{"id":370,"date":"2026-03-02T08:33:00","date_gmt":"2026-03-02T00:33:00","guid":{"rendered":"https:\/\/www.han-sphere.com\/?p=370"},"modified":"2026-03-02T23:29:32","modified_gmt":"2026-03-02T15:29:32","slug":"rigid-pcb-failure-analysis-reliability","status":"publish","type":"post","link":"https:\/\/www.han-sphere.com\/de\/blog\/news\/rigid-pcb-failure-analysis-reliability\/","title":{"rendered":"Fehleranalyse und Zuverl\u00e4ssigkeitstechnik f\u00fcr starre Leiterplatten"},"content":{"rendered":"

Selbst gut konstruierte starre Leiterplatten k\u00f6nnen aufgrund von Fertigungsfehlern, Umweltbelastungen oder Konstruktionseinschr\u00e4nkungen ausfallen. Fehleranalyse und Zuverl\u00e4ssigkeitstechnik helfen, die Ursachen zu ermitteln, die Produktlebensdauer zu verbessern und zuk\u00fcnftige Probleme zu vermeiden.<\/p>\n\n\n\n

Dieser Artikel erkl\u00e4rt starre Leiterplatte<\/a> Fehleranalyse und Zuverl\u00e4ssigkeitstechnik<\/strong>, Dazu geh\u00f6ren h\u00e4ufige Fehlerarten, Pr\u00fcfverfahren und Konstruktionsstrategien f\u00fcr langfristige Zuverl\u00e4ssigkeit.<\/p>\n\n\n\n

\n

\ud83d\udd17 Teil der Serie Starres PCB-Design<\/em>
Starres PCB-Design<\/a>: Grundlagen<\/a>, Stackup<\/a>, Layout<\/a>, Herstellung<\/a>, und Verl\u00e4sslichkeit<\/a><\/strong><\/p>\n<\/blockquote>\n\n\n

\n
\"Starre<\/figure>\n<\/div>\n\n\n

Warum die Fehleranalyse wichtig ist<\/h2>\n\n\n\n

Die Fehleranalyse hilft:<\/p>\n\n\n\n

    \n
  • Identifizieren Sie die Ursachen<\/li>\n\n\n\n
  • Verbesserung k\u00fcnftiger Entw\u00fcrfe<\/li>\n\n\n\n
  • Reduzierung von Garantie- und Feldausf\u00e4llen<\/li>\n\n\n\n
  • Verbessern Sie die Produktzuverl\u00e4ssigkeit<\/li>\n<\/ul>\n\n\n\n

    Dies ist ein entscheidender Schritt zur kontinuierlichen Verbesserung.<\/p>\n\n\n\n

    \n\n\n\n

    H\u00e4ufige Fehlermodi bei starren Leiterplatten<\/h2>\n\n\n\n

    Typische Ausfallmechanismen sind:<\/p>\n\n\n\n

      \n
    • Offene Stromkreise<\/li>\n\n\n\n
    • Kurzschl\u00fcsse<\/li>\n\n\n\n
    • Delamination<\/li>\n\n\n\n
    • \u00dcber das Knacken<\/li>\n\n\n\n
    • Erm\u00fcdung der L\u00f6tstelle<\/li>\n<\/ul>\n\n\n\n

      Jede Fehlerart hat unterschiedliche Ursachen.<\/p>\n\n\n\n

      \n\n\n\n

      Fertigungsbedingte Ausf\u00e4lle<\/h2>\n\n\n\n

      Zu den Ursachen k\u00f6nnen geh\u00f6ren:<\/p>\n\n\n\n

        \n
      • Schlechte Qualit\u00e4t der Beschichtung<\/li>\n\n\n\n
      • Fehlregistrierung<\/li>\n\n\n\n
      • Kontamination<\/li>\n\n\n\n
      • Unzureichende Kupferdicke<\/li>\n<\/ul>\n\n\n\n

        Die DFM-Validierung verringert diese Risiken.<\/p>\n\n\n\n

        \n\n\n\n

        Konstruktionsbedingte Vers\u00e4umnisse<\/h2>\n\n\n\n

        Designprobleme k\u00f6nnen dazu f\u00fchren:<\/p>\n\n\n\n

          \n
        • \u00dcberh\u00f6hte Stromdichte<\/li>\n\n\n\n
        • Thermische Spannungskonzentration<\/li>\n\n\n\n
        • Schlechte R\u00fccklaufwege<\/li>\n<\/ul>\n\n\n\n

          Diese Fehler treten h\u00e4ufig w\u00e4hrend der Produktlebenszykluspr\u00fcfung auf.<\/p>\n\n\n

          \n
          \"Starre<\/figure>\n<\/div>\n\n\n

          Umwelt- und mechanische Belastung<\/h2>\n\n\n\n

          Starre Leiterplatten k\u00f6nnen aus folgenden Gr\u00fcnden versagen:<\/p>\n\n\n\n

            \n
          • Thermisches Zyklieren<\/li>\n\n\n\n
          • Vibration<\/li>\n\n\n\n
          • Luftfeuchtigkeit<\/li>\n\n\n\n
          • Chemische Belastung<\/li>\n<\/ul>\n\n\n\n

            Materialauswahl und mechanisches Design spielen eine wichtige Rolle.<\/p>\n\n\n\n

            \n\n\n\n

            Techniken der Fehleranalyse<\/h2>\n\n\n\n

            Zu den g\u00e4ngigen Methoden geh\u00f6ren:<\/p>\n\n\n\n

              \n
            • Optische Inspektion<\/li>\n\n\n\n
            • R\u00f6ntgenanalyse<\/li>\n\n\n\n
            • Querschnittsanalyse<\/li>\n\n\n\n
            • Elektrische Pr\u00fcfung<\/li>\n<\/ul>\n\n\n\n

              Diese Techniken helfen, die Fehlerursachen zu isolieren.<\/p>\n\n\n\n

              \n\n\n\n

              Methoden der Zuverl\u00e4ssigkeitspr\u00fcfung<\/h2>\n\n\n\n

              Typische Zuverl\u00e4ssigkeitstests:<\/p>\n\n\n\n

                \n
              • Thermische Zyklustests<\/li>\n\n\n\n
              • Hochgradig beschleunigte Lebensdauertests (HALT)<\/li>\n\n\n\n
              • Umweltstress-Screening (ESS)<\/li>\n<\/ul>\n\n\n\n

                Tests best\u00e4tigen die langfristige Leistung.<\/p>\n\n\n\n

                \n\n\n\n

                Entwurf f\u00fcr Zuverl\u00e4ssigkeit<\/h2>\n\n\n\n

                Zu den bew\u00e4hrten Praktiken geh\u00f6ren:<\/p>\n\n\n\n

                  \n
                • Konservative Gestaltungsspielr\u00e4ume<\/li>\n\n\n\n
                • Ausgewogene Stapelung<\/li>\n\n\n\n
                • Angemessenes W\u00e4rmemanagement<\/li>\n\n\n\n
                • Robuste Via-Strukturen<\/li>\n<\/ul>\n\n\n\n

                  Zuverl\u00e4ssigkeit muss konstruiert werden, nicht vorausgesetzt.<\/p>\n\n\n

                  \n
                  \"Starre<\/figure>\n<\/div>\n\n\n

                  Arbeitsablauf der Ursachenanalyse<\/h2>\n\n\n\n

                  Ein typischer Arbeitsablauf:<\/p>\n\n\n\n

                    \n
                  1. Erkennung von Fehlern<\/li>\n\n\n\n
                  2. Datenerhebung<\/li>\n\n\n\n
                  3. Physische Kontrolle<\/li>\n\n\n\n
                  4. Validierung von Hypothesen<\/li>\n\n\n\n
                  5. Abhilfema\u00dfnahmen<\/li>\n<\/ol>\n\n\n\n

                    Eine strukturierte Analyse gew\u00e4hrleistet genaue Schlussfolgerungen.<\/p>\n\n\n\n

                    \n\n\n\n

                    Zusammenfassung bew\u00e4hrter Praktiken<\/h2>\n\n\n\n
                      \n
                    • Fr\u00fchzeitig f\u00fcr Zuverl\u00e4ssigkeit planen<\/li>\n\n\n\n
                    • Ordnungsgem\u00e4\u00dfe Tests durchf\u00fchren<\/li>\n\n\n\n
                    • Fehler systematisch analysieren<\/li>\n\n\n\n
                    • R\u00fcckf\u00fchrung der Erkenntnisse in die Gestaltung<\/li>\n<\/ul>\n\n\n\n
                      \n\n\n\n

                      Schlussfolgerung<\/h2>\n\n\n\n

                      Eine rigide PCB-Fehleranalyse und Zuverl\u00e4ssigkeitstechnik bieten die f\u00fcr eine kontinuierliche Produktverbesserung erforderliche Feedbackschleife. Das Verst\u00e4ndnis von Fehlermechanismen und das Design f\u00fcr Langlebigkeit gew\u00e4hrleisten langfristige Systemstabilit\u00e4t.<\/p>\n\n\n\n

                      Dieser Artikel vervollst\u00e4ndigt die Beh\u00f6rde und Lebenszyklus-Ebene<\/strong> des Inhaltsclusters Starres Leiterplattendesign.<\/p>\n\n\n\n

                      FAQ - Zuverl\u00e4ssigkeits- und Fehleranalyse f\u00fcr starre Leiterplatten<\/h2>\n\n\n\n
                      Q: 1. Was ist der h\u00e4ufigste Fehler bei starren Leiterplatten?<\/strong><\/strong>

                      A: Erm\u00fcdung der L\u00f6tstelle und Rissbildung an der Durchkontaktierung.<\/p> <\/div>

                      F: Erm\u00fcdung von L\u00f6tstellen und Rissbildung an Durchkontaktierungen.<\/strong>

                      A: Ja, in erheblichem Ma\u00dfe.<\/p> <\/div>

                      Q: 3. Gilt die Fehleranalyse nur f\u00fcr defekte Platten?<\/strong><\/strong>

                      A: Nein, sie wird auch zur Verbesserung des Designs verwendet.<\/p> <\/div>

                      Q: 4. Was ist ein HALT-Test?<\/strong><\/strong>

                      A: Eine Methode zur Ermittlung von Konstruktionsschw\u00e4chen unter extremer Belastung.<\/p> <\/div>

                      Q: 5. Kann die Materialauswahl die Zuverl\u00e4ssigkeit beeinflussen?<\/strong><\/strong>

                      A: Ja, insbesondere bei Temperaturschwankungen.<\/p> <\/div>

                      Q: 6. Sollte die Zuverl\u00e4ssigkeit bei der Planung ber\u00fccksichtigt werden?<\/strong><\/strong>

                      A: Auf jeden Fall - es ist viel effektiver, als Probleme sp\u00e4ter zu beheben.<\/p> <\/div> <\/div>","protected":false},"excerpt":{"rendered":"

                      In dieser Zusammenfassung werden die Ausfallarten von starren Leiterplatten, einschlie\u00dflich Delaminierung, CAF-Bildung und Erm\u00fcdung der L\u00f6tstellen, zusammen mit Methoden zur Ursachenanalyse wie Querschnittsuntersuchungen und W\u00e4rmebildaufnahmen untersucht. Der Schwerpunkt liegt auf Strategien der Zuverl\u00e4ssigkeitstechnik wie Designoptimierung und Materialauswahl zur Verbesserung der Produktlebensdauer. Durch das Verst\u00e4ndnis dieser Fehler k\u00f6nnen Ingenieure wirksame Abhilfema\u00dfnahmen ergreifen, die eine robuste Leistung und eine verl\u00e4ngerte Lebensdauer von starren Leiterplatten in anspruchsvollen Anwendungen gew\u00e4hrleisten.<\/p>","protected":false},"author":1,"featured_media":356,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[4],"tags":[33],"class_list":["post-370","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-rigid-pcb"],"yoast_head":"\nRigid PCB Failure Analysis and Reliability Engineering - Hansphere<\/title>\n<meta name=\"description\" content=\"Learn rigid PCB failure modes, root cause analysis methods, and reliability engineering strategies to improve product durability.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/rigid-pcb-failure-analysis-reliability\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Rigid PCB Failure Analysis and Reliability Engineering - Hansphere\" \/>\n<meta property=\"og:description\" content=\"Learn rigid PCB failure modes, root cause analysis methods, and reliability engineering strategies to improve product durability.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/rigid-pcb-failure-analysis-reliability\/\" \/>\n<meta property=\"og:site_name\" content=\"hansphere\" \/>\n<meta property=\"article:published_time\" content=\"2026-03-02T00:33:00+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-03-02T15:29:32+00:00\" \/>\n<meta property=\"og:image\" content=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/Rigid-PCB-15.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"398\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"hansphere01\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Verfasst von\" \/>\n\t<meta name=\"twitter:data1\" content=\"hansphere01\" \/>\n\t<meta name=\"twitter:label2\" content=\"Gesch\u00e4tzte Lesezeit\" \/>\n\t<meta name=\"twitter:data2\" content=\"3\u00a0Minuten\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":[\"WebPage\",\"FAQPage\"],\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/\",\"name\":\"Rigid PCB Failure Analysis and Reliability Engineering - Hansphere\",\"isPartOf\":{\"@id\":\"https:\/\/www.han-sphere.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/Rigid-PCB-15.jpg\",\"datePublished\":\"2026-03-02T00:33:00+00:00\",\"dateModified\":\"2026-03-02T15:29:32+00:00\",\"author\":{\"@id\":\"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422\"},\"description\":\"Learn rigid PCB failure modes, root cause analysis methods, and reliability engineering strategies to improve product durability.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#breadcrumb\"},\"mainEntity\":[{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461121041\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461141152\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461444084\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461462661\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461486311\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461507378\"}],\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"de\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#primaryimage\",\"url\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/Rigid-PCB-15.jpg\",\"contentUrl\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/Rigid-PCB-15.jpg\",\"width\":600,\"height\":398,\"caption\":\"Rigid PCB\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.han-sphere.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Rigid PCB Failure Analysis and Reliability Engineering\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.han-sphere.com\/#website\",\"url\":\"https:\/\/www.han-sphere.com\/\",\"name\":\"hansphere\",\"description\":\"\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.han-sphere.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"de\"},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422\",\"name\":\"hansphere01\",\"sameAs\":[\"http:\/\/www.han-sphere.com\/\"],\"url\":\"https:\/\/www.han-sphere.com\/de\/author\/hansphere01\/\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461121041\",\"position\":1,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461121041\",\"name\":\"Q: 1. What is the most common rigid PCB failure?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Solder joint fatigue and via cracking.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461141152\",\"position\":2,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461141152\",\"name\":\"Q: Solder joint fatigue and via cracking.\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Yes, significantly.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461444084\",\"position\":3,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461444084\",\"name\":\"Q: 3. Is failure analysis only for defective boards?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: No, it is also used for design improvement.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461462661\",\"position\":4,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461462661\",\"name\":\"Q: 4. What is HALT testing?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: A method to identify design weaknesses under extreme stress.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461486311\",\"position\":5,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461486311\",\"name\":\"Q: 5. Can material selection impact reliability?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Yes, especially under thermal cycling.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461507378\",\"position\":6,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461507378\",\"name\":\"Q: 6. Should reliability be considered during design?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Absolutely \u2014 it is far more effective than fixing issues later.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Fehleranalyse und Zuverl\u00e4ssigkeitstechnik f\u00fcr starre Leiterplatten - Hansphere","description":"Lernen Sie starre PCB-Fehlermodi, Methoden der Ursachenanalyse und Strategien der Zuverl\u00e4ssigkeitstechnik zur Verbesserung der Produktlebensdauer kennen.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.han-sphere.com\/de\/blog\/news\/rigid-pcb-failure-analysis-reliability\/","og_locale":"de_DE","og_type":"article","og_title":"Rigid PCB Failure Analysis and Reliability Engineering - Hansphere","og_description":"Learn rigid PCB failure modes, root cause analysis methods, and reliability engineering strategies to improve product durability.","og_url":"https:\/\/www.han-sphere.com\/de\/blog\/news\/rigid-pcb-failure-analysis-reliability\/","og_site_name":"hansphere","article_published_time":"2026-03-02T00:33:00+00:00","article_modified_time":"2026-03-02T15:29:32+00:00","og_image":[{"width":600,"height":398,"url":"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/Rigid-PCB-15.jpg","type":"image\/jpeg"}],"author":"hansphere01","twitter_card":"summary_large_image","twitter_misc":{"Verfasst von":"hansphere01","Gesch\u00e4tzte Lesezeit":"3\u00a0Minuten"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":["WebPage","FAQPage"],"@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/","url":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/","name":"Fehleranalyse und Zuverl\u00e4ssigkeitstechnik f\u00fcr starre Leiterplatten - Hansphere","isPartOf":{"@id":"https:\/\/www.han-sphere.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#primaryimage"},"image":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#primaryimage"},"thumbnailUrl":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/Rigid-PCB-15.jpg","datePublished":"2026-03-02T00:33:00+00:00","dateModified":"2026-03-02T15:29:32+00:00","author":{"@id":"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422"},"description":"Lernen Sie starre PCB-Fehlermodi, Methoden der Ursachenanalyse und Strategien der Zuverl\u00e4ssigkeitstechnik zur Verbesserung der Produktlebensdauer kennen.","breadcrumb":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#breadcrumb"},"mainEntity":[{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461121041"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461141152"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461444084"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461462661"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461486311"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461507378"}],"inLanguage":"de","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/"]}]},{"@type":"ImageObject","inLanguage":"de","@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#primaryimage","url":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/Rigid-PCB-15.jpg","contentUrl":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/02\/Rigid-PCB-15.jpg","width":600,"height":398,"caption":"Rigid PCB"},{"@type":"BreadcrumbList","@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.han-sphere.com\/"},{"@type":"ListItem","position":2,"name":"Rigid PCB Failure Analysis and Reliability Engineering"}]},{"@type":"WebSite","@id":"https:\/\/www.han-sphere.com\/#website","url":"https:\/\/www.han-sphere.com\/","name":"hansphere","description":"","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.han-sphere.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"de"},{"@type":"Person","@id":"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422","name":"hansphere01","sameAs":["http:\/\/www.han-sphere.com\/"],"url":"https:\/\/www.han-sphere.com\/de\/author\/hansphere01\/"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461121041","position":1,"url":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461121041","name":"F: 1. was ist der h\u00e4ufigste Fehler bei starren Leiterplatten?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Solder joint fatigue and via cracking.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461141152","position":2,"url":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461141152","name":"F: Erm\u00fcdung von L\u00f6tstellen und Rissbildung an Durchkontaktierungen.","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Yes, significantly.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461444084","position":3,"url":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461444084","name":"F: 3. gilt die Fehleranalyse nur f\u00fcr defekte Platinen?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: No, it is also used for design improvement.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461462661","position":4,"url":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461462661","name":"F: 4. was ist ein HALT-Test?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: A method to identify design weaknesses under extreme stress.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461486311","position":5,"url":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461486311","name":"F: 5. kann die Materialauswahl die Zuverl\u00e4ssigkeit beeinflussen?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Yes, especially under thermal cycling.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461507378","position":6,"url":"https:\/\/www.han-sphere.com\/blog\/news\/rigid-pcb-failure-analysis-reliability\/#faq-question-1772461507378","name":"F: 6. sollte die Zuverl\u00e4ssigkeit bei der Planung ber\u00fccksichtigt werden?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Absolutely \u2014 it is far more effective than fixing issues later.","inLanguage":"de"},"inLanguage":"de"}]}},"_links":{"self":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/370","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/comments?post=370"}],"version-history":[{"count":2,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/370\/revisions"}],"predecessor-version":[{"id":408,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/370\/revisions\/408"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/media\/356"}],"wp:attachment":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/media?parent=370"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/categories?post=370"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/tags?post=370"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}