{"id":707,"date":"2026-05-18T10:53:00","date_gmt":"2026-05-18T02:53:00","guid":{"rendered":"https:\/\/www.han-sphere.com\/?p=707"},"modified":"2026-05-19T00:03:21","modified_gmt":"2026-05-18T16:03:21","slug":"through-hole-technology-tht-assembly","status":"publish","type":"post","link":"https:\/\/www.han-sphere.com\/de\/blog\/news\/through-hole-technology-tht-assembly\/","title":{"rendered":"THT-Montage (Through-Hole Technology): Engineering f\u00fcr mechanische Zuverl\u00e4ssigkeit"},"content":{"rendered":"<p class=\"wp-block-paragraph\">W\u00e4hrend <a href=\"https:\/\/www.han-sphere.com\/blog\/news\/the-complete-smt-assembly-process\/\">Oberfl\u00e4chenmontage-Technologie<\/a> (SMT) dominiert die Welt der ultrakompakten Unterhaltungselektronik, <strong>Durchgangslochtechnik (THT)<\/strong> bleibt der unangefochtene Champion f\u00fcr robuste, stark beanspruchte und leistungsstarke Anwendungen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Von Systemen f\u00fcr die Luft- und Raumfahrt bis hin zu industriellen Stromversorgungen und hochbelastbaren Steckverbindern f\u00fcr die Automobilindustrie sind Komponenten, die starken physischen Belastungen, Temperaturschwankungen oder hohen Str\u00f6men standhalten m\u00fcssen, in hohem Ma\u00dfe auf THT angewiesen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Unter <strong>HanSphere<\/strong>, Wir bieten fortschrittliche, halbautomatische und manuelle THT-Linien an, die nahtlos mit unserer Hochgeschwindigkeits-SMT-Infrastruktur zusammenarbeiten und sicherstellen, dass Ihre Hybridleiterplatten das Beste aus beiden Welten erhalten.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"449\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/THT-Assembly.jpg\" alt=\"THT-Montage\" class=\"wp-image-708\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/THT-Assembly.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/THT-Assembly-300x225.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/THT-Assembly-16x12.jpg 16w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">1. Was ist THT Assembly?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Bei der Durchstecktechnik werden elektronische Bauteile mit Drahtanschl\u00fcssen in vorgebohrte L\u00f6cher auf einer Leiterplatte (PCB) eingesetzt. Diese Leitungen werden dann an Pads auf der gegen\u00fcberliegenden Seite der Leiterplatte angel\u00f6tet.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Der wichtigste Vorteil von THT ist die <strong>starke physische Bindung<\/strong> sie schafft. Da die Leiterbahnen des Bauteils direkt durch die Platine verlaufen, kann die L\u00f6tstelle weitaus mehr mechanischem Ziehen, Verdrehen und Umgebungsvibrationen standhalten als eine SMT-Verbindung, die nur auf der Oberfl\u00e4che ruht.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">2. Der schrittweise THT-Prozess bei HanSphere<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Schritt 1: Vorbereitung und Formung von Bauteilanschl\u00fcssen<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Elektronische Bauteile werden oft mit geraden, langen Leitungen geliefert. Vor dem Einsetzen m\u00fcssen diese Leitungen geschnitten und gebogen (geformt) werden, damit sie genau zu den Lochabst\u00e4nden auf der Leiterplatte passen. HanSphere verwendet automatisierte Biegemaschinen, um eine gleichm\u00e4\u00dfige Biegung zu gew\u00e4hrleisten und mechanische Belastungen des Bauteilk\u00f6rpers zu vermeiden.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Schritt 2: Einsetzen der Komponenten (manuell oder automatisiert)<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Je nach Produktionsvolumen und Komplexit\u00e4t werden die Bauteile auf der Platine platziert.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Automatisierte Einf\u00fcgung:<\/strong> F\u00fcr radiale und axiale Standardbauteile in Gro\u00dfserien.<\/li>\n\n\n\n<li><strong>Manuelles Einsetzen:<\/strong> Bei komplexen, ungew\u00f6hnlich geformten Bauteilen wie schweren Transformatoren, Klemmenleisten und speziellen Steckverbindern platziert unser hochqualifiziertes Technikerteam die Teile von Hand unter Anwendung strenger ESD-sicherer Protokolle.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Schritt 3: Wellenl\u00f6ten oder Selektivl\u00f6ten<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Sobald die Bauteile best\u00fcckt sind, geht die Platine in die L\u00f6tphase \u00fcber:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Wellenl\u00f6ten:<\/strong> Die gesamte Leiterplatte l\u00e4uft \u00fcber eine Welle aus geschmolzenem Lot. Das Lot flie\u00dft durch Kapillarwirkung in die durchkontaktierten L\u00f6cher und bildet eine perfekte Verrundung.<\/li>\n\n\n\n<li><strong>Selektives L\u00f6ten:<\/strong> Wenn die Leiterplatte bereits SMT-Bauteile auf der Unterseite hat, die nicht einer vollen Schmelzwelle ausgesetzt werden k\u00f6nnen, verwenden wir eine Pr\u00e4zisions-Selektivl\u00f6tmaschine, um einzelne Durchgangslochstifte gezielt anzusteuern, ohne benachbarte oberfl\u00e4chenmontierte Teile zu st\u00f6ren.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Schritt 4: Inspektion und Reinigung nach dem L\u00f6ten<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Jede THT-Verbindung wird strengen Qualit\u00e4tskontrollen unterzogen. Unser Team setzt automatische optische Systeme und manuelle Sichtpr\u00fcfungen ein, um sicherzustellen, dass die L\u00f6tf\u00e4sser mit 100% gef\u00fcllt sind (IPC Klasse 2 oder Klasse 3). Die Leiterplatten werden anschlie\u00dfend gereinigt, um aktive Flussmittelr\u00fcckst\u00e4nde zu entfernen.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"432\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/THT-Assembly-1.jpg\" alt=\"THT-Montage\" class=\"wp-image-709\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/THT-Assembly-1.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/THT-Assembly-1-300x216.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/THT-Assembly-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">3. Design for Manufacturing (DFM) Regeln f\u00fcr THT<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Um Ihr Durchgangsbohrungsdesign f\u00fcr die HanSphere-Fertigung zu optimieren und die Produktionskosten niedrig zu halten, sollten Sie diese Regeln in Ihr CAD-Layout einbeziehen:<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><td><strong>Merkmal<\/strong><\/td><td><strong>Empfohlene Spezifikation<\/strong><\/td><td><strong>Warum es wichtig ist<\/strong><\/td><\/tr><\/thead><tbody><tr><td><strong>Bohrung-zu-Blech-Abstand<\/strong><\/td><td>Bauteil-Durchmesser + 0,2 mm bis 0,4 mm<\/td><td>Ein zu fester Sitz macht das Einsetzen unm\u00f6glich; ein zu lockerer Sitz f\u00fchrt zu einer schlechten Kapillarl\u00f6tung.<\/td><\/tr><tr><td><strong>Breite des Ringes<\/strong><\/td><td>Mindestens 0,5 mm (20 mil)<\/td><td>Gew\u00e4hrleistet eine ausreichende Kupferfl\u00e4che f\u00fcr eine strukturell solide L\u00f6tstelle.<\/td><\/tr><tr><td><strong>Komponente Pitch<\/strong><\/td><td>\u00dcbereinstimmung mit Standard-Rasterintervallen (z. B. 2,54 mm)<\/td><td>Erm\u00f6glicht den Einsatz von standardm\u00e4\u00dfigen automatisierten Form- und Best\u00fcckungswerkzeugen.<\/td><\/tr><tr><td><strong>Thermische Entlastungspads<\/strong><\/td><td>Erforderlich f\u00fcr Boden-\/Triebwerksflugzeuge<\/td><td>Verhindert, dass die Kupferebenen als W\u00e4rmesenken wirken, was zu kalten L\u00f6tstellen f\u00fchrt.<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">4. THT vs. SMT: Die richtige Balance finden<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Die meisten modernen elektronischen Ger\u00e4te entscheiden sich nicht f\u00fcr das eine oder das andere; sie verwenden <strong>Gemischte Montage (Hybridplatten)<\/strong>.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Verwenden Sie <strong>SMT<\/strong> f\u00fcr Mikrocontroller, Speicher, Chipwiderst\u00e4nde und digitale Hochgeschwindigkeitsschleifen.<\/li>\n\n\n\n<li>Verwenden Sie <strong>THT<\/strong> f\u00fcr Eingangs-\/Ausgangsstecker, Schalter, Elektrolytkondensatoren und Endstufenkomponenten.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><em>Interner Link:<\/em> Wenn Sie unsicher sind, welche Technologie zu Ihrem Projektbudget passt, konsultieren Sie unsere <a href=\"https:\/\/www.han-sphere.com\/blog\/news\/smt-vs-tht-assembly\/\" target=\"_blank\" rel=\"noreferrer noopener\">SMT vs. THT Vergleichsleitfaden<\/a>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">FAQ: THT Montage Einblicke<\/h2>\n\n\n\n<div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1779116222536\"><strong class=\"schema-faq-question\"><strong>F: Warum ist die THT-Best\u00fcckung im Allgemeinen teurer als die SMT-Best\u00fcckung?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: THT erfordert mehr manuelle Handhabung, Bleiformen und sekund\u00e4re L\u00f6tschritte (wie Selektivl\u00f6ten). Die Gestaltung der Leiterplatte mit klaren Abst\u00e4nden und automatisierter Werkzeugkompatibilit\u00e4t kann diese Arbeitskosten im Werk jedoch drastisch reduzieren.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1779116242850\"><strong class=\"schema-faq-question\"><strong>F: Welche IPC-Standards befolgt HanSphere f\u00fcr THT?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Wir fertigen streng nach <strong>IPC-A-610 Klasse 2<\/strong> f\u00fcr standardm\u00e4\u00dfige industrielle\/gewerbliche Elektronik und kann <strong>Klasse 3<\/strong> (High Reliability\/Aerospace) auf ausdr\u00fccklichen Kundenwunsch.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1779116249235\"><strong class=\"schema-faq-question\"><strong>F: K\u00f6nnen Sie Projekte mit gemischter Technologie (SMT + THT) bearbeiten?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Ja, die meisten unserer PCBA-Projekte sind hybrid. In der Regel f\u00fchren wir zuerst das SMT-Reflow-Verfahren durch, gefolgt vom Durchsteckwellen- oder Selektivl\u00f6ten.<\/p> <\/div> <\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>","protected":false},"excerpt":{"rendered":"<p>Von der Vorbereitung der Bauteilanschl\u00fcsse bis zum automatisierten Wellenl\u00f6ten: Erfahren Sie, wie HanSphere eine hochzuverl\u00e4ssige Durchsteck-Leiterplattenbest\u00fcckung f\u00fcr raue Umgebungen erm\u00f6glicht.<\/p>","protected":false},"author":1,"featured_media":710,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[4],"tags":[57],"class_list":["post-707","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-tht-assembly"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Through-Hole Technology (THT) Assembly: Durable PCBA for Heavy-Duty Electronics | HanSphere<\/title>\n<meta name=\"description\" content=\"Explore the THT assembly process. From component lead preparation to automated wave soldering, learn how HanSphere delivers high-reliability through-hole PCB assembly for rugged environments.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/through-hole-technology-tht-assembly\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Through-Hole Technology (THT) Assembly: Durable PCBA for Heavy-Duty Electronics | HanSphere\" \/>\n<meta property=\"og:description\" content=\"Explore the THT assembly process. From component lead preparation to automated wave soldering, learn how HanSphere delivers high-reliability through-hole PCB assembly for rugged environments.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/through-hole-technology-tht-assembly\/\" \/>\n<meta property=\"og:site_name\" content=\"hansphere\" \/>\n<meta property=\"article:published_time\" content=\"2026-05-18T02:53:00+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-05-18T16:03:21+00:00\" \/>\n<meta property=\"og:image\" content=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/THT-Assembly-2.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"440\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"hansphere01\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Verfasst von\" \/>\n\t<meta name=\"twitter:data1\" content=\"hansphere01\" \/>\n\t<meta name=\"twitter:label2\" content=\"Gesch\u00e4tzte Lesezeit\" \/>\n\t<meta name=\"twitter:data2\" content=\"4\u00a0Minuten\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":[\"WebPage\",\"FAQPage\"],\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/through-hole-technology-tht-assembly\/\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/through-hole-technology-tht-assembly\/\",\"name\":\"Through-Hole Technology (THT) Assembly: Durable PCBA for Heavy-Duty Electronics | HanSphere\",\"isPartOf\":{\"@id\":\"https:\/\/www.han-sphere.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/through-hole-technology-tht-assembly\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/through-hole-technology-tht-assembly\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/THT-Assembly-2.jpg\",\"datePublished\":\"2026-05-18T02:53:00+00:00\",\"dateModified\":\"2026-05-18T16:03:21+00:00\",\"author\":{\"@id\":\"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422\"},\"description\":\"Explore the THT assembly process. 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