higem Epoxidharz gef\u00fcllt und \u00fcberplattiert werden, um eine ebene Oberfl\u00e4che f\u00fcr <a href=\"https:\/\/www.han-sphere.com\/pcb-assembly\/\" target=\"_blank\" rel=\"noreferrer noopener\">PCB-Montage<\/a>.<\/p>\n\n\n\n<p><strong>Sequentielle Lamination:<\/strong> Jede HDI-Schicht erfordert einen separaten Laminierungs-, Bohr- und Beschichtungszyklus. Dies erh\u00f6ht sowohl die Kosten als auch die Vorlaufzeit, wodurch die DFM-Genauigkeit entscheidend ist.<\/p>\n\n\n\n<p><strong>Genauigkeit bei der Registrierung:<\/strong> Das Ausrichten eines 100-\u00b5m-Laserbohrers auf einem 200-\u00b5m-Pad \u00fcber mehrere Schichten hinweg erfordert Pr\u00e4zision im Submikrometerbereich.<\/p>\n\n\n\n<p><\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"387\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-2.jpg\" alt=\"HDI PCB Design\" class=\"wp-image-306\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-2.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-2-300x194.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">FAQ - HDI PCB Design \u00dcbersicht<\/h2>\n\n\n\n<div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1770221089425\"><strong class=\"schema-faq-question\">Q: <strong>1. Was bedeutet HDI beim PCB-Design?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: HDI steht f\u00fcr High Density Interconnect und bezieht sich auf Leiterplattendesigns, bei denen Microvias und Feinrouting zur Erh\u00f6hung der Dichte eingesetzt werden.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1770221108803\"><strong class=\"schema-faq-question\">Q: <strong>2. Sind HDI-Platinen nur f\u00fcr Unterhaltungselektronik geeignet?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Nein. HDI wird h\u00e4ufig in der Medizin, in der Automobilindustrie und in industriellen Systemen eingesetzt.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1770221130286\"><strong class=\"schema-faq-question\">Q: <strong>3. Verringern HDI-Leiterplatten immer die Leiterplattengr\u00f6\u00dfe?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Oft ja, aber der Hauptvorteil ist die Routingdichte, nicht die Gr\u00f6\u00dfe allein.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1770221143496\"><strong class=\"schema-faq-question\">Q: <strong>4. Ist das HDI-Leiterplattendesign teurer?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Die Anfangskosten sind h\u00f6her, aber die Kosten auf Systemebene k\u00f6nnen reduziert werden.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1770221163885\"><strong class=\"schema-faq-question\"><strong>F5: Was ist die Mindestgr\u00f6\u00dfe der Laserbohrer bei Hansphere?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong> Wir unterst\u00fctzen in der Regel Mikrovias bis hinunter zu <strong>0,1 mm (4 mil)<\/strong> f\u00fcr die Standardproduktion, mit erweiterten M\u00f6glichkeiten bis hin zu <strong>0,075 mm<\/strong> f\u00fcr spezialisierte <a href=\"https:\/\/www.han-sphere.com\/flex-pcb\/\" target=\"_blank\" rel=\"noreferrer noopener\">Flexible Leiterplatte<\/a> oder medizinische Anwendungen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1774193467922\"><strong class=\"schema-faq-question\"><strong>F6: Kostet HDI immer mehr als Standard-PCBs?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong> W\u00e4hrend der Preis pro Quadratzoll h\u00f6her ist, kann HDI tats\u00e4chlich <strong>die Gesamtkosten des Systems zu senken<\/strong>. Durch die Reduzierung der Lagenzahl (z. B. Umwandlung einer 14-lagigen Standardplatine in eine 8-lagige HDI-Platine) k\u00f6nnen Sie die Herstellungskosten oft ausgleichen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1774193486242\"><strong class=\"schema-faq-question\"><strong>F7: Ist HDI f\u00fcr Hochleistungsanwendungen geeignet?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong> Ja, aber das W\u00e4rmemanagement ist entscheidend. Die Verwendung von kupfergef\u00fcllten Mikrovias kann die W\u00e4rmeleitf\u00e4higkeit in der N\u00e4he von hei\u00dfen Komponenten wie Hochgeschwindigkeitsprozessoren tats\u00e4chlich verbessern.<\/p> <\/div> <\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Schlussfolgerung<\/h2>\n\n\n\n<p>Die HDI-Technologie ist die Br\u00fccke in die Zukunft der Elektronik. Durch die Beherrschung von Microvia-Strukturen und sequentieller Laminierung k\u00f6nnen Ingenieure mehr Funktionalit\u00e4t in kleinere, schnellere und zuverl\u00e4ssigere Ger\u00e4te packen.<\/p>\n\n\n\n<p><strong>Sind Sie bereit, Ihr Design zu verbessern?<\/strong> Hansphere ist f\u00fchrend in der HDI-Fertigung, von 1+N+1 bis zu komplexen Every-Layer-Platinen. <strong><a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/contact\/\">Holen Sie sich eine HDI-Designpr\u00fcfung<\/a><\/strong> oder erfahren Sie mehr \u00fcber unsere fortschrittlichen Ger\u00e4te auf unserer <strong><a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/about\/\">\u00dcber die Seite<\/a><\/strong>.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Die High-Density Interconnect (HDI)-Technologie hat das Electronic Packaging revolutioniert, da sie eine h\u00f6here Komponentendichte und eine bessere Signalleistung auf kleinerer Grundfl\u00e4che erm\u00f6glicht. In diesem technischen \u00dcberblick werden die Hauptpfeiler von HDI - einschlie\u00dflich Blind-, Buried- und Microvia-Strukturen - analysiert und der \u00dcbergang zu Every Layer Interconnect (ELIC) erl\u00e4utert. Wir er\u00f6rtern die Fertigungspr\u00e4zision, die f\u00fcr lasergebohrte Durchkontaktierungen erforderlich ist, und bieten einen Fahrplan f\u00fcr Ingenieure zur Optimierung ihrer BGA-Fan-outs und Stackup-Lagen f\u00fcr maximale Zuverl\u00e4ssigkeit und Signalintegrit\u00e4t.<\/p>","protected":false},"author":1,"featured_media":307,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[4],"tags":[30],"class_list":["post-303","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-hdi-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>HDI PCB Design &amp; Technology: A 2026 Guide to Microvia Excellence<\/title>\n<meta name=\"description\" content=\"Explore the evolution of HDI PCB technology. Learn about ELIC, microvia stacking, laser drilling, and DFM strategies for ultra-high-density electronic layouts.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/hdi-pcb-design-technology-overview\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"HDI PCB Design &amp; Technology: A 2026 Guide to Microvia Excellence\" \/>\n<meta property=\"og:description\" content=\"Explore the evolution of HDI PCB technology. 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Using copper-filled microvias can actually improve thermal conductivity away from hot components like high-speed processors.","inLanguage":"de"},"inLanguage":"de"},{"@type":"HowTo","@id":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-design-technology-overview\/#howto-1","name":"HDI PCB Design und Technologie: Die Grenzen der Miniaturisierung verschieben","mainEntityOfPage":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-design-technology-overview\/"},"description":"&lt;strong&gt;Ziel:&lt;\/strong&gt; Hardware-Ingenieure und PCB-Layout-Spezialisten &lt;br&gt;&lt;strong&gt;Schwerpunkt:&lt;\/strong&gt; Die Microvia-Strategie meistern","step":[{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-design-technology-overview\/#how-to-step-1774193328214","name":"Step 1: Analyze BGA Pitch and Fan-out","itemListElement":[{"@type":"HowToDirection","text":"If your BGA pitch is $\\le 0.5mm$, standard via-in-pad is no longer an option. You must move to microvia-in-pad technology to manage the escape routing."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-design-technology-overview\/#how-to-step-1774193341208","name":"Step 2: Select the Proper Buildup (e.g., 1+N+1)","itemListElement":[{"@type":"HowToDirection","text":"Define the number of laser-drilled layers. A \"1+N+1\" structure means one layer of microvias on each side of a conventional core. For more complexity, move to 2+N+2 or ELIC."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-design-technology-overview\/#how-to-step-1774193350934","name":"Step 3: Material Compatibility for Laser Drilling","itemListElement":[{"@type":"HowToDirection","text":"Not all FR-4 materials are suitable for laser ablation. Choose \"Laser-Drillable\" prepregs with consistent resin content to ensure clean via holes and reliable plating.<br\/><em>Related:<\/em> See our <a href=\"https:\/\/www.han-sphere.com\/blog\/news\/high-speed-pcb-stackup-material-selection\/\" target=\"_blank\" rel=\"noreferrer noopener\">High-Speed PCB Material Selection<\/a> for laminate ideas."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-design-technology-overview\/#how-to-step-1774193369510","name":"Step 4: Manage Aspect Ratio","itemListElement":[{"@type":"HowToDirection","text":"To ensure reliable copper plating, the aspect ratio (depth to diameter) of a microvia should ideally be $0.75:1$ or $1:1$. Exceeding this makes chemical fluid exchange difficult during <a href=\"https:\/\/www.han-sphere.com\/pcb-manufacturing\/\" target=\"_blank\" rel=\"noreferrer noopener\">PCB Manufacturing<\/a>."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-design-technology-overview\/#how-to-step-1774193387222","name":"Step 5: Coordinate with Hansphere DFM","itemListElement":[{"@type":"HowToDirection","text":"HDI fabrication requires precise sequential lamination cycles. Contact our team to verify your stackup and ensure that the via-filling process (VIPPO - Via In Pad Plated Over) aligns with our production standards."}]}],"inLanguage":"de"}]}},"_links":{"self":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/303","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/comments?post=303"}],"version-history":[{"count":4,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/303\/revisions"}],"predecessor-version":[{"id":546,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/303\/revisions\/546"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/media\/307"}],"wp:attachment":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/media?parent=303"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/categories?post=303"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/tags?post=303"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}