{"id":327,"date":"2026-03-24T08:54:45","date_gmt":"2026-03-24T00:54:45","guid":{"rendered":"https:\/\/www.han-sphere.com\/?p=327"},"modified":"2026-03-22T23:43:56","modified_gmt":"2026-03-22T15:43:56","slug":"hdi-pcb-manufacturing-yield-optimization","status":"publish","type":"post","link":"https:\/\/www.han-sphere.com\/de\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/","title":{"rendered":"HDI PCB-Herstellung: Technik f\u00fcr maximale Produktionsausbeute"},"content":{"rendered":"<p>In der HDI-Fertigung ist \u201cAusbeute\u201d ein Synonym f\u00fcr \u201cRentabilit\u00e4t\u201d. Bei einigen Designs, die vier oder mehr aufeinanderfolgende Laminierungszyklen (4+N+4) erfordern, kann ein Verlust von 1% in jeder Phase zu einer verheerenden Ausschussrate bei der Endmontage f\u00fchren.<\/p>\n\n\n\n<p>Erzielung einer hohen Rendite <a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/hdi-pcb\/\">HDI-PCB<\/a> Die Produktion erfordert nicht nur fortschrittliche Maschinen, sondern auch ein tiefes Verst\u00e4ndnis daf\u00fcr, wie sich Materialien unter extremer thermischer und chemischer Belastung verhalten. Unter <strong><a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/\">Hansphere<\/a><\/strong>, Wir haben unser Verfahren verfeinert, um diese spezifischen Fehlerarten zu beheben.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"510\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-1.jpg\" alt=\"HDI PCB Design\" class=\"wp-image-305\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-1.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-1-300x255.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">1. Die Achillesferse: Dimensionsstabilit\u00e4t und Registrierung<\/h2>\n\n\n\n<p>Die gr\u00f6\u00dfte Herausforderung beim HDI ist <strong>Anmeldung<\/strong>-Ausrichtung der lasergebohrten Microvia auf das Zielpad der darunter liegenden Schicht. Wenn Schichten hinzugef\u00fcgt und gepresst werden, schrumpft und verschiebt sich der Kern.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Nicht-lineare Skalierung:<\/strong> Wir verwenden keinen festen Skalierungsfaktor. Wir verwenden Echtzeitdaten aus fr\u00fcheren Chargen, um eine nichtlineare Kompensation auf die Druckvorlage anzuwenden, die die Bewegungen des jeweiligen Laminats (wie Megtron oder Isola) vorwegnimmt.<\/li>\n\n\n\n<li><strong>LDI (Laser Direct Imaging):<\/strong> Durch den Einsatz von LDI anstelle eines herk\u00f6mmlichen Films k\u00f6nnen wir das Bildmuster in Echtzeit an die tats\u00e4chliche Position der Kupfermerkmale auf der Platte anpassen.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">2. Sicherstellung der Microvia-Zuverl\u00e4ssigkeit: F\u00fcllen und Beschichten<\/h2>\n\n\n\n<p>Ein Microvia ist nur so gut wie seine Kupferf\u00fcllung. Eine unvollst\u00e4ndige F\u00fcllung f\u00fchrt zu Luftblasen, die sich w\u00e4hrend der <a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/pcb-assembly\/\">PCB-Montage<\/a>, Dies f\u00fchrt dazu, dass sich das Pad \u201cabhebt\u201d oder die L\u00f6tstelle versagt.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Der VIPPO-Standard:<\/h3>\n\n\n\n<p>Wir besch\u00e4ftigen <strong>Via-In-Pad \u00fcberplattet (VIPPO)<\/strong> Technologie. Nach dem Laserbohren werden die Mikrovias mit speziellen Kupferchemikalien galvanisiert, um eine solide, l\u00fcckenlose Verbindung zu gew\u00e4hrleisten.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Steuerung des Seitenverh\u00e4ltnisses:<\/strong> Wir halten ein Seitenverh\u00e4ltnis von $\\le 0,8:1$ f\u00fcr Microvias ein, um sicherzustellen, dass die Beschichtungsl\u00f6sung effektiv bis zum Boden des Lochs zirkulieren kann.<\/li>\n\n\n\n<li><strong>Querschnittsanalyse:<\/strong> Jede Charge wird bei Hansphere einem Mikroschliff unterzogen, um die Kornstruktur des beschichteten Kupfers zu \u00fcberpr\u00fcfen.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-5.jpg\" alt=\"HDI PCB Design\" class=\"wp-image-311\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-5.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-5-300x169.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">5 Schritte zur Optimierung der Ausbeute Ihres HDI-Designs<\/h2>\n\n\n\n<div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\"><strong>Ziel:<\/strong> Entwicklungsingenieure und Qualit\u00e4tssicherungs-Manager <br><strong>Schwerpunkt:<\/strong> Verringerung der Reibung in der Fertigung<\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1774193950959\"><strong class=\"schema-how-to-step-name\">Schritt 1: Optimieren des Verh\u00e4ltnisses von Via zu Pad<\/strong> <p class=\"schema-how-to-step-text\">W\u00e4hrend Sie <em>kann<\/em> eine 4-Mil-Durchkontaktierung in einem 6-Mil-Pad zu entwerfen, vergr\u00f6\u00dfert eine Vergr\u00f6\u00dferung des Pads auf 8-Mil (wenn es der Platz erlaubt) das \u201cRegistrierungsfenster\u201d betr\u00e4chtlich, was die Ausbeute der Fabrik direkt erh\u00f6ht und Ihre Kosten senkt. <a href=\"https:\/\/www.han-sphere.com\/pcb-manufacturing\/\" target=\"_blank\" rel=\"noreferrer noopener\">PCB-Herstellung<\/a> Kosten.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1774193976128\"><strong class=\"schema-how-to-step-name\">Schritt 2: Auswahl kompatibler Materialien<\/strong> <p class=\"schema-how-to-step-text\">Stellen Sie sicher, dass Ihr Prepreg und Ihr Kern kompatible W\u00e4rmeausdehnungskoeffizienten (WAK) haben. Die Verwendung unpassender Materialien in einem <a href=\"https:\/\/www.han-sphere.com\/rigid-pcb\/\" target=\"_blank\" rel=\"noreferrer noopener\">Starre PCB<\/a> Aufbau zu einer internen Delamination w\u00e4hrend des Reflow-Prozesses f\u00fchrt.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1774193993975\"><strong class=\"schema-how-to-step-name\">Schritt 3: Teardrops bei allen Mikrovias einsetzen<\/strong> <p class=\"schema-how-to-step-text\">Selbst bei HDI sind Teardrops unerl\u00e4sslich. Sie bieten zus\u00e4tzliches Kupfer an der Via-to-Trace-Verbindung und verhindern ein \u201cAusbrechen\u201d, wenn sich die Registrierung w\u00e4hrend der Laminierung leicht verschiebt.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1774194003491\"><strong class=\"schema-how-to-step-name\">Schritt 4: Vermeiden Sie gestapelte Vias, wenn eine Staffelung m\u00f6glich ist<\/strong> <p class=\"schema-how-to-step-text\">Gestapelte Durchkontaktierungen (Durchkontaktierungen direkt auf Durchkontaktierungen) sind am schwierigsten zu fertigen. Wenn Ihr <a href=\"https:\/\/www.han-sphere.com\/pcb-design\/\" target=\"_blank\" rel=\"noreferrer noopener\">PCB-Entwurf<\/a> kann beherbergen <strong>Gestaffelte Vias<\/strong>, Dadurch wird die mechanische Belastung des Kupfers verringert und die langfristige Zuverl\u00e4ssigkeit verbessert.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1774194012368\"><strong class=\"schema-how-to-step-name\">Schritt 5: Fr\u00fchzeitig kupfergef\u00fcllte Durchkontaktierungen spezifizieren<\/strong> <p class=\"schema-how-to-step-text\">Warten Sie nicht darauf, dass das Fertigungsunternehmen danach fragt. Geben Sie in Ihren Fertigungsunterlagen ausdr\u00fccklich kupfergef\u00fcllte Microvias an, um sicherzustellen, dass die Leiterplattenoberfl\u00e4che f\u00fcr die Fine-Pitch-BGA-Best\u00fcckung perfekt eben ist.<\/p> <\/li><\/ol><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">3. Die Auswirkungen von Handhabung und Sauberkeit<\/h2>\n\n\n\n<p>In der Welt der 3-Millimeter-Spuren ist ein einziges Staubkorn ein \u201ct\u00f6dlicher Fehler\u201d.\u201d<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Reinr\u00e4ume der Klasse 10.000:<\/strong> Unsere HDI-Belichtungs- und Laminierungsbereiche werden streng kontrolliert, um Fremdk\u00f6rperablagerungen (FOD) zu vermeiden.<\/li>\n\n\n\n<li><strong>Automatisierte optische Inspektion (AOI):<\/strong> Wir verwenden hochaufl\u00f6sende AOI nach jedem \u00c4tzschritt, um Kurzschl\u00fcsse oder \u00d6ffnungen zu erkennen und zu reparieren, bevor die n\u00e4chste Schicht laminiert wird.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"443\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-13.jpg\" alt=\"HDI PCB Design\" class=\"wp-image-323\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-13.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/HDI-PCB-Design-13-300x222.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">FAQ - HDI PCB Fertigung &amp; Ausbeute<\/h2>\n\n\n\n<div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1770224237130\"><strong class=\"schema-faq-question\">Q1: <strong>Warum ist die Ausbeute von HDI-Leiterplatten geringer als die von Standard-Leiterplatten?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Fortschrittliche Verfahren und engere Toleranzen erh\u00f6hen die Anf\u00e4lligkeit f\u00fcr Abweichungen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1770224253709\"><strong class=\"schema-faq-question\">Q2: <strong>Wie viele Laminierungszyklen sind bei HDI-Leiterplatten akzeptabel?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Die meisten Konstruktionen beschr\u00e4nken sich auf 1-2 aufeinanderfolgende Laminierungen, um die Ausbeute und die Kosten zu kontrollieren.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1770224272213\"><strong class=\"schema-faq-question\"><strong>F3: Warum ist HDI teurer als herk\u00f6mmliche mehrlagige Leiterplatten?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong> Die Kosten richten sich nach der Anzahl der <strong>Lamination-Zyklen<\/strong>. Jeder HDI-\u201cSchritt\u201d (wie 1+N+1) erfordert, dass die Leiterplatte den gesamten Prozess durchl\u00e4uft: Laminieren, Bohren, Beschichten und Belichten.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1770224286889\"><strong class=\"schema-faq-question\"><strong>F4: Wie gro\u00df ist das Risiko eines \u201cRosa Rings\u201d bei HDI?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong> Rosa Ringe entstehen, wenn die Oxidbeschichtung w\u00e4hrend des Abschmierens aufgel\u00f6st wird. Bei Hansphere verwenden wir eine spezielle \u201cAlternative Oxide\u201d-Behandlung, die eine \u00fcberragende Haftfestigkeit bietet und Probleme mit rosa Ringen beseitigt bei <a href=\"https:\/\/www.han-sphere.com\/high-frequency-pcb\/\" target=\"_blank\" rel=\"noreferrer noopener\">Hochfrequenz-PCBs<\/a>.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1774194118798\"><strong class=\"schema-faq-question\"><strong>F5: Kann ich HDI mit flexiblen Schaltungen kombinieren?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong> Ja. Dies ist bekannt als <strong>Starr-Flex HDI<\/strong>. Es wird h\u00e4ufig in Smartphones und medizinischen Implantaten verwendet. Beispiele f\u00fcr unsere Arbeit finden Sie auf der Website <a href=\"https:\/\/www.han-sphere.com\/rigid-flex-pcb\/\" target=\"_blank\" rel=\"noreferrer noopener\">Starr-Flex-Leiterplatte<\/a> Service-Seite.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1770224321119\"><strong class=\"schema-faq-question\">Q6: <strong>Verl\u00e4ngert die HDI-Fertigung die Vorlaufzeit?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Ja, aber mit der richtigen Planung lassen sich Verz\u00f6gerungen minimieren.<\/p> <\/div> <\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Schlussfolgerung<\/h2>\n\n\n\n<p>Die ertragreiche HDI-Fertigung ist ein heikler Tanz zwischen Chemie, Physik und mechanischer Pr\u00e4zision. Wenn Sie die Einschr\u00e4nkungen bei der Registrierung und Beschichtung verstehen und mit einem Hersteller zusammenarbeiten, der DFM zu seinen Priorit\u00e4ten z\u00e4hlt, k\u00f6nnen Sie selbst die komplexesten Designs mit Zuversicht auf den Markt bringen.<\/p>\n\n\n\n<p><strong>Haben Sie Ertragsprobleme mit Ihrem derzeitigen Lieferanten?<\/strong> Das Ingenieurteam von Hansphere ist auf die Fehlersuche und Optimierung komplexer HDI-Aufbauten spezialisiert. <strong><a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/contact\/\">Senden Sie uns Ihr Design f\u00fcr eine Ertragspr\u00fcfung<\/a><\/strong> oder erfahren Sie mehr \u00fcber unsere Qualit\u00e4tsstandards auf unserer <strong><a target=\"_blank\" rel=\"noreferrer noopener\" href=\"https:\/\/www.han-sphere.com\/about\/\">\u00dcber die Seite<\/a><\/strong>.<\/p>","protected":false},"excerpt":{"rendered":"<p>Die Herstellung von High-Density Interconnect (HDI)-Leiterplatten stellt den H\u00f6hepunkt der aktuellen Schaltungsherstellung dar, bei der die Fehlermarge in Mikrometern gemessen wird. In diesem Fachbeitrag werden die kritischen Variablen untersucht, die sich auf die Produktionsausbeute auswirken - von der Dimensionsinstabilit\u00e4t d\u00fcnner Dielektrika w\u00e4hrend der sequentiellen Laminierung bis hin zur Pr\u00e4zision der Laser-Direkt-Bildgebung (LDI) f\u00fcr die Ausrichtung von Microvia. Wir bieten einen strategischen Rahmen f\u00fcr die Optimierung der Integrit\u00e4t von Kupferf\u00fcllungen und die Bew\u00e4ltigung von Fehlanpassungen bei der W\u00e4rmeausdehnung, um eine hochzuverl\u00e4ssige, kosteneffektive HDI-Massenproduktion zu gew\u00e4hrleisten.<\/p>","protected":false},"author":1,"featured_media":316,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[4],"tags":[30],"class_list":["post-327","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-hdi-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>HDI PCB Yield Optimization: Advanced Manufacturing Strategies 2026<\/title>\n<meta name=\"description\" content=\"Maximize HDI PCB production yield. Explore expert tactics for laser drill registration, copper filling, and layer bonding to reduce scrap and lead times.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"HDI PCB Yield Optimization: Advanced Manufacturing Strategies 2026\" \/>\n<meta property=\"og:description\" content=\"Maximize HDI PCB production yield. 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You can see examples of our work on the <a href=\"https:\/\/www.han-sphere.com\/rigid-flex-pcb\/\" target=\"_blank\" rel=\"noreferrer noopener\">Rigid-Flex PCB<\/a> service page.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/#faq-question-1770224321119","position":6,"url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/#faq-question-1770224321119","name":"F6: Verl\u00e4ngert die HDI-Fertigung die Vorlaufzeit?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Yes, but proper planning minimizes delays.","inLanguage":"de"},"inLanguage":"de"},{"@type":"HowTo","@id":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/#howto-1","name":"HDI PCB-Herstellung: Technik f\u00fcr maximale Produktionsausbeute","mainEntityOfPage":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/"},"description":"&lt;strong&gt;Ziel:&lt;\/strong&gt; Entwicklungsingenieure und Qualit&auml;tssicherungs-Manager &lt;br&gt;&lt;strong&gt;Schwerpunkt:&lt;\/strong&gt; Verringerung der Reibung in der Fertigung","step":[{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/#how-to-step-1774193950959","name":"Step 1: Optimize the Via-to-Pad Ratio","itemListElement":[{"@type":"HowToDirection","text":"While you <em>can<\/em> design a 4-mil via in a 6-mil pad, increasing the pad size to 8-mil (if space allows) significantly increases the \"registration window,\" directly boosting the factory yield and lowering your <a href=\"https:\/\/www.han-sphere.com\/pcb-manufacturing\/\" target=\"_blank\" rel=\"noreferrer noopener\">PCB Manufacturing<\/a> cost."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/#how-to-step-1774193976128","name":"Step 2: Select Compatible Materials","itemListElement":[{"@type":"HowToDirection","text":"Ensure your Prepreg and Core have compatible Coefficient of Thermal Expansion (CTE) values. Using mismatched materials in a <a href=\"https:\/\/www.han-sphere.com\/rigid-pcb\/\" target=\"_blank\" rel=\"noreferrer noopener\">Rigid PCB<\/a> buildup leads to internal delamination during reflow."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/#how-to-step-1774193993975","name":"Step 3: Implement Teardrops on All Microvias","itemListElement":[{"@type":"HowToDirection","text":"Even in HDI, teardrops are vital. They provide extra copper at the via-to-trace junction, preventing \"breakout\" if the registration shifts slightly during lamination."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/#how-to-step-1774194003491","name":"Step 4: Avoid Stacked Vias if Staggered is Possible","itemListElement":[{"@type":"HowToDirection","text":"Stacked vias (vias directly on top of vias) are the most difficult to manufacture. If your <a href=\"https:\/\/www.han-sphere.com\/pcb-design\/\" target=\"_blank\" rel=\"noreferrer noopener\">PCB Design<\/a> can accommodate <strong>Staggered Vias<\/strong>, the mechanical stress on the copper is reduced, improving long-term reliability."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/hdi-pcb-manufacturing-yield-optimization\/#how-to-step-1774194012368","name":"Step 5: Specify Copper-Filled Vias Early","itemListElement":[{"@type":"HowToDirection","text":"Don't wait for the fab house to ask. Explicitly specify copper-filled microvias in your fab notes to ensure the board surface is perfectly flat for fine-pitch BGA assembly."}]}],"inLanguage":"de"}]}},"_links":{"self":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/327","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/comments?post=327"}],"version-history":[{"count":3,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/327\/revisions"}],"predecessor-version":[{"id":548,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/327\/revisions\/548"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/media\/316"}],"wp:attachment":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/media?parent=327"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/categories?post=327"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/tags?post=327"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}