{"id":309,"date":"2026-02-07T08:29:00","date_gmt":"2026-02-07T00:29:00","guid":{"rendered":"https:\/\/www.han-sphere.com\/?p=309"},"modified":"2026-03-02T22:57:44","modified_gmt":"2026-03-02T14:57:44","slug":"hdi-microvias-blind-buried-via-design","status":"publish","type":"post","link":"https:\/\/www.han-sphere.com\/de\/blog\/news\/hdi-microvias-blind-buried-via-design\/","title":{"rendered":"Microvias, Blind- und Buried Vias im HDI PCB Design"},"content":{"rendered":"

Vias sind die Grundlage der HDI-Leiterplattentechnologie. Im Gegensatz zu herk\u00f6mmlichen Durchkontaktierungen, HDI-Platinen <\/a>sich st\u00fctzen auf Microvias, Blind Vias und Buried Vias<\/strong> um eine extrem hohe Routingdichte, verbesserte Signalintegrit\u00e4t und kompakte Leiterplattenlayouts zu erreichen.<\/p>\n\n\n\n

Dieser Artikel erkl\u00e4rt wie man Microvias, Blind Vias und Buried Vias in HDI-Leiterplatten gestaltet<\/strong>, einschlie\u00dflich Konstruktionsregeln, Zuverl\u00e4ssigkeits\u00fcberlegungen und Fertigungseinschr\u00e4nkungen.<\/p>\n\n\n\n

\n

\ud83d\udd17 Teil der HDI PCB Design Serie<\/em>
HDI PCB Design: Technologie<\/a>, Stackup<\/a>, Weiterleitung<\/a>, und Herstellung<\/a><\/strong><\/p>\n<\/blockquote>\n\n\n

\n
\"HDI<\/figure>\n<\/div>\n\n\n

Was sind Mikrovias?<\/h2>\n\n\n\n

Microvias sind in der Regel lasergebohrte Durchkontaktierungen:<\/p>\n\n\n\n

    \n
  • Durchmesser \u2264 150 \u03bcm<\/li>\n\n\n\n
  • Tiefe \u2264 1 Schicht<\/li>\n\n\n\n
  • Wird zur Verbindung benachbarter Ebenen verwendet<\/li>\n<\/ul>\n\n\n\n

    Sie sorgen f\u00fcr eine drastische Verringerung der Durchgangsparasiten und schaffen Platz auf der Leiterplatte.<\/p>\n\n\n\n

    \n\n\n\n

    Erkl\u00e4rungen zu Blind Vias und Buried Vias<\/h2>\n\n\n\n

    Blinde Vias<\/h3>\n\n\n\n
      \n
    • \u00c4u\u00dfere Schichten mit inneren Schichten verbinden<\/li>\n\n\n\n
    • Nicht durch das gesamte Brett gehen<\/li>\n<\/ul>\n\n\n\n

      Vergrabene Vias<\/h3>\n\n\n\n
        \n
      • Nur innere Schichten verbinden<\/li>\n\n\n\n
      • Unsichtbar von der Oberfl\u00e4che aus<\/li>\n<\/ul>\n\n\n\n

        Beide werden erstellt mit sequentielle Laminierung<\/strong>.<\/p>\n\n\n\n

        \n\n\n\n

        Warum HDI-Designs auf Microvias angewiesen sind<\/h2>\n\n\n\n

        Microvias erm\u00f6glichen:<\/p>\n\n\n\n

          \n
        • Fine-Pitch BGA Fanout<\/li>\n\n\n\n
        • Erm\u00e4\u00dfigt \u00fcber Stummel<\/li>\n\n\n\n
        • Bessere High-Speed-Signalintegrit\u00e4t<\/li>\n\n\n\n
        • Kleineres Brettformat<\/li>\n<\/ul>\n\n\n\n

          F\u00fcr BGA-Abst\u00e4nde \u2264 0,8 mm sind Mikrovias oft obligatorisch.<\/p>\n\n\n\n

          \n\n\n\n

          Microvia-Designregeln und bew\u00e4hrte Praktiken<\/h2>\n\n\n\n

          Leitlinien f\u00fcr das Seitenverh\u00e4ltnis<\/h3>\n\n\n\n
            \n
          • Empfohlenes Microvia-Seitenverh\u00e4ltnis \u2264 1:1<\/li>\n\n\n\n
          • Flachere Vias verbessern die Zuverl\u00e4ssigkeit der Beschichtung<\/li>\n<\/ul>\n\n\n\n
            \n\n\n\n

            Gestapelte vs. gestaffelte Mikrovias<\/h3>\n\n\n\n

            Gestapelte Microvias<\/strong><\/p>\n\n\n\n

              \n
            • H\u00f6here Dichte<\/li>\n\n\n\n
            • H\u00f6here Kosten und h\u00f6heres Zuverl\u00e4ssigkeitsrisiko<\/li>\n<\/ul>\n\n\n\n

              Gestaffelte Mikrovias<\/strong><\/p>\n\n\n\n

                \n
              • Bessere Zuverl\u00e4ssigkeit<\/li>\n\n\n\n
              • Bevorzugt f\u00fcr die meisten Entw\u00fcrfe<\/li>\n<\/ul>\n\n\n\n
                \n

                Im Allgemeinen werden gestaffelte Mikrovias empfohlen, es sei denn, die Dichte erfordert eine Stapelung.<\/p>\n<\/blockquote>\n\n\n\n

                \n\n\n\n

                Via-in-Pad-Design<\/h3>\n\n\n\n

                Via-in-Pad ist in HDI-Designs \u00fcblich, erfordert aber:<\/p>\n\n\n\n

                  \n
                • F\u00fcllung aus Kupfer<\/li>\n\n\n\n
                • Richtige Planarisierung<\/li>\n\n\n\n
                • Strenge Prozesskontrolle<\/li>\n<\/ul>\n\n\n\n

                  Schlechte Via-F\u00fcllung f\u00fchrt zu L\u00f6tl\u00f6chern und Zuverl\u00e4ssigkeitsproblemen.<\/p>\n\n\n

                  \n
                  \"HDI<\/figure>\n<\/div>\n\n\n

                  \u00dcberlegungen zur elektrischen Leistung<\/h2>\n\n\n\n

                  HDI \u00fcber Strukturen reduzieren:<\/p>\n\n\n\n

                    \n
                  • Parasit\u00e4re Induktivit\u00e4t<\/li>\n\n\n\n
                  • Signalreflexion<\/li>\n\n\n\n
                  • Nebensprechen<\/li>\n<\/ul>\n\n\n\n

                    Eine schlechte Via-Geometrie kann diese Vorteile jedoch zunichte machen.<\/p>\n\n\n\n

                    Bew\u00e4hrte Praktiken:<\/p>\n\n\n\n

                      \n
                    • Anzahl der Durchg\u00e4nge minimieren<\/li>\n\n\n\n
                    • Halten Sie die \u00dcberg\u00e4nge kurz<\/li>\n\n\n\n
                    • Vermeiden Sie unn\u00f6tige gestapelte Strukturen<\/li>\n<\/ul>\n\n\n\n
                      \n\n\n\n

                      Zuverl\u00e4ssigkeitsrisiken in HDI-Via-Strukturen<\/h2>\n\n\n\n

                      H\u00e4ufige Fehlerarten sind:<\/p>\n\n\n\n

                        \n
                      • Rissbildung bei Kupfer in gestapelten Mikrovias<\/li>\n\n\n\n
                      • Unvollst\u00e4ndig durch Ausf\u00fcllen<\/li>\n\n\n\n
                      • Delamination w\u00e4hrend der thermischen Belastung<\/li>\n<\/ul>\n\n\n\n

                        Das Zuverl\u00e4ssigkeitsrisiko steigt mit:<\/p>\n\n\n\n

                          \n
                        • \u00dcberm\u00e4\u00dfiges Stapeln<\/li>\n\n\n\n
                        • Hohe Seitenverh\u00e4ltnisse<\/li>\n\n\n\n
                        • Schlechte Materialauswahl<\/li>\n<\/ul>\n\n\n\n
                          \n\n\n\n

                          Fertigungseinschr\u00e4nkungen und DFM-Regeln<\/h2>\n\n\n\n

                          Das HDI-Vias-Design muss mit den F\u00e4higkeiten des Herstellers \u00fcbereinstimmen.<\/p>\n\n\n\n

                          Wichtige DFM-\u00dcberlegungen:<\/p>\n\n\n\n

                            \n
                          • Minimaler Durchmesser des Laserdurchgangs<\/li>\n\n\n\n
                          • Maximale Stapelh\u00f6hen<\/li>\n\n\n\n
                          • \u00dcber die Auswahl des F\u00fcllmaterials<\/li>\n\n\n\n
                          • Genauigkeit der Registrierung<\/li>\n<\/ul>\n\n\n\n

                            Eine fr\u00fchzeitige DFM-Pr\u00fcfung ist f\u00fcr den Ertrag unerl\u00e4sslich.<\/p>\n\n\n\n

                            \n

                            \ud83d\udd17 Kontext der Herstellung:<\/em>
                            HDI PCB-Herstellungsprozess und Optimierung der Ausbeute<\/strong><\/p>\n<\/blockquote>\n\n\n\n

                            \n\n\n\n

                            Wann sollten Blind-\/Verdeckungsdurchf\u00fchrungen anstelle von Durchgangsdurchf\u00fchrungen verwendet werden?<\/h2>\n\n\n\n

                            W\u00e4hlen Sie blind\/vergrabene Durchkontaktierungen, wenn:<\/p>\n\n\n\n

                              \n
                            • Die Routingdichte ist begrenzt<\/li>\n\n\n\n
                            • Signalintegrit\u00e4t ist entscheidend<\/li>\n\n\n\n
                            • Die Gr\u00f6\u00dfe der Platine muss minimiert werden<\/li>\n<\/ul>\n\n\n\n

                              Durchkontaktierungen eignen sich weiterhin f\u00fcr Bereiche mit geringer Dichte.<\/p>\n\n\n\n

                              \n\n\n\n

                              Zusammenfassung bew\u00e4hrter Praktiken<\/h2>\n\n\n\n

                              Zuverl\u00e4ssige HDI-Durchkontaktierungen zu entwerfen:<\/p>\n\n\n\n

                                \n
                              • Verwenden Sie Mikrovias mit einem Seitenverh\u00e4ltnis \u2264 1:1<\/li>\n\n\n\n
                              • Bevorzugt gestaffelte gegen\u00fcber gestapelten Mikrovias<\/li>\n\n\n\n
                              • Auftragen via-in-pad nur mit entsprechender F\u00fcllung<\/li>\n\n\n\n
                              • Minimieren durch \u00dcberg\u00e4nge<\/li>\n\n\n\n
                              • Abstimmung der Entw\u00fcrfe mit den M\u00f6glichkeiten des Herstellers<\/li>\n<\/ul>\n\n\n
                                \n
                                \"HDI<\/figure>\n<\/div>\n\n\n

                                Schlussfolgerung<\/h2>\n\n\n\n

                                Microvias, Blind Vias und Buried Vias sind das R\u00fcckgrat des HDI-Leiterplattendesigns. Die richtige Auswahl der Via-Strukturen und disziplinierte Entwurfspraktiken sind entscheidend, um eine hohe Dichte, gute Signalintegrit\u00e4t und langfristige Zuverl\u00e4ssigkeit zu erreichen.<\/p>\n\n\n\n

                                Dieser Artikel bildet die technischer Kern<\/strong> des HDI PCB Design Clusters.<\/p>\n\n\n\n

                                FAQ - HDI-Mikrovias und Via-Design<\/h2>\n\n\n\n
                                Q: 1. Was ist der Unterschied zwischen einer Microvia und einer Blind Via?<\/strong><\/strong>

                                A: Eine Microvia ist eine Art Blinddurchgang, der durch Laserbohren erzeugt wird und in der Regel nur benachbarte Schichten verbindet.<\/p> <\/div>

                                Q: 2. Sind gestapelte Mikrovias unzuverl\u00e4ssig?<\/strong><\/strong>

                                A: Sie k\u00f6nnen zuverl\u00e4ssig sein, wenn sie korrekt hergestellt werden, aber sie bergen ein h\u00f6heres Risiko als gestaffelte Mikrovias.<\/p> <\/div>

                                Q: 3. Wann ist das Via-in-Pad erforderlich?<\/strong><\/strong>

                                A: Via-in-Pad wird f\u00fcr Fine-Pitch-BGAs verwendet, bei denen der Platz f\u00fcr die Entflechtung begrenzt ist.<\/p> <\/div>

                                Q: 4. K\u00f6nnen Mikrovias alle Durchgangsl\u00f6cher ersetzen?<\/strong><\/strong>

                                A: Nein. Durchkontaktierungen sind nach wie vor n\u00fctzlich f\u00fcr Stromversorgungs-, Masse- und Low-Density-Bereiche.<\/p> <\/div>

                                Q: 5. Wie viele Microvia-Stapel sind zul\u00e4ssig?<\/strong><\/strong>

                                A: Die meisten Hersteller empfehlen aus Gr\u00fcnden der Zuverl\u00e4ssigkeit eine Begrenzung der Stapel auf 2 Ebenen.<\/p> <\/div>

                                Q: 6. Verbessern Mikrovias die Signalintegrit\u00e4t?<\/strong><\/strong>

                                A: Ja. K\u00fcrzere Durchgangsl\u00e4ngen verringern die parasit\u00e4re Induktivit\u00e4t und Reflexionen.<\/p> <\/div> <\/div>\n\n\n\n

                                <\/p>","protected":false},"excerpt":{"rendered":"

                                Diese Zusammenfassung behandelt Designrichtlinien f\u00fcr Microvias, Blind Vias und Buried Vias in HDI-Leiterplatten. Sie befasst sich mit wichtigen \u00dcberlegungen, einschlie\u00dflich Via-in-Pad-Regeln, potenziellen Zuverl\u00e4ssigkeitsrisiken und kritischen Fertigungseinschr\u00e4nkungen, um eine robuste Leiterplattenfertigung zu gew\u00e4hrleisten.<\/p>","protected":false},"author":1,"featured_media":311,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[4],"tags":[31],"class_list":["post-309","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-microvias"],"yoast_head":"\nMicrovias, Blind and Buried Vias in HDI PCB Design - HanSphere<\/title>\n<meta name=\"description\" content=\"Learn how to design microvias, blind vias, and buried vias in HDI PCBs, including via-in-pad rules, reliability risks, and manufacturing constraints.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/hdi-microvias-blind-buried-via-design\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Microvias, Blind and Buried Vias in HDI PCB Design - HanSphere\" \/>\n<meta property=\"og:description\" content=\"Learn how to design microvias, blind vias, and buried vias in HDI PCBs, including via-in-pad rules, reliability risks, and manufacturing constraints.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/hdi-microvias-blind-buried-via-design\/\" \/>\n<meta property=\"og:site_name\" content=\"hansphere\" \/>\n<meta property=\"article:published_time\" content=\"2026-02-07T00:29:00+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-03-02T14:57:44+00:00\" \/>\n<meta property=\"og:image\" content=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-5.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"337\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"hansphere01\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Verfasst von\" \/>\n\t<meta name=\"twitter:data1\" content=\"hansphere01\" \/>\n\t<meta name=\"twitter:label2\" content=\"Gesch\u00e4tzte Lesezeit\" \/>\n\t<meta name=\"twitter:data2\" content=\"4\u00a0Minuten\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":[\"WebPage\",\"FAQPage\"],\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/hdi-microvias-blind-buried-via-design\/\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/hdi-microvias-blind-buried-via-design\/\",\"name\":\"Microvias, Blind and Buried Vias in HDI PCB Design - 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