{"id":633,"date":"2026-04-26T08:16:00","date_gmt":"2026-04-26T00:16:00","guid":{"rendered":"https:\/\/www.han-sphere.com\/?p=633"},"modified":"2026-04-21T22:29:19","modified_gmt":"2026-04-21T14:29:19","slug":"pcb-via-design-high-speed-stub-backdrill","status":"publish","type":"post","link":"https:\/\/www.han-sphere.com\/de\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/","title":{"rendered":"PCB Via Design in Hochgeschwindigkeitsschaltungen: Stub, Backdrilling und Signalintegrit\u00e4t"},"content":{"rendered":"<p>Vias sind beim Routing leicht zu \u00fcbersehen.<\/p>\n\n\n\n<p>Es sind nur vertikale Verbindungen - bis sie anfangen, Ihr Signal zu unterbrechen.<\/p>\n\n\n\n<p>Bei niedrigen Geschwindigkeiten verhalten sich Durchkontaktierungen nahezu ideal.<br>Bei hohen Geschwindigkeiten f\u00fchren sie:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Impedanzspr\u00fcnge<\/li>\n\n\n\n<li>Reflexionen<\/li>\n\n\n\n<li>zus\u00e4tzliche Einf\u00fcgungsd\u00e4mpfung<\/li>\n<\/ul>\n\n\n\n<p>Die meisten Probleme entstehen durch eine sogenannte <strong>\u00fcber Stummel<\/strong>.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"433\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via.jpg\" alt=\"PCB \u00dcber\" class=\"wp-image-634\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-300x217.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Was ist ein PCB-Via?<\/h2>\n\n\n\n<p>Ein Via ist ein plattiertes Loch, das verschiedene Schichten einer Leiterplatte miteinander verbindet.<\/p>\n\n\n\n<p>G\u00e4ngige Typen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Durchgangsbohrung (von oben nach unten)<\/li>\n\n\n\n<li>Blinddurchgang (von der \u00e4u\u00dferen zur inneren Schicht)<\/li>\n\n\n\n<li>vergrabenes Via (nur innere Schichten)<\/li>\n<\/ul>\n\n\n\n<p>Elektrisch gesehen ist ein Via nicht nur eine Verbindung - es verh\u00e4lt sich wie eine kleine \u00dcbertragungsstruktur.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Was ist ein Via Stub?<\/h2>\n\n\n\n<p>Ein Via-Stummel ist der ungenutzte Teil eines Vias, der \u00fcber die Signalschicht hinausgeht.<\/p>\n\n\n\n<p>Beispiel:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Signal geht von Schicht 1 \u2192 Schicht 3<\/li>\n\n\n\n<li>\u00fcber weiter nach unten bis zur Schicht 8<\/li>\n\n\n\n<li>der ungenutzte Abschnitt (Schicht 3 \u2192 8) ist die Stichleitung<\/li>\n<\/ul>\n\n\n\n<p>Dieser Stub wirkt wie ein <strong>Resonanzstruktur<\/strong>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Warum Via Stubs ein Problem sind<\/h2>\n\n\n\n<p>Bei hohen Frequenzen verh\u00e4lt sich die Stichleitung wie eine offene \u00dcbertragungsleitung.<\/p>\n\n\n\n<p>Dies schafft:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Reflexionen<\/li>\n\n\n\n<li>Resonanz bei bestimmten Frequenzen<\/li>\n\n\n\n<li>Signalverzerrung<\/li>\n<\/ul>\n\n\n\n<p>In Messungen zeigt sich dies oft als:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Einbr\u00fcche in der Einf\u00fcged\u00e4mpfung<\/li>\n\n\n\n<li>unerwartete Impedanz\u00e4nderungen<\/li>\n<\/ul>\n\n\n\n<p>Verwandtes Konzept: <strong><a href=\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-insertion-loss-dielectric-vs-conductor-loss\/\">PCB-Einf\u00fcged\u00e4mpfung erkl\u00e4rt (Dielektrischer Verlust vs. Leitungsverlust)<\/a><\/strong><\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"437\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-1.jpg\" alt=\"PCB \u00dcber\" class=\"wp-image-635\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-1.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-1-300x219.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-1-16x12.jpg 16w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Wann sind Via Stubs von Bedeutung?<\/h2>\n\n\n\n<p>Nicht jeder Entwurf muss sich um sie k\u00fcmmern.<\/p>\n\n\n\n<p>Sie werden wichtig, wenn:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>die Datenraten sind hoch (mehrere Gbps)<\/li>\n\n\n\n<li>Signalflanken sind sehr schnell<\/li>\n\n\n\n<li>die Anzahl der Lagen ist gro\u00df (l\u00e4ngere Vias)<\/li>\n<\/ul>\n\n\n\n<p>Bei Konstruktionen mit niedrigeren Geschwindigkeiten ist der Effekt in der Regel vernachl\u00e4ssigbar.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Backdrilling (Wie das Problem behoben wird)<\/h2>\n\n\n\n<p>Durch das Aufbohren wird der ungenutzte Teil der Durchkontaktierung entfernt.<\/p>\n\n\n\n<p>Prozess:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>das Via normal bohren<\/li>\n\n\n\n<li>dann von der gegen\u00fcberliegenden Seite bohren, um den Stummel zu entfernen<\/li>\n<\/ul>\n\n\n\n<p>Ergebnis:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>k\u00fcrzer wirksam \u00fcber<\/li>\n\n\n\n<li>geringere Reflexion<\/li>\n\n\n\n<li>verbesserte Signalintegrit\u00e4t<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Backdrill vs. kein Backdrill<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Aspekt<\/th><th>Ohne Backdrill<\/th><th>Mit Backdrill<\/th><\/tr><\/thead><tbody><tr><td>\u00fcber Stummel<\/td><td>Gegenwart<\/td><td>entfernt<\/td><\/tr><tr><td>Reflexionen<\/td><td>h\u00f6her<\/td><td>unter<\/td><\/tr><tr><td>Einf\u00fcgungsd\u00e4mpfung<\/td><td>h\u00f6her<\/td><td>unter<\/td><\/tr><tr><td>Kosten<\/td><td>unter<\/td><td>h\u00f6her<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Backdrilling verursacht zus\u00e4tzliche Kosten, l\u00f6st aber oft echte SI-Probleme.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Andere M\u00f6glichkeiten zur Verringerung der Auswirkungen<\/h2>\n\n\n\n<p>Backdrilling ist nicht die einzige Option.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">1. Verwenden Sie Blind-\/Verdeckte Durchg\u00e4nge<\/h3>\n\n\n\n<p>Diese vermeiden lange Stummel vollst\u00e4ndig.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>bessere Signalleistung<\/li>\n\n\n\n<li>h\u00f6here Herstellungskosten<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">2. Ebenen\u00fcberg\u00e4nge minimieren<\/h3>\n\n\n\n<p>Jede Durchquerung f\u00fchrt zu einer Diskontinuit\u00e4t.<\/p>\n\n\n\n<p>Weniger \u00dcberg\u00e4nge \u2192 bessere Signalqualit\u00e4t.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3. Optimieren der Anti-Pad-Gr\u00f6\u00dfe<\/h3>\n\n\n\n<p>Der Abstand um das Via (Anti-Pad) beeinflusst die Impedanz.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>zu klein \u2192 h\u00f6here Kapazit\u00e4t<\/li>\n\n\n\n<li>zu gro\u00df \u2192 Impedanzfehlanpassung<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">4. Via-in-Pad verwenden (wenn n\u00f6tig)<\/h3>\n\n\n\n<p>H\u00e4ufig in Designs mit hoher Dichte.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>kurzer Signalweg<\/li>\n\n\n\n<li>reduzierte Induktivit\u00e4t<\/li>\n<\/ul>\n\n\n\n<p>Er erfordert jedoch eine ordnungsgem\u00e4\u00dfe F\u00fcllung und Beschichtung.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Via-Design und Impedanz<\/h2>\n\n\n\n<p>Ein Via ist nicht impedanzneutral.<\/p>\n\n\n\n<p>Sie f\u00fchrt ein:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kapazit\u00e4t (zu Ebenen)<\/li>\n\n\n\n<li>Induktivit\u00e4t (durch den Lauf)<\/li>\n<\/ul>\n\n\n\n<p>Dadurch entsteht eine Impedanzdiskontinuit\u00e4t.<\/p>\n\n\n\n<p>In Hochgeschwindigkeitsdesigns werden Durchkontaktierungen oft wie Leiterbahnen modelliert und abgestimmt.<\/p>\n\n\n\n<p>Stackup-Interaktion: <strong><a href=\"https:\/\/www.han-sphere.com\/blog\/news\/fr4-pcb-stackup-design-guide\/\">FR4 PCB Stackup Design Leitfaden<\/a><\/strong><\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"466\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-2.jpg\" alt=\"PCB \u00dcber\" class=\"wp-image-636\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-2.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-2-300x233.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-2-15x12.jpg 15w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Hin- und R\u00fcckweg<\/h2>\n\n\n\n<p>Der R\u00fcckstrom muss dem Signal durch den Via-\u00dcbergang folgen.<\/p>\n\n\n\n<p>Wenn keine Referenz in der N\u00e4he ist, \u00fcber:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>der R\u00fcckweg ist unterbrochen<\/li>\n\n\n\n<li>Schleifenbereich vergr\u00f6\u00dfert sich<\/li>\n\n\n\n<li>L\u00e4rmerh\u00f6hungen<\/li>\n<\/ul>\n\n\n\n<p>L\u00f6sung:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Massedurchf\u00fchrungen in der N\u00e4he von Signaldurchf\u00fchrungen anbringen<\/li>\n<\/ul>\n\n\n\n<p>Weitere Einzelheiten: <strong><a href=\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-return-path-ground-plane-high-speed-design\/\">PCB-R\u00fcckleitung und Massefl\u00e4che im Hochgeschwindigkeitsdesign<\/a><\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Wie man Durchkontaktierungen f\u00fcr Hochgeschwindigkeits-Leiterplatten entwirft<\/h2>\n\n\n\n<p><\/p>\n\n\n\n<div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\">Hier finden die meisten Verbesserungen statt.<\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1776781551459\"><strong class=\"schema-how-to-step-name\">1. Vias kurz halten<\/strong> <p class=\"schema-how-to-step-text\">K\u00fcrzere Durchg\u00e4nge \u2192 weniger Induktivit\u00e4t \u2192 weniger Reflexion<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1776781562678\"><strong class=\"schema-how-to-step-name\">2. Ungenutzte Stub-L\u00e4nge vermeiden<\/strong> <p class=\"schema-how-to-step-text\">Verwendung:<br\/>. r\u00fcckw\u00e4rts bohren<br\/>. blinde\/vergrabene Durchkontaktierungen<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1776781583314\"><strong class=\"schema-how-to-step-name\">3. Bodenvias in der N\u00e4he platzieren<\/strong> <p class=\"schema-how-to-step-text\">Behalten Sie einen kontinuierlichen R\u00fcckweg bei.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1776781590218\"><strong class=\"schema-how-to-step-name\">4. Steuerung \u00fcber Geometrie<\/strong> <p class=\"schema-how-to-step-text\">Entscheidende Parameter:<br\/>. Bohrergr\u00f6\u00dfe<br\/>. Polstergr\u00f6\u00dfe<br\/>. Anti-Pad-Gr\u00f6\u00dfe<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1776781609441\"><strong class=\"schema-how-to-step-name\">5. Kritische Vias simulieren<\/strong> <p class=\"schema-how-to-step-text\">F\u00fcr Hochgeschwindigkeitskan\u00e4le:<br\/>. Durchkontaktierungen in die Simulation einbeziehen<br\/>. gehen Sie nicht davon aus, dass sie vernachl\u00e4ssigbar sind<\/p> <\/li><\/ol><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Praktische Gestaltungshinweise<\/h2>\n\n\n\n<p>Aus echten Entw\u00fcrfen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u00fcber Stubs zeigen sich oft unerkl\u00e4rliche Verlustspitzen<\/li>\n\n\n\n<li>Backdrilling ist bei Hochgeschwindigkeits-Backplanes \u00fcblich<\/li>\n\n\n\n<li>Ignorieren von R\u00fcckleitungsdurchf\u00fchrungen verursacht EMI-Probleme<\/li>\n\n\n\n<li>Via-Design wird mit steigender Datenrate wichtiger<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Schlussfolgerung<\/h2>\n\n\n\n<p>Beim Hochgeschwindigkeits-Leiterplattendesign sind Durchkontaktierungen nicht mehr \u201cnur Verbindungen\u201d.\u201d<\/p>\n\n\n\n<p>Sie f\u00fchren Impedanzunterbrechungen ein und k\u00f6nnen die Signalintegrit\u00e4t erheblich beeintr\u00e4chtigen. Insbesondere Durchgangsstichleitungen k\u00f6nnen bei hohen Frequenzen zu Reflexionen und Resonanzproblemen f\u00fchren.<\/p>\n\n\n\n<p>Ein sorgf\u00e4ltiges Via-Design - einschlie\u00dflich Backdrilling, Geometriekontrolle und korrekter Planung des R\u00fccklaufs - ist f\u00fcr eine zuverl\u00e4ssige Hochgeschwindigkeitsleistung unerl\u00e4sslich.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">FAQ<\/h2>\n\n\n\n<div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1776781394311\"><strong class=\"schema-faq-question\">F: Was ist ein Via Stub?<\/strong> <p class=\"schema-faq-answer\">A: Es handelt sich um den ungenutzten Teil eines Durchgangs, der \u00fcber die Signalschicht hinausgeht.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1776781406347\"><strong class=\"schema-faq-question\">F: Warum sind \"Via Stubs\" schlecht?<\/strong> <p class=\"schema-faq-answer\">A: Sie wirken als Resonanzstrukturen und verursachen Signalreflexionen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1776781417336\"><strong class=\"schema-faq-question\">F: Was ist Backdrilling?<\/strong> <p class=\"schema-faq-answer\">A: Ein Verfahren, bei dem der ungenutzte Teil eines Durchgangs entfernt wird, um die Signalintegrit\u00e4t zu verbessern.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1776781430594\"><strong class=\"schema-faq-question\">F: M\u00fcssen alle PCBs hinterbohrt werden?<\/strong> <p class=\"schema-faq-answer\">A: Nein. Es wird haupts\u00e4chlich in Hochgeschwindigkeitsdesigns verwendet, wo Via-Stubs die Leistung beeintr\u00e4chtigen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1776781446062\"><strong class=\"schema-faq-question\">F: Wie wirken sich Durchkontaktierungen auf die Impedanz aus?<\/strong> <p class=\"schema-faq-answer\">A: Sie f\u00fchren Kapazit\u00e4ten und Induktivit\u00e4ten ein, wodurch Impedanzdiskontinuit\u00e4ten entstehen.<\/p> <\/div> <\/div>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Vias play an important role in multilayer PCB design, but in high-speed circuits they can introduce signal reflections and additional loss. This article explains via stubs, backdrilling, and how engineers design vias to maintain signal integrity.<\/p>","protected":false},"author":1,"featured_media":637,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[4],"tags":[53],"class_list":["post-633","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-via-design"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Via Design in High-Speed Circuits: Stub, Backdrilling, and Signal Integrity<\/title>\n<meta name=\"description\" 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class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":[\"WebPage\",\"FAQPage\"],\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/\",\"name\":\"PCB Via Design in High-Speed Circuits: Stub, Backdrilling, and Signal Integrity\",\"isPartOf\":{\"@id\":\"https:\/\/www.han-sphere.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-3.jpg\",\"datePublished\":\"2026-04-26T00:16:00+00:00\",\"author\":{\"@id\":\"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422\"},\"description\":\"Learn how PCB via design affects high-speed signals, including via stubs, backdrilling, and practical techniques to improve signal integrity.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#breadcrumb\"},\"mainEntity\":[{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781394311\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781406347\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781417336\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781430594\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781446062\"}],\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"de\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#primaryimage\",\"url\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-3.jpg\",\"contentUrl\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-3.jpg\",\"width\":600,\"height\":473,\"caption\":\"PCB Via\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.han-sphere.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"PCB Via Design in High-Speed Circuits: Stub, Backdrilling, and Signal Integrity\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.han-sphere.com\/#website\",\"url\":\"https:\/\/www.han-sphere.com\/\",\"name\":\"hansphere\",\"description\":\"\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.han-sphere.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"de\"},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422\",\"name\":\"hansphere01\",\"sameAs\":[\"http:\/\/www.han-sphere.com\/\"],\"url\":\"https:\/\/www.han-sphere.com\/de\/author\/hansphere01\/\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781394311\",\"position\":1,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781394311\",\"name\":\"Q: What is a via stub?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: It is the unused portion of a via that extends beyond the signal layer.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781406347\",\"position\":2,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781406347\",\"name\":\"Q: Why are via stubs bad?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: They act as resonant structures and cause signal reflections.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781417336\",\"position\":3,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781417336\",\"name\":\"Q: What is backdrilling?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: A process that removes the unused part of a via to improve signal integrity.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781430594\",\"position\":4,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781430594\",\"name\":\"Q: Do all PCBs need backdrilling?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: No. It is mainly used in high-speed designs where via stubs affect performance.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781446062\",\"position\":5,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781446062\",\"name\":\"Q: How do vias affect impedance?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: They introduce capacitance and inductance, creating impedance discontinuities.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"HowTo\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#howto-1\",\"name\":\"PCB Via Design in High-Speed Circuits: Stub, Backdrilling, and Signal Integrity\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/\"},\"description\":\"This is where most improvements happen.\",\"step\":[{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#how-to-step-1776781551459\",\"name\":\"1. Keep Vias Short\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Shorter vias \u2192 less inductance \u2192 less reflection\"}]},{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#how-to-step-1776781562678\",\"name\":\"2. Avoid Unused Stub Length\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Use:<br\/>. backdrilling<br\/>. blind\/buried vias\"}]},{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#how-to-step-1776781583314\",\"name\":\"3. Place Ground Vias Nearby\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Maintain a continuous return path.\"}]},{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#how-to-step-1776781590218\",\"name\":\"4. Control Via Geometry\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Parameters that matter:<br\/>. drill size<br\/>. pad size<br\/>. anti-pad size\"}]},{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#how-to-step-1776781609441\",\"name\":\"5. Simulate Critical Vias\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"For high-speed channels:<br\/>. include vias in simulation<br\/>. don\u2019t assume they are negligible\"}]}],\"inLanguage\":\"de\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"PCB Via Design in Hochgeschwindigkeitsschaltungen: Stub, Backdrilling und Signalintegrit\u00e4t","description":"Erfahren Sie, wie sich das Design von PCB-Vias auf Hochgeschwindigkeitssignale auswirkt, einschlie\u00dflich Via-Stubs, Backdrilling und praktische Techniken zur Verbesserung der Signalintegrit\u00e4t.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.han-sphere.com\/de\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/","og_locale":"de_DE","og_type":"article","og_title":"PCB Via Design in High-Speed Circuits: Stub, Backdrilling, and Signal Integrity","og_description":"Learn how PCB via design affects high-speed signals, including via stubs, backdrilling, and practical techniques to improve signal integrity.","og_url":"https:\/\/www.han-sphere.com\/de\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/","og_site_name":"hansphere","article_published_time":"2026-04-26T00:16:00+00:00","og_image":[{"width":600,"height":473,"url":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-3.jpg","type":"image\/jpeg"}],"author":"hansphere01","twitter_card":"summary_large_image","twitter_misc":{"Verfasst von":"hansphere01","Gesch\u00e4tzte Lesezeit":"5\u00a0Minuten"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":["WebPage","FAQPage"],"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/","name":"PCB Via Design in Hochgeschwindigkeitsschaltungen: Stub, Backdrilling und Signalintegrit\u00e4t","isPartOf":{"@id":"https:\/\/www.han-sphere.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#primaryimage"},"image":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#primaryimage"},"thumbnailUrl":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-3.jpg","datePublished":"2026-04-26T00:16:00+00:00","author":{"@id":"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422"},"description":"Erfahren Sie, wie sich das Design von PCB-Vias auf Hochgeschwindigkeitssignale auswirkt, einschlie\u00dflich Via-Stubs, Backdrilling und praktische Techniken zur Verbesserung der Signalintegrit\u00e4t.","breadcrumb":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#breadcrumb"},"mainEntity":[{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781394311"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781406347"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781417336"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781430594"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781446062"}],"inLanguage":"de","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/"]}]},{"@type":"ImageObject","inLanguage":"de","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#primaryimage","url":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-3.jpg","contentUrl":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/PCB-Via-3.jpg","width":600,"height":473,"caption":"PCB Via"},{"@type":"BreadcrumbList","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.han-sphere.com\/"},{"@type":"ListItem","position":2,"name":"PCB Via Design in High-Speed Circuits: Stub, Backdrilling, and Signal Integrity"}]},{"@type":"WebSite","@id":"https:\/\/www.han-sphere.com\/#website","url":"https:\/\/www.han-sphere.com\/","name":"hansphere","description":"","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.han-sphere.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"de"},{"@type":"Person","@id":"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422","name":"hansphere01","sameAs":["http:\/\/www.han-sphere.com\/"],"url":"https:\/\/www.han-sphere.com\/de\/author\/hansphere01\/"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781394311","position":1,"url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781394311","name":"F: Was ist ein Via Stub?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: It is the unused portion of a via that extends beyond the signal layer.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781406347","position":2,"url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781406347","name":"F: Warum sind \"Via Stubs\" schlecht?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: They act as resonant structures and cause signal reflections.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781417336","position":3,"url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781417336","name":"F: Was ist Backdrilling?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: A process that removes the unused part of a via to improve signal integrity.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781430594","position":4,"url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781430594","name":"F: M\u00fcssen alle PCBs hinterbohrt werden?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: No. It is mainly used in high-speed designs where via stubs affect performance.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781446062","position":5,"url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#faq-question-1776781446062","name":"F: Wie wirken sich Durchkontaktierungen auf die Impedanz aus?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: They introduce capacitance and inductance, creating impedance discontinuities.","inLanguage":"de"},"inLanguage":"de"},{"@type":"HowTo","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#howto-1","name":"PCB Via Design in Hochgeschwindigkeitsschaltungen: Stub, Backdrilling und Signalintegrit\u00e4t","mainEntityOfPage":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/"},"description":"Hier finden die meisten Verbesserungen statt.","step":[{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#how-to-step-1776781551459","name":"1. Keep Vias Short","itemListElement":[{"@type":"HowToDirection","text":"Shorter vias \u2192 less inductance \u2192 less reflection"}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#how-to-step-1776781562678","name":"2. Avoid Unused Stub Length","itemListElement":[{"@type":"HowToDirection","text":"Use:<br\/>. backdrilling<br\/>. blind\/buried vias"}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#how-to-step-1776781583314","name":"3. Place Ground Vias Nearby","itemListElement":[{"@type":"HowToDirection","text":"Maintain a continuous return path."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#how-to-step-1776781590218","name":"4. Control Via Geometry","itemListElement":[{"@type":"HowToDirection","text":"Parameters that matter:<br\/>. drill size<br\/>. pad size<br\/>. anti-pad size"}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-via-design-high-speed-stub-backdrill\/#how-to-step-1776781609441","name":"5. Simulate Critical Vias","itemListElement":[{"@type":"HowToDirection","text":"For high-speed channels:<br\/>. include vias in simulation<br\/>. don\u2019t assume they are negligible"}]}],"inLanguage":"de"}]}},"_links":{"self":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/633","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/comments?post=633"}],"version-history":[{"count":1,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/633\/revisions"}],"predecessor-version":[{"id":638,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/633\/revisions\/638"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/media\/637"}],"wp:attachment":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/media?parent=633"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/categories?post=633"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/tags?post=633"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}