{"id":736,"date":"2026-05-27T08:53:00","date_gmt":"2026-05-27T00:53:00","guid":{"rendered":"https:\/\/www.han-sphere.com\/?p=736"},"modified":"2026-05-25T23:03:04","modified_gmt":"2026-05-25T15:03:04","slug":"pcb-testing-methods-quality-control","status":"publish","type":"post","link":"https:\/\/www.han-sphere.com\/de\/blog\/news\/pcb-testing-methods-quality-control\/","title":{"rendered":"PCB-Testmethoden erkl\u00e4rt: AOI, ICT, Flying Probe, R\u00f6ntgen- und Funktionstests"},"content":{"rendered":"<p class=\"wp-block-paragraph\">Eine Leiterplatte kann perfekt aussehen und trotzdem elektrisch ausfallen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Bei einer guten Fertigung geht es nicht nur um die Herstellung, sondern auch um die \u00dcberpr\u00fcfung.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Deshalb gibt es die PCB-Pr\u00fcfung.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Unabh\u00e4ngig davon, ob die Platine in der Unterhaltungselektronik, in industriellen Systemen, in der Automobilbranche oder in der Medizintechnik eingesetzt wird, ist die Pr\u00fcfung das Mittel, um Probleme aufzusp\u00fcren, bevor die Produkte in die Praxis gelangen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Zu den typischen Problemen, die bei den Tests festgestellt wurden, geh\u00f6ren:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>offene Schaltkreise<\/li>\n\n\n\n<li>Shorts<\/li>\n\n\n\n<li>L\u00f6tfehler<\/li>\n\n\n\n<li>fehlende Komponenten<\/li>\n\n\n\n<li>versteckte BGA-Fehler<\/li>\n\n\n\n<li>Funktionsprobleme<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">F\u00fcr unterschiedliche Risiken werden unterschiedliche Tests verwendet.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"533\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/AOI.jpg\" alt=\"AOI\" class=\"wp-image-718\" style=\"width:600px\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/AOI.jpg 800w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/AOI-300x200.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/AOI-768x512.jpg 768w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/AOI-18x12.jpg 18w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Warum PCB-Tests wichtig sind<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Selbst bei einem stabilen Herstellungsprozess kommt es immer wieder zu Abweichungen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Kleine Defekte k\u00f6nnen die Ursache sein:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>intermittierende Ausf\u00e4lle<\/li>\n\n\n\n<li>geringere Zuverl\u00e4ssigkeit<\/li>\n\n\n\n<li>Feldr\u00fcckgaben<\/li>\n\n\n\n<li>kostspielige R\u00fcckrufe<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Testen hilft beim \u00dcberpr\u00fcfen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>elektrische Kontinuit\u00e4t<\/li>\n\n\n\n<li>L\u00f6tqualit\u00e4t<\/li>\n\n\n\n<li>Montagegenauigkeit<\/li>\n\n\n\n<li>Gesamtfunktionalit\u00e4t<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">\u00dcberlegungen zur Produktionsqualit\u00e4t finden Sie unter <strong>Hochgeschwindigkeits-PCB-Design f\u00fcr Fertigung und Ausbeute<\/strong>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">G\u00e4ngige PCB-Pr\u00fcfmethoden<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Es gibt keinen einzigen \u201cbesten\u201d Test.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Die Hersteller kombinieren in der Regel mehrere Methoden.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Automatisierte optische Inspektion (AOI)<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Bei der AOI werden Kameras zur automatischen Inspektion von PCB-Baugruppen eingesetzt.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Sie pr\u00fcft auf:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>fehlende Komponenten<\/li>\n\n\n\n<li>Polarit\u00e4tsfehler<\/li>\n\n\n\n<li>L\u00f6tbr\u00fcckenbildung<\/li>\n\n\n\n<li>Montageversatz<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Wo AOI am besten funktioniert<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>SMT-Best\u00fcckungslinien<\/li>\n\n\n\n<li>Gro\u00dfserienfertigung<\/li>\n\n\n\n<li>sichtbare L\u00f6tstellen<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Beschr\u00e4nkungen<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">AOI kann keine verdeckten Verbindungen pr\u00fcfen, wie z. B.:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>BGA-L\u00f6tkugeln<\/li>\n\n\n\n<li>versteckte M\u00e4ngel auf der Unterseite<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Die AOI ist in der Regel einer der fr\u00fchesten Pr\u00fcfschritte.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">R\u00f6ntgeninspektion<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Einige M\u00e4ngel sind optisch nicht erkennbar.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Hier kommt die R\u00f6ntgeninspektion ins Spiel.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Es wird \u00fcblicherweise verwendet f\u00fcr:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>BGA-Geh\u00e4use<\/li>\n\n\n\n<li>QFN-Bauteile<\/li>\n\n\n\n<li>verdeckte L\u00f6tstellen<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Das R\u00f6ntgenbild kann Aufschluss geben:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>entf\u00e4llt<\/li>\n\n\n\n<li>Kaltl\u00f6tstellen<\/li>\n\n\n\n<li>unzureichendes L\u00f6tzinn<\/li>\n\n\n\n<li>\u00dcberbr\u00fcckung unter Komponenten<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Bei komplexen Baugruppen ist das R\u00f6ntgen oft obligatorisch.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">In-Circuit-Tests (ICT)<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">ICT pr\u00fcft einzelne Bauteile auf der Platine elektrisch.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Typische Kontrollen sind:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Shorts<\/li>\n\n\n\n<li>\u00f6ffnet<\/li>\n\n\n\n<li>Widerstand<\/li>\n\n\n\n<li>Kapazit\u00e4t<\/li>\n\n\n\n<li>Bauteilwerte<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Vorteile<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>schnelle Pr\u00fcfung<\/li>\n\n\n\n<li>hohe Abdeckung<\/li>\n\n\n\n<li>geeignet f\u00fcr die Serienproduktion<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Begrenzung<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">F\u00fcr die IKT ist oft eine spezielle Halterung erforderlich.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Das erh\u00f6ht die Vorabkosten.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Flying Probe Testing<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Die Pr\u00fcfung mit der fliegenden Sonde ist \u00e4hnlich wie die ICT-Pr\u00fcfung, jedoch ohne eine spezielle Halterung.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Stattdessen ber\u00fchren die beweglichen Pr\u00fcfspitzen automatisch die Pr\u00fcfpunkte.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Am besten f\u00fcr<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Prototypen<\/li>\n\n\n\n<li>Kleinserienfertigung<\/li>\n\n\n\n<li>schnelle Fertigung<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Trade-Off<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Langsamer als ICT, aber flexibler.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Aus diesem Grund werden viele Leiterplattenprototypen zun\u00e4chst mit Flying Probe getestet.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Funktionspr\u00fcfung (FCT)<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Bei der Funktionspr\u00fcfung wird \u00fcberpr\u00fcft, ob die best\u00fcckte Leiterplatte tats\u00e4chlich funktioniert.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Anstatt isolierte Komponenten zu pr\u00fcfen, wird getestet:<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">\u201cErf\u00fcllt das Gremium die ihm zugedachte Funktion?\u201d<\/p>\n<\/blockquote>\n\n\n\n<p class=\"wp-block-paragraph\">Beispiele:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Einschaltpr\u00fcfung<\/li>\n\n\n\n<li>Kommunikations\u00fcberpr\u00fcfung<\/li>\n\n\n\n<li>Signalmessung<\/li>\n\n\n\n<li>Software-Interaktion<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Funktionstests sind oft der letzte Schritt der Validierung.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Burn-In-Pr\u00fcfung<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">F\u00fcr Anwendungen mit hoher Zuverl\u00e4ssigkeit k\u00f6nnen die Leiterplatten einem Burn-in-Test unterzogen werden.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Das Brett l\u00e4uft unter:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>erh\u00f6hte Temperatur<\/li>\n\n\n\n<li>Dauerbetrieb<\/li>\n\n\n\n<li>elektrische Belastung<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Zweck:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>fr\u00fche Misserfolge im Leben aufdecken<\/li>\n\n\n\n<li>das Vertrauen in die Zuverl\u00e4ssigkeit verbessern<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Gemeinsam in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Luft- und Raumfahrt<\/li>\n\n\n\n<li>Automobil<\/li>\n\n\n\n<li>Industrieelektronik<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Boundary Scan (JTAG) Pr\u00fcfung<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Bei dichten Leiterplatten mit eingeschr\u00e4nktem Zugang zur Sonde ist der Boundary Scan n\u00fctzlich.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Es erm\u00f6glicht elektrische Pr\u00fcfungen \u00fcber IC-Schnittstellen ohne physische Abtastung.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Besonders n\u00fctzlich f\u00fcr:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>komplexe digitale Systeme<\/li>\n\n\n\n<li>Fine-Pitch-Komponenten<\/li>\n\n\n\n<li>Mehrschichtplatten<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"534\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/x-ray.jpg\" alt=\"R\u00f6ntgenstrahlen\" class=\"wp-image-720\" style=\"width:600px\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/x-ray.jpg 800w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/x-ray-300x200.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/x-ray-768x513.jpg 768w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/x-ray-18x12.jpg 18w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Vergleich der PCB-Pr\u00fcfmethoden<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Methode<\/th><th>Am besten f\u00fcr<\/th><th>Hauptzweck<\/th><th>Begrenzung<\/th><\/tr><\/thead><tbody><tr><td>AOI<\/td><td>SMT-Pr\u00fcfung<\/td><td>Sehfehler<\/td><td>versteckte Fugen<\/td><\/tr><tr><td>R\u00f6ntgenstrahlen<\/td><td>BGA\/QFN<\/td><td>verstecktes Lot<\/td><td>h\u00f6here Kosten<\/td><\/tr><tr><td>ICT<\/td><td>Massenproduktion<\/td><td>elektrische Pr\u00fcfungen<\/td><td>Halterung erforderlich<\/td><\/tr><tr><td>Fliegende Sonde<\/td><td>Prototyp<\/td><td>elektrische Pr\u00fcfung<\/td><td>Langsamer<\/td><\/tr><tr><td>Funktionspr\u00fcfung<\/td><td>endg\u00fcltige Validierung<\/td><td>Realbetrieb<\/td><td>benutzerdefinierte Einrichtung<\/td><\/tr><tr><td>Einbrennen<\/td><td>Zuverl\u00e4ssigkeit<\/td><td>Stresspr\u00fcfung<\/td><td>zeitaufwendig<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Wie man die richtige PCB-Testmethode w\u00e4hlt<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Die Pr\u00fcfstrategie h\u00e4ngt davon ab:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Produktkomplexit\u00e4t<\/li>\n\n\n\n<li>Produktionsvolumen<\/li>\n\n\n\n<li>Zuverl\u00e4ssigkeitsanforderung<\/li>\n\n\n\n<li>Haushalt<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Prototyp-Stadium<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Empfohlen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>fliegende Sonde<\/li>\n\n\n\n<li>AOI<\/li>\n\n\n\n<li>Funktionstest<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Mittelgro\u00dfe Produktion<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Empfohlen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>AOI<\/li>\n\n\n\n<li>ICT oder fliegende Sonde<\/li>\n\n\n\n<li>Funktionspr\u00fcfung<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Hochzuverl\u00e4ssige Produkte<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Empfohlen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>R\u00f6ntgenbild<\/li>\n\n\n\n<li>ICT<\/li>\n\n\n\n<li>Funktionspr\u00fcfung<\/li>\n\n\n\n<li>Einbrenntest<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Wie man die Testbarkeit von PCBs verbessert<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Gute Tests beginnen bereits in der Entwurfsphase.<\/p>\n\n\n\n<div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\"><\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1779721120178\"><strong class=\"schema-how-to-step-name\">1. Testpunkte hinzuf\u00fcgen<\/strong> <p class=\"schema-how-to-step-text\">Ohne Zugangspunkte:<br\/>. IKT wird schwierig<br\/>. die Fehlersuche verlangsamt sich<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1779721136248\"><strong class=\"schema-how-to-step-name\">2. Abstand der Komponenten ber\u00fccksichtigen<\/strong> <p class=\"schema-how-to-step-text\">Zu dichte Layouts verringern die Zug\u00e4nglichkeit der Sonden.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1779721141218\"><strong class=\"schema-how-to-step-name\">3. Entwurf f\u00fcr DFM und DFA<\/strong> <p class=\"schema-how-to-step-text\">Die Herstellbarkeit beeinflusst den Testerfolg.<br\/>Weiterf\u00fchrende Lekt\u00fcre:<br\/><strong>Hochgeschwindigkeits-PCB-Design f\u00fcr Fertigung und Ausbeute<\/strong><br\/><strong>PCB Design Review Checkliste<\/strong><\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1779721150670\"><strong class=\"schema-how-to-step-name\">4. Tests fr\u00fchzeitig planen<\/strong> <p class=\"schema-how-to-step-text\">Tests sollten nicht am Ende hinzugef\u00fcgt werden.<br\/>F\u00fcgen Sie es w\u00e4hrend der Veranstaltung ein:<br\/>. schematische Phase<br\/>. Layout-Planung<br\/>. Montage\u00fcberpr\u00fcfung<\/p> <\/li><\/ol><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">H\u00e4ufige Fehler bei der PCB-Pr\u00fcfung<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Typische Probleme aus der Produktion:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u00dcberspringen der Funktionspr\u00fcfung<\/li>\n\n\n\n<li>sich nur auf die Sichtpr\u00fcfung zu verlassen<\/li>\n\n\n\n<li>schlechter Zugang zu den Testpunkten<\/li>\n\n\n\n<li>kein R\u00f6ntgen f\u00fcr BGA-Baugruppen<\/li>\n\n\n\n<li>zu sp\u00e4t in das Projekt eingef\u00fcgte Tests<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"450\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/flying.jpg\" alt=\"\" class=\"wp-image-570\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/flying.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/flying-300x225.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/04\/flying-16x12.jpg 16w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Praktische Hinweise aus der realen Produktion<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Was normalerweise in der Praxis passiert:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Bei Prototypen wird h\u00e4ufig eine fliegende Sonde verwendet und die Fehlersuche erfolgt manuell.<\/li>\n\n\n\n<li>Massenproduktion verlagert sich aus Geschwindigkeitsgr\u00fcnden auf IKT<\/li>\n\n\n\n<li>BGA-Baugruppen erfordern fast immer eine R\u00f6ntgenpr\u00fcfung<\/li>\n\n\n\n<li>Funktionstests decken Probleme auf, die elektrische Tests \u00fcbersehen<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Kein einziger Test kann alles erfassen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Die beste Strategie kombiniert mehrere Methoden.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Schlussfolgerung<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Die Pr\u00fcfung von Leiterplatten ist f\u00fcr die Gew\u00e4hrleistung von Qualit\u00e4t, Zuverl\u00e4ssigkeit und Fertigungskonsistenz von entscheidender Bedeutung.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Verschiedene Methoden dienen unterschiedlichen Zwecken: AOI f\u00fcr visuelle Defekte, ICT und Flying Probe f\u00fcr die elektrische \u00dcberpr\u00fcfung, R\u00f6ntgen f\u00fcr versteckte L\u00f6tstellen und Funktionstests f\u00fcr die reale Leistung.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Die Wahl der richtigen Kombination von Pr\u00fcfmethoden h\u00e4ngt von der Produktkomplexit\u00e4t, dem Produktionsvolumen und den Zuverl\u00e4ssigkeitsanforderungen ab.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>","protected":false},"excerpt":{"rendered":"<p>Die Pr\u00fcfung von Leiterplatten ist unerl\u00e4sslich, um die Qualit\u00e4t, Zuverl\u00e4ssigkeit und Konsistenz der Fertigung zu gew\u00e4hrleisten. In verschiedenen Phasen der Produktion werden unterschiedliche Pr\u00fcfverfahren eingesetzt, von der Sichtpr\u00fcfung bis hin zur elektrischen und funktionalen \u00dcberpr\u00fcfung. In diesem Artikel werden die g\u00e4ngigen Pr\u00fcfverfahren f\u00fcr Leiterplatten und deren Einsatzm\u00f6glichkeiten erl\u00e4utert.<\/p>","protected":false},"author":1,"featured_media":661,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[4],"tags":[60],"class_list":["post-736","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-testing"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Testing Methods Explained: AOI, ICT, Flying Probe, X-Ray &amp; Functional Testing<\/title>\n<meta name=\"description\" content=\"Learn common PCB testing methods including AOI, ICT, flying probe, X-ray inspection, and functional testing to improve PCB quality and reliability.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/pcb-testing-methods-quality-control\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"PCB Testing Methods Explained: AOI, ICT, Flying Probe, X-Ray &amp; 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