{"id":742,"date":"2026-05-29T08:19:00","date_gmt":"2026-05-29T00:19:00","guid":{"rendered":"https:\/\/www.han-sphere.com\/?p=742"},"modified":"2026-05-27T23:37:32","modified_gmt":"2026-05-27T15:37:32","slug":"pcb-x-ray-inspection-bga-solder-joints","status":"publish","type":"post","link":"https:\/\/www.han-sphere.com\/de\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/","title":{"rendered":"PCB-R\u00f6ntgeninspektion f\u00fcr BGA und verdeckte L\u00f6tstellen"},"content":{"rendered":"<p class=\"wp-block-paragraph\">Ein Brett kann die AOI bestehen und trotzdem durchfallen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Das passiert \u00f6fter, als man denkt.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Der Grund daf\u00fcr ist einfach:<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">Kameras sehen nur, was sichtbar ist.<\/p>\n<\/blockquote>\n\n\n\n<p class=\"wp-block-paragraph\">Sobald sich die L\u00f6tstellen unter den Bauteilen bewegen, wird die optische Pr\u00fcfung eingeschr\u00e4nkt.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Das ist der Ort, an dem <strong>R\u00f6ntgeninspektion<\/strong> kommt herein.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">F\u00fcr Baugruppen mit:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>BGA<\/li>\n\n\n\n<li>QFN<\/li>\n\n\n\n<li>LGA<\/li>\n\n\n\n<li>verdeckte L\u00f6tpads<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Die R\u00f6ntgeninspektion ist oft die einzige praktikable Methode zur \u00dcberpr\u00fcfung der L\u00f6tqualit\u00e4t.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"423\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1.jpg\" alt=\"R\u00f6ntgenbild\" class=\"wp-image-743\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-300x212.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Was ist eine PCB-R\u00f6ntgeninspektion?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Bei der R\u00f6ntgeninspektion werden R\u00f6ntgenstrahlen eingesetzt, um das Innere von Leiterplatten zu untersuchen, ohne die Leiterplatte zu besch\u00e4digen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Anstelle von Oberfl\u00e4chenbildern zeigt es:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>L\u00f6tstellenqualit\u00e4t<\/li>\n\n\n\n<li>interne Verbindungen<\/li>\n\n\n\n<li>versteckte M\u00e4ngel<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Das Ergebnis ist ein Graustufenbild, auf dem die L\u00f6tdichte sichtbar wird.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Dadurch k\u00f6nnen Bereiche inspiziert werden, die f\u00fcr die AOI nicht zug\u00e4nglich sind.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Weiterf\u00fchrende Lekt\u00fcre: <strong><a href=\"https:\/\/www.han-sphere.com\/blog\/news\/aoi-inspection-pcb-assembly\/\">AOI-Inspektion bei der PCB-Best\u00fcckung: Was kann sie erkennen?<\/a><\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Warum R\u00f6ntgeninspektion wichtig ist<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Moderne PCB-Baugruppen werden immer mehr:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>kleiner<\/li>\n\n\n\n<li>dichter<\/li>\n\n\n\n<li>komplexer<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Bei vielen Geh\u00e4usen sind die L\u00f6tstellen jetzt unter dem Bauteilk\u00f6rper verborgen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Ohne R\u00f6ntgenstrahlen:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>L\u00f6tbr\u00fccken k\u00f6nnen unbemerkt bleiben<\/li>\n\n\n\n<li>Leerstellen bleiben unsichtbar<\/li>\n\n\n\n<li>Er\u00f6ffnungen und Leerverk\u00e4ufe sind schwieriger zu erkennen<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Bei Produkten mit hoher Zuverl\u00e4ssigkeit kann das Auslassen von R\u00f6ntgenaufnahmen das Ausfallrisiko im Feld erh\u00f6hen.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Komponenten, die in der Regel eine R\u00f6ntgeninspektion erfordern<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">BGA (Ball Grid Array)<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Der h\u00e4ufigste Anwendungsfall.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Denn die L\u00f6tkugeln sitzen unter dem Geh\u00e4use:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>die optische Inspektion kann sie nicht erkennen<\/li>\n\n\n\n<li>elektrische Pr\u00fcfungen allein k\u00f6nnen marginale Verbindungen \u00fcbersehen<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Das R\u00f6ntgenbild verifiziert:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kugelausrichtung<\/li>\n\n\n\n<li>Lotkonsistenz<\/li>\n\n\n\n<li>\u00dcberbr\u00fcckung<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">QFN (Quad Flat No-Lead)<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">QFN-Geh\u00e4use enthalten oft verdeckte mittlere Pads.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">H\u00e4ufige Probleme:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>schlechte Benetzung<\/li>\n\n\n\n<li>unzureichendes L\u00f6tzinn<\/li>\n\n\n\n<li>ung\u00fcltig<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">LGA-Pakete<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Land Grid Array-Ger\u00e4te profitieren ebenfalls von der R\u00f6ntgenpr\u00fcfung.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Besonders in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>RF-Systeme<\/li>\n\n\n\n<li>Automobilelektronik<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Dichte SMT-Baugruppen<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Ein dichtes Layout kann die Sicht versperren, selbst f\u00fcr sichtbare Leitungen.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"441\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-1.jpg\" alt=\"R\u00f6ntgenbild\" class=\"wp-image-744\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-1.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-1-300x221.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-1-16x12.jpg 16w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">H\u00e4ufige Defekte, die mit R\u00f6ntgenstrahlen erkannt werden k\u00f6nnen<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">1. L\u00f6tporen<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Lunker sind eingeschlossene Lufteinschl\u00fcsse in L\u00f6tstellen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Kleine Hohlr\u00e4ume sind in der Regel akzeptabel.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u00dcberm\u00e4\u00dfiges Entleeren kann Auswirkungen haben:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>W\u00e4rmeleistung<\/li>\n\n\n\n<li>Zuverl\u00e4ssigkeit<\/li>\n\n\n\n<li>mechanische Festigkeit<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Besonders kritisch in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Leistungselektronik<\/li>\n\n\n\n<li>Thermopads<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">2. L\u00f6tbr\u00fccken<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Versteckte Kurzschl\u00fcsse zwischen den Pads.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Besonders h\u00e4ufig in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Fine-Pitch BGA<\/li>\n\n\n\n<li>dichte Routinggebiete<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">3. Offene L\u00f6tstellen<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Unvollst\u00e4ndige L\u00f6tverbindungen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Kann dazu f\u00fchren:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>intermittierende Ausf\u00e4lle<\/li>\n\n\n\n<li>instabiler Betrieb<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">4. Schieflage<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Die Bauteile k\u00f6nnen sich w\u00e4hrend des Reflow-Prozesses leicht verschieben.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Das R\u00f6ntgenbild zeigt, ob die L\u00f6tkugeln richtig ausgerichtet sind.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">5. Unzureichendes oder \u00fcberm\u00e4\u00dfiges L\u00f6tzinn<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Eine ungleichm\u00e4\u00dfige Lotverteilung wird auf R\u00f6ntgenbildern sichtbar.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">2D- vs. 3D-R\u00f6ntgeninspektion<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">2D-R\u00f6ntgenbild<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">H\u00e4ufigster Ansatz.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Vorteile:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>schneller<\/li>\n\n\n\n<li>niedrigere Kosten<\/li>\n\n\n\n<li>geeignet f\u00fcr Produktionsscreening<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">3D CT-R\u00f6ntgen (Computertomographie)<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Bietet Querschnittsbilder.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Vorteile:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Vertiefte Fehleranalyse<\/li>\n\n\n\n<li>Sichtbarkeit der internen Ebene<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Typischerweise verwendet f\u00fcr:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Fehleruntersuchung<\/li>\n\n\n\n<li>High-End-Anwendungen<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Verwandtes Thema: <strong><a href=\"https:\/\/www.han-sphere.com\/blog\/news\/high-speed-pcb-failure-analysis\/\">PCB-Fehleranalyse<\/a><\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">X-Ray vs. AOI (Schnellvergleich)<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Merkmal<\/th><th>AOI<\/th><th>R\u00f6ntgenstrahlen<\/th><\/tr><\/thead><tbody><tr><td>sichtbare L\u00f6tstellen<\/td><td>ausgezeichnet<\/td><td>gut<\/td><\/tr><tr><td>verdeckte L\u00f6tstellen<\/td><td>arm<\/td><td>ausgezeichnet<\/td><\/tr><tr><td>BGA-Inspektion<\/td><td>begrenzt<\/td><td>stark<\/td><\/tr><tr><td>Geschwindigkeit<\/td><td>schneller<\/td><td>Langsamer<\/td><\/tr><tr><td>Kosten<\/td><td>unter<\/td><td>h\u00f6her<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">In der Praxis:<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">AOI und R\u00f6ntgenstrahlen erg\u00e4nzen sich gegenseitig.<\/p>\n<\/blockquote>\n\n\n\n<p class=\"wp-block-paragraph\">Sie sind keine Ersatzstoffe.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Wann ist eine R\u00f6ntgeninspektion erforderlich?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Nicht jeder Vorstand braucht sie.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Gew\u00f6hnlich empfohlen f\u00fcr<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>BGA-Baugruppen<\/li>\n\n\n\n<li>QFN-Geh\u00e4use<\/li>\n\n\n\n<li>Automobilelektronik<\/li>\n\n\n\n<li>Luftfahrtsysteme<\/li>\n\n\n\n<li>medizinische Ger\u00e4te<\/li>\n\n\n\n<li>SMT-Leiterplatten mit hoher Dichte<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Weniger kritisch f\u00fcr<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>einfache durchkontaktierte Platten<\/li>\n\n\n\n<li>Konsumg\u00fcter mit geringer Dichte<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"432\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-2.jpg\" alt=\"R\u00f6ntgenbild\" class=\"wp-image-745\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-2.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-2-300x216.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">So verbessern Sie die Ergebnisse von R\u00f6ntgeninspektionen<\/h2>\n\n\n\n<div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\"><\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1779895507584\"><strong class=\"schema-how-to-step-name\">1. Design f\u00fcr Herstellbarkeit (DFM)<\/strong> <p class=\"schema-how-to-step-text\">Ein gutes Pad-Design verbessert die Konsistenz des Lots.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1779895540608\"><strong class=\"schema-how-to-step-name\">2. Optimierung des Schablonendesigns<\/strong> <p class=\"schema-how-to-step-text\">Ein angemessenes Lotpastenvolumen reduziert Defekte.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1779895548746\"><strong class=\"schema-how-to-step-name\">3. Kontrolle des Reflow-Profils<\/strong> <p class=\"schema-how-to-step-text\">Das Temperaturprofil wirkt sich stark auf die L\u00f6tqualit\u00e4t aus.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1779895558126\"><strong class=\"schema-how-to-step-name\">4. R\u00f6ntgenstrahlen fr\u00fch im NPI verwenden<\/strong> <p class=\"schema-how-to-step-text\">Bei der Einf\u00fchrung neuer Produkte:<br\/>. die Prozessstabilit\u00e4t zu \u00fcberpr\u00fcfen<br\/>. versteckte M\u00e4ngel fr\u00fchzeitig erkennen<\/p> <\/li><\/ol><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">H\u00e4ufige Fehler bei der R\u00f6ntgeninspektion<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Typische Produktionsprobleme:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Ausschlie\u00dflich AOI f\u00fcr BGAs<\/li>\n\n\n\n<li>Nichtber\u00fccksichtigung von L\u00f6tporenanteilen<\/li>\n\n\n\n<li>Auslassen von R\u00f6ntgenaufnahmen w\u00e4hrend der NPI<\/li>\n\n\n\n<li>Verwendung unzureichender Standards f\u00fcr die Bildauswertung<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">R\u00f6ntgen funktioniert nur, wenn die Pr\u00fcfkriterien einheitlich sind.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Praktische Hinweise aus der realen Produktion<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Was oft in Fabriken passiert:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>BGA-Br\u00fccken werden normalerweise mit R\u00f6ntgenstrahlen gefunden, nicht mit AOI<\/li>\n\n\n\n<li>viele intermittierende Ausf\u00e4lle lassen sich auf versteckte L\u00f6tprobleme zur\u00fcckf\u00fchren<\/li>\n\n\n\n<li>Entl\u00fcftung wird zu einem gro\u00dfen Problem in der Leistungselektronik<\/li>\n\n\n\n<li>R\u00f6ntgenaufnahmen sind in der Fr\u00fchphase der Produktion besonders wertvoll.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Bei ausgereiften Produkten wird h\u00e4ufig eine Stichprobenkontrolle anstelle der 100%-Kontrolle durchgef\u00fchrt.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Schlussfolgerung<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Die R\u00f6ntgeninspektion von Leiterplatten spielt eine entscheidende Rolle bei der \u00dcberpr\u00fcfung verdeckter L\u00f6tstellen und der Sicherstellung der Montagequalit\u00e4t.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Bei BGA-, QFN- und High-Density-PCB-Baugruppen hilft es, Defekte zu erkennen, die die optische Inspektion nicht erfassen kann. Dies ist zwar mit zus\u00e4tzlichen Kosten verbunden, verringert aber das Risiko versteckter Fehler bei Produkten mit hoher Zuverl\u00e4ssigkeit erheblich.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">FAQ<\/h2>\n\n\n\n<div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1779895627241\"><strong class=\"schema-faq-question\">F: Warum wird bei der Leiterplattenbest\u00fcckung eine R\u00f6ntgenpr\u00fcfung ben\u00f6tigt?<\/strong> <p class=\"schema-faq-answer\">A: Weil viele L\u00f6tstellen unter den Bauteilen verborgen sind und nicht visuell \u00fcberpr\u00fcft werden k\u00f6nnen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1779895637465\"><strong class=\"schema-faq-question\">F: Kann die AOI die R\u00f6ntgenpr\u00fcfung ersetzen?<\/strong> <p class=\"schema-faq-answer\">A: Nein. AOI kann keine verdeckten L\u00f6tstellen wie BGA-Kugeln pr\u00fcfen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1779895649528\"><strong class=\"schema-faq-question\">F: Welche Fehler kann die R\u00f6ntgeninspektion von Leiterplatten aufdecken?<\/strong> <p class=\"schema-faq-answer\">A: L\u00fccken, L\u00f6tbr\u00fccken, offene Stellen, Ausrichtungsfehler und Probleme bei der Lotverteilung.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1779895664380\"><strong class=\"schema-faq-question\">F: Ist eine R\u00f6ntgeninspektion f\u00fcr alle PCBs erforderlich?<\/strong> <p class=\"schema-faq-answer\">A: Nein. Es wird haupts\u00e4chlich f\u00fcr komplexe SMT-Baugruppen und verdeckte L\u00f6tpakete verwendet.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1779895677199\"><strong class=\"schema-faq-question\">F: Was ist der Unterschied zwischen 2D- und 3D-R\u00f6ntgenaufnahmen?<\/strong> <p class=\"schema-faq-answer\">A: 2D ist schneller und f\u00fcr die Produktion \u00fcblich, w\u00e4hrend 3D-CT eine tiefere interne Analyse erm\u00f6glicht.<\/p> <\/div> <\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>","protected":false},"excerpt":{"rendered":"<p>Die R\u00f6ntgeninspektion von Leiterplatten wird h\u00e4ufig eingesetzt, um versteckte L\u00f6tstellenfehler aufzusp\u00fcren, die mit der optischen Inspektion nicht zu erkennen sind. Sie ist besonders wichtig f\u00fcr BGA-, QFN- und High-Density-PCB-Baugruppen. Dieser Artikel erkl\u00e4rt, wie die R\u00f6ntgeninspektion funktioniert, welche Defekte sie aufdeckt und wann sie notwendig ist.<\/p>","protected":false},"author":1,"featured_media":746,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[4],"tags":[63,62],"class_list":["post-742","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-bga","tag-x-ray"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB X-Ray Inspection for BGA and Hidden Solder Joints<\/title>\n<meta name=\"description\" content=\"how PCB X-ray inspection works for BGA, QFN, and hidden solder joints, including common defects detected and quality control benefits.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"PCB X-Ray Inspection for BGA and Hidden Solder Joints\" \/>\n<meta property=\"og:description\" content=\"how PCB X-ray inspection works for BGA, QFN, and hidden solder joints, including common defects detected and quality control benefits.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.han-sphere.com\/de\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/\" \/>\n<meta property=\"og:site_name\" content=\"hansphere\" \/>\n<meta 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class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":[\"WebPage\",\"FAQPage\"],\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/\",\"name\":\"PCB X-Ray Inspection for BGA and Hidden Solder Joints\",\"isPartOf\":{\"@id\":\"https:\/\/www.han-sphere.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-3.jpg\",\"datePublished\":\"2026-05-29T00:19:00+00:00\",\"author\":{\"@id\":\"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422\"},\"description\":\"how PCB X-ray inspection works for BGA, QFN, and hidden solder joints, including common defects detected and quality control benefits.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#breadcrumb\"},\"mainEntity\":[{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895627241\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895637465\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895649528\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895664380\"},{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895677199\"}],\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"de\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#primaryimage\",\"url\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-3.jpg\",\"contentUrl\":\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-3.jpg\",\"width\":600,\"height\":441,\"caption\":\"X-ray\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.han-sphere.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"PCB X-Ray Inspection for BGA and Hidden Solder Joints\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.han-sphere.com\/#website\",\"url\":\"https:\/\/www.han-sphere.com\/\",\"name\":\"hansphere\",\"description\":\"\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.han-sphere.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"de\"},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422\",\"name\":\"hansphere01\",\"sameAs\":[\"http:\/\/www.han-sphere.com\/\"],\"url\":\"https:\/\/www.han-sphere.com\/de\/author\/hansphere01\/\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895627241\",\"position\":1,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895627241\",\"name\":\"Q: Why is X-ray inspection needed in PCB assembly?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Because many solder joints are hidden underneath components and cannot be inspected visually.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895637465\",\"position\":2,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895637465\",\"name\":\"Q: Can AOI replace X-ray inspection?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: No. AOI cannot inspect hidden solder joints like BGA balls.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895649528\",\"position\":3,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895649528\",\"name\":\"Q: What defects can PCB X-ray inspection detect?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Voids, solder bridges, opens, misalignment, and solder distribution problems.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895664380\",\"position\":4,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895664380\",\"name\":\"Q: Is X-ray inspection required for all PCBs?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: No. It is mainly used for complex SMT assemblies and hidden solder packages.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895677199\",\"position\":5,\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895677199\",\"name\":\"Q: What is the difference between 2D and 3D X-ray?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: 2D is faster and common for production, while 3D CT provides deeper internal analysis.\",\"inLanguage\":\"de\"},\"inLanguage\":\"de\"},{\"@type\":\"HowTo\",\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#howto-1\",\"name\":\"PCB X-Ray Inspection for BGA and Hidden Solder Joints\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/\"},\"description\":\"\",\"step\":[{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#how-to-step-1779895507584\",\"name\":\"1. Design for Manufacturability (DFM)\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Good pad design improves solder consistency.\"}]},{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#how-to-step-1779895540608\",\"name\":\"2. Optimize Stencil Design\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Proper solder paste volume reduces defects.\"}]},{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#how-to-step-1779895548746\",\"name\":\"3. Control Reflow Profile\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Temperature profile strongly affects solder quality.\"}]},{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#how-to-step-1779895558126\",\"name\":\"4. Use X-Ray Early in NPI\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"During new product introduction:<br\/>. verify process stability<br\/>. identify hidden defects early\"}]}],\"inLanguage\":\"de\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"PCB-R\u00f6ntgeninspektion f\u00fcr BGA und verdeckte L\u00f6tstellen","description":"wie die R\u00f6ntgeninspektion von Leiterplatten f\u00fcr BGA-, QFN- und verdeckte L\u00f6tstellen funktioniert, einschlie\u00dflich der h\u00e4ufigsten erkannten Fehler und der Vorteile f\u00fcr die Qualit\u00e4tskontrolle.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.han-sphere.com\/de\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/","og_locale":"de_DE","og_type":"article","og_title":"PCB X-Ray Inspection for BGA and Hidden Solder Joints","og_description":"how PCB X-ray inspection works for BGA, QFN, and hidden solder joints, including common defects detected and quality control benefits.","og_url":"https:\/\/www.han-sphere.com\/de\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/","og_site_name":"hansphere","article_published_time":"2026-05-29T00:19:00+00:00","og_image":[{"width":600,"height":441,"url":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-3.jpg","type":"image\/jpeg"}],"author":"hansphere01","twitter_card":"summary_large_image","twitter_misc":{"Verfasst von":"hansphere01","Gesch\u00e4tzte Lesezeit":"5\u00a0Minuten"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":["WebPage","FAQPage"],"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/","name":"PCB-R\u00f6ntgeninspektion f\u00fcr BGA und verdeckte L\u00f6tstellen","isPartOf":{"@id":"https:\/\/www.han-sphere.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#primaryimage"},"image":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#primaryimage"},"thumbnailUrl":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-3.jpg","datePublished":"2026-05-29T00:19:00+00:00","author":{"@id":"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422"},"description":"wie die R\u00f6ntgeninspektion von Leiterplatten f\u00fcr BGA-, QFN- und verdeckte L\u00f6tstellen funktioniert, einschlie\u00dflich der h\u00e4ufigsten erkannten Fehler und der Vorteile f\u00fcr die Qualit\u00e4tskontrolle.","breadcrumb":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#breadcrumb"},"mainEntity":[{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895627241"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895637465"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895649528"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895664380"},{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895677199"}],"inLanguage":"de","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/"]}]},{"@type":"ImageObject","inLanguage":"de","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#primaryimage","url":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-3.jpg","contentUrl":"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-3.jpg","width":600,"height":441,"caption":"X-ray"},{"@type":"BreadcrumbList","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.han-sphere.com\/"},{"@type":"ListItem","position":2,"name":"PCB X-Ray Inspection for BGA and Hidden Solder Joints"}]},{"@type":"WebSite","@id":"https:\/\/www.han-sphere.com\/#website","url":"https:\/\/www.han-sphere.com\/","name":"hansphere","description":"","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.han-sphere.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"de"},{"@type":"Person","@id":"https:\/\/www.han-sphere.com\/#\/schema\/person\/a8f2356806898d33a9f431801140e422","name":"hansphere01","sameAs":["http:\/\/www.han-sphere.com\/"],"url":"https:\/\/www.han-sphere.com\/de\/author\/hansphere01\/"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895627241","position":1,"url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895627241","name":"F: Warum wird bei der Leiterplattenbest\u00fcckung eine R\u00f6ntgenpr\u00fcfung ben\u00f6tigt?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Because many solder joints are hidden underneath components and cannot be inspected visually.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895637465","position":2,"url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895637465","name":"F: Kann die AOI die R\u00f6ntgenpr\u00fcfung ersetzen?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: No. AOI cannot inspect hidden solder joints like BGA balls.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895649528","position":3,"url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895649528","name":"F: Welche Fehler kann die R\u00f6ntgeninspektion von Leiterplatten aufdecken?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Voids, solder bridges, opens, misalignment, and solder distribution problems.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895664380","position":4,"url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895664380","name":"F: Ist eine R\u00f6ntgeninspektion f\u00fcr alle PCBs erforderlich?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: No. It is mainly used for complex SMT assemblies and hidden solder packages.","inLanguage":"de"},"inLanguage":"de"},{"@type":"Question","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895677199","position":5,"url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#faq-question-1779895677199","name":"F: Was ist der Unterschied zwischen 2D- und 3D-R\u00f6ntgenaufnahmen?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: 2D is faster and common for production, while 3D CT provides deeper internal analysis.","inLanguage":"de"},"inLanguage":"de"},{"@type":"HowTo","@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#howto-1","name":"PCB-R\u00f6ntgeninspektion f\u00fcr BGA und verdeckte L\u00f6tstellen","mainEntityOfPage":{"@id":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/"},"description":"","step":[{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#how-to-step-1779895507584","name":"1. Design for Manufacturability (DFM)","itemListElement":[{"@type":"HowToDirection","text":"Good pad design improves solder consistency."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#how-to-step-1779895540608","name":"2. Optimize Stencil Design","itemListElement":[{"@type":"HowToDirection","text":"Proper solder paste volume reduces defects."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#how-to-step-1779895548746","name":"3. Control Reflow Profile","itemListElement":[{"@type":"HowToDirection","text":"Temperature profile strongly affects solder quality."}]},{"@type":"HowToStep","url":"https:\/\/www.han-sphere.com\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/#how-to-step-1779895558126","name":"4. Use X-Ray Early in NPI","itemListElement":[{"@type":"HowToDirection","text":"During new product introduction:<br\/>. verify process stability<br\/>. identify hidden defects early"}]}],"inLanguage":"de"}]}},"_links":{"self":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/742","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/comments?post=742"}],"version-history":[{"count":1,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/742\/revisions"}],"predecessor-version":[{"id":747,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/posts\/742\/revisions\/747"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/media\/746"}],"wp:attachment":[{"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/media?parent=742"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/categories?post=742"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.han-sphere.com\/de\/wp-json\/wp\/v2\/tags?post=742"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}