{"id":742,"date":"2026-05-29T08:19:00","date_gmt":"2026-05-29T00:19:00","guid":{"rendered":"https:\/\/www.han-sphere.com\/?p=742"},"modified":"2026-05-27T23:37:32","modified_gmt":"2026-05-27T15:37:32","slug":"pcb-x-ray-inspection-bga-solder-joints","status":"publish","type":"post","link":"https:\/\/www.han-sphere.com\/ru\/blog\/news\/pcb-x-ray-inspection-bga-solder-joints\/","title":{"rendered":"\u0420\u0435\u043d\u0442\u0433\u0435\u043d\u043e\u0432\u0441\u043a\u0438\u0439 \u043a\u043e\u043d\u0442\u0440\u043e\u043b\u044c \u043f\u0435\u0447\u0430\u0442\u043d\u044b\u0445 \u043f\u043b\u0430\u0442 \u0434\u043b\u044f BGA \u0438 \u0441\u043a\u0440\u044b\u0442\u044b\u0445 \u043f\u0430\u044f\u043d\u044b\u0445 \u0441\u043e\u0435\u0434\u0438\u043d\u0435\u043d\u0438\u0439"},"content":{"rendered":"<p class=\"wp-block-paragraph\">A board can pass AOI and still fail.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">That happens more often than people expect.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The reason is simple:<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">cameras only see what is visible.<\/p>\n<\/blockquote>\n\n\n\n<p class=\"wp-block-paragraph\">Once solder joints move underneath components, optical inspection becomes limited.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">That\u2019s where <strong>\u0420\u0435\u043d\u0442\u0433\u0435\u043d\u043e\u0432\u0441\u043a\u0438\u0439 \u043a\u043e\u043d\u0442\u0440\u043e\u043b\u044c<\/strong> comes in.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For assemblies using:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>BGA<\/li>\n\n\n\n<li>QFN<\/li>\n\n\n\n<li>LGA<\/li>\n\n\n\n<li>hidden solder pads<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray inspection is often the only practical way to verify solder quality.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"423\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1.jpg\" alt=\"\u0420\u0435\u043d\u0442\u0433\u0435\u043d\" class=\"wp-image-743\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-300x212.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">What Is PCB X-Ray Inspection?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray inspection uses X-ray imaging to look inside PCB assemblies without damaging the board.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Instead of surface images, it shows:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>solder joint quality<\/li>\n\n\n\n<li>internal connections<\/li>\n\n\n\n<li>\u0441\u043a\u0440\u044b\u0442\u044b\u0435 \u0434\u0435\u0444\u0435\u043a\u0442\u044b<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">The result is a grayscale image where solder density becomes visible.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">This makes it possible to inspect areas that AOI cannot access.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u041f\u043e\u0445\u043e\u0436\u0438\u0435 \u0441\u0442\u0430\u0442\u044c\u0438: <strong><a href=\"https:\/\/www.han-sphere.com\/blog\/news\/aoi-inspection-pcb-assembly\/\">\u041a\u043e\u043d\u0442\u0440\u043e\u043b\u044c AOI \u043f\u0440\u0438 \u0441\u0431\u043e\u0440\u043a\u0435 \u043f\u0435\u0447\u0430\u0442\u043d\u044b\u0445 \u043f\u043b\u0430\u0442: \u0427\u0442\u043e \u043e\u043d \u043c\u043e\u0436\u0435\u0442 \u043e\u0431\u043d\u0430\u0440\u0443\u0436\u0438\u0442\u044c?<\/a><\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Why X-Ray Inspection Is Important<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Modern PCB assemblies continue to become:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>smaller<\/li>\n\n\n\n<li>denser<\/li>\n\n\n\n<li>more complex<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Many packages now hide solder joints underneath the component body.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Without X-ray:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>solder bridges may go unnoticed<\/li>\n\n\n\n<li>voids remain invisible<\/li>\n\n\n\n<li>opens and shorts become harder to identify<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">For high-reliability products, skipping X-ray can increase field failure risk.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Components That Usually Require X-Ray Inspection<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">BGA (Ball Grid Array)<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">The most common use case.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Because solder balls sit under the package:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>optical inspection cannot see them<\/li>\n\n\n\n<li>electrical testing alone may miss marginal joints<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray verifies:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>ball alignment<\/li>\n\n\n\n<li>solder consistency<\/li>\n\n\n\n<li>bridging<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">QFN (Quad Flat No-Lead)<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">QFN packages often include hidden center pads.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Common problems:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>poor wetting<\/li>\n\n\n\n<li>\u043d\u0435\u0434\u043e\u0441\u0442\u0430\u0442\u043e\u0447\u043d\u043e\u0435 \u043a\u043e\u043b\u0438\u0447\u0435\u0441\u0442\u0432\u043e \u043f\u0440\u0438\u043f\u043e\u044f<\/li>\n\n\n\n<li>voiding<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">LGA Packages<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Land Grid Array devices also benefit from X-ray verification.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Especially in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>RF systems<\/li>\n\n\n\n<li>\u0430\u0432\u0442\u043e\u043c\u043e\u0431\u0438\u043b\u044c\u043d\u0430\u044f \u044d\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u0438\u043a\u0430<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Dense SMT Assemblies<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">High-density layouts may block visual access, even for visible leads.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"441\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-1.jpg\" alt=\"\u0420\u0435\u043d\u0442\u0433\u0435\u043d\" class=\"wp-image-744\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-1.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-1-300x221.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-1-1-16x12.jpg 16w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Common Defects X-Ray Can Detect<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">1. Solder Voids<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Voids are trapped air pockets inside solder joints.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Small voids are usually acceptable.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Excessive voiding can affect:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u0442\u0435\u043f\u043b\u043e\u0432\u044b\u0435 \u0445\u0430\u0440\u0430\u043a\u0442\u0435\u0440\u0438\u0441\u0442\u0438\u043a\u0438<\/li>\n\n\n\n<li>\u043d\u0430\u0434\u0435\u0436\u043d\u043e\u0441\u0442\u044c<\/li>\n\n\n\n<li>mechanical strength<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Especially critical in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u0441\u0438\u043b\u043e\u0432\u0430\u044f \u044d\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u0438\u043a\u0430<\/li>\n\n\n\n<li>thermal pads<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">2. Solder Bridges<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Hidden short circuits between pads.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Particularly common in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>fine-pitch BGA<\/li>\n\n\n\n<li>dense routing areas<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">3. Open Solder Joints<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Incomplete solder connections.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Can result in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u043f\u0435\u0440\u0438\u043e\u0434\u0438\u0447\u0435\u0441\u043a\u0438\u0435 \u0441\u0431\u043e\u0438<\/li>\n\n\n\n<li>unstable operation<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">4. Misalignment<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Components may shift slightly during reflow.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray shows whether solder balls align properly.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">5. Insufficient or Excessive Solder<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Uneven solder distribution becomes visible in X-ray images.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">2D vs 3D X-Ray Inspection<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">2D X-Ray<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Most common approach.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u041f\u0440\u0435\u0438\u043c\u0443\u0449\u0435\u0441\u0442\u0432\u0430:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>faster<\/li>\n\n\n\n<li>lower cost<\/li>\n\n\n\n<li>suitable for production screening<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">3D CT X-Ray (Computed Tomography)<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Provides cross-sectional imaging.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u041f\u0440\u0435\u0438\u043c\u0443\u0449\u0435\u0441\u0442\u0432\u0430:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>deeper failure analysis<\/li>\n\n\n\n<li>internal layer visibility<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Typically used for:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>failure investigation<\/li>\n\n\n\n<li>high-end applications<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">\u041f\u043e\u0445\u043e\u0436\u0438\u0435 \u0442\u0435\u043c\u044b: <strong><a href=\"https:\/\/www.han-sphere.com\/blog\/news\/high-speed-pcb-failure-analysis\/\">PCB Failure Analysis<\/a><\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">X-Ray vs AOI (Quick Comparison)<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>\u0425\u0430\u0440\u0430\u043a\u0442\u0435\u0440\u0438\u0441\u0442\u0438\u043a\u0430<\/th><th>AOI<\/th><th>\u0420\u0435\u043d\u0442\u0433\u0435\u043d<\/th><\/tr><\/thead><tbody><tr><td>\u0432\u0438\u0434\u0438\u043c\u044b\u0435 \u043f\u0430\u044f\u043d\u044b\u0435 \u0441\u043e\u0435\u0434\u0438\u043d\u0435\u043d\u0438\u044f<\/td><td>\u043e\u0442\u043b\u0438\u0447\u043d\u044b\u0439<\/td><td>\u0445\u043e\u0440\u043e\u0448\u043e<\/td><\/tr><tr><td>\u0441\u043a\u0440\u044b\u0442\u044b\u0435 \u043f\u0430\u044f\u043d\u044b\u0435 \u0441\u043e\u0435\u0434\u0438\u043d\u0435\u043d\u0438\u044f<\/td><td>\u0431\u0435\u0434\u043d\u044b\u0439<\/td><td>\u043e\u0442\u043b\u0438\u0447\u043d\u044b\u0439<\/td><\/tr><tr><td>BGA inspection<\/td><td>\u043e\u0433\u0440\u0430\u043d\u0438\u0447\u0435\u043d\u043d\u044b\u0439<\/td><td>\u0441\u0438\u043b\u044c\u043d\u044b\u0439<\/td><\/tr><tr><td>\u0441\u043a\u043e\u0440\u043e\u0441\u0442\u044c<\/td><td>faster<\/td><td>\u043c\u0435\u0434\u043b\u0435\u043d\u043d\u0435\u0435<\/td><\/tr><tr><td>\u0441\u0442\u043e\u0438\u043c\u043e\u0441\u0442\u044c<\/td><td>\u043d\u0438\u0436\u0435<\/td><td>\u0432\u044b\u0448\u0435<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">In practice:<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"wp-block-paragraph\">AOI and X-ray complement each other.<\/p>\n<\/blockquote>\n\n\n\n<p class=\"wp-block-paragraph\">They are not substitutes.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">When Is X-Ray Inspection Necessary?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Not every board needs it.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Usually Recommended For<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>BGA assemblies<\/li>\n\n\n\n<li>QFN packages<\/li>\n\n\n\n<li>\u0430\u0432\u0442\u043e\u043c\u043e\u0431\u0438\u043b\u044c\u043d\u0430\u044f \u044d\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u0438\u043a\u0430<\/li>\n\n\n\n<li>\u0430\u044d\u0440\u043e\u043a\u043e\u0441\u043c\u0438\u0447\u0435\u0441\u043a\u0438\u0435 \u0441\u0438\u0441\u0442\u0435\u043c\u044b<\/li>\n\n\n\n<li>\u043c\u0435\u0434\u0438\u0446\u0438\u043d\u0441\u043a\u0438\u0435 \u043f\u0440\u0438\u0431\u043e\u0440\u044b<\/li>\n\n\n\n<li>high-density SMT boards<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Less Critical For<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>simple through-hole boards<\/li>\n\n\n\n<li>low-density consumer products<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"432\" src=\"http:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-2.jpg\" alt=\"\u0420\u0435\u043d\u0442\u0433\u0435\u043d\" class=\"wp-image-745\" srcset=\"https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-2.jpg 600w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-2-300x216.jpg 300w, https:\/\/www.han-sphere.com\/wp-content\/uploads\/2026\/05\/X-ray-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">How to Improve X-Ray Inspection Results<\/h2>\n\n\n\n<div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\"><\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1779895507584\"><strong class=\"schema-how-to-step-name\">1. Design for Manufacturability (DFM)<\/strong> <p class=\"schema-how-to-step-text\">Good pad design improves solder consistency.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1779895540608\"><strong class=\"schema-how-to-step-name\">2. Optimize Stencil Design<\/strong> <p class=\"schema-how-to-step-text\">Proper solder paste volume reduces defects.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1779895548746\"><strong class=\"schema-how-to-step-name\">3. Control Reflow Profile<\/strong> <p class=\"schema-how-to-step-text\">Temperature profile strongly affects solder quality.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1779895558126\"><strong class=\"schema-how-to-step-name\">4. Use X-Ray Early in NPI<\/strong> <p class=\"schema-how-to-step-text\">During new product introduction:<br\/>. verify process stability<br\/>. identify hidden defects early<\/p> <\/li><\/ol><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Common X-Ray Inspection Mistakes<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Typical production problems:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>relying only on AOI for BGAs<\/li>\n\n\n\n<li>ignoring solder void percentages<\/li>\n\n\n\n<li>skipping X-ray during NPI<\/li>\n\n\n\n<li>using poor image interpretation standards<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray only works when inspection criteria are consistent.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">\u041f\u0440\u0430\u043a\u0442\u0438\u0447\u0435\u0441\u043a\u0438\u0435 \u0437\u0430\u043c\u0435\u0442\u043a\u0438 \u0441 \u0440\u0435\u0430\u043b\u044c\u043d\u043e\u0433\u043e \u043f\u0440\u043e\u0438\u0437\u0432\u043e\u0434\u0441\u0442\u0432\u0430<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">What often happens in factories:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>BGA bridges are usually found with X-ray, not AOI<\/li>\n\n\n\n<li>many intermittent failures trace back to hidden solder issues<\/li>\n\n\n\n<li>voiding becomes a major concern in power electronics<\/li>\n\n\n\n<li>X-ray is most valuable during early production builds<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">For mature products, sampling inspection is often used instead of 100% inspection.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">\u0417\u0430\u043a\u043b\u044e\u0447\u0435\u043d\u0438\u0435<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">PCB X-ray inspection plays a critical role in verifying hidden solder joints and ensuring assembly quality.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For BGA, QFN, and high-density PCB assemblies, it helps identify defects that optical inspection cannot detect. While it adds cost, it significantly reduces the risk of hidden failures in high-reliability products.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">\u0427\u0410\u0421\u0422\u041e \u0417\u0410\u0414\u0410\u0412\u0410\u0415\u041c\u042b\u0415 \u0412\u041e\u041f\u0420\u041e\u0421\u042b<\/h2>\n\n\n\n<div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1779895627241\"><strong class=\"schema-faq-question\">Q: Why is X-ray inspection needed in PCB assembly?<\/strong> <p class=\"schema-faq-answer\">A: Because many solder joints are hidden underneath components and cannot be inspected visually.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1779895637465\"><strong class=\"schema-faq-question\">Q: Can AOI replace X-ray inspection?<\/strong> <p class=\"schema-faq-answer\">A: No. AOI cannot inspect hidden solder joints like BGA balls.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1779895649528\"><strong class=\"schema-faq-question\">Q: What defects can PCB X-ray inspection detect?<\/strong> <p class=\"schema-faq-answer\">A: Voids, solder bridges, opens, misalignment, and solder distribution problems.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1779895664380\"><strong class=\"schema-faq-question\">Q: Is X-ray inspection required for all PCBs?<\/strong> <p class=\"schema-faq-answer\">A: No. It is mainly used for complex SMT assemblies and hidden solder packages.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1779895677199\"><strong class=\"schema-faq-question\">Q: What is the difference between 2D and 3D X-ray?<\/strong> <p class=\"schema-faq-answer\">A: 2D is faster and common for production, while 3D CT provides deeper internal analysis.<\/p> <\/div> <\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>","protected":false},"excerpt":{"rendered":"<p>\u0420\u0435\u043d\u0442\u0433\u0435\u043d\u043e\u0432\u0441\u043a\u0438\u0439 \u043a\u043e\u043d\u0442\u0440\u043e\u043b\u044c \u043f\u0435\u0447\u0430\u0442\u043d\u044b\u0445 \u043f\u043b\u0430\u0442 \u0448\u0438\u0440\u043e\u043a\u043e \u0438\u0441\u043f\u043e\u043b\u044c\u0437\u0443\u0435\u0442\u0441\u044f \u0434\u043b\u044f \u043e\u0431\u043d\u0430\u0440\u0443\u0436\u0435\u043d\u0438\u044f \u0441\u043a\u0440\u044b\u0442\u044b\u0445 \u0434\u0435\u0444\u0435\u043a\u0442\u043e\u0432 \u043f\u0430\u044f\u043d\u044b\u0445 \u0441\u043e\u0435\u0434\u0438\u043d\u0435\u043d\u0438\u0439, \u043a\u043e\u0442\u043e\u0440\u044b\u0435 \u043d\u0435\u0432\u043e\u0437\u043c\u043e\u0436\u043d\u043e \u0443\u0432\u0438\u0434\u0435\u0442\u044c \u043f\u0440\u0438 \u043e\u043f\u0442\u0438\u0447\u0435\u0441\u043a\u043e\u043c \u043a\u043e\u043d\u0442\u0440\u043e\u043b\u0435. \u042d\u0442\u043e \u043e\u0441\u043e\u0431\u0435\u043d\u043d\u043e \u0432\u0430\u0436\u043d\u043e \u0434\u043b\u044f \u0441\u0431\u043e\u0440\u043e\u043a \u043f\u0435\u0447\u0430\u0442\u043d\u044b\u0445 \u043f\u043b\u0430\u0442 BGA, QFN \u0438 \u0432\u044b\u0441\u043e\u043a\u043e\u0439 \u043f\u043b\u043e\u0442\u043d\u043e\u0441\u0442\u0438. \u0412 \u044d\u0442\u043e\u0439 \u0441\u0442\u0430\u0442\u044c\u0435 \u043e\u0431\u044a\u044f\u0441\u043d\u044f\u0435\u0442\u0441\u044f, \u043a\u0430\u043a \u0440\u0430\u0431\u043e\u0442\u0430\u0435\u0442 \u0440\u0435\u043d\u0442\u0433\u0435\u043d\u043e\u0432\u0441\u043a\u0438\u0439 \u043a\u043e\u043d\u0442\u0440\u043e\u043b\u044c, \u043a\u0430\u043a\u0438\u0435 \u0434\u0435\u0444\u0435\u043a\u0442\u044b \u043e\u043d \u0432\u044b\u044f\u0432\u043b\u044f\u0435\u0442 \u0438 \u043a\u043e\u0433\u0434\u0430 \u043e\u043d \u0441\u0442\u0430\u043d\u043e\u0432\u0438\u0442\u0441\u044f \u043d\u0435\u043e\u0431\u0445\u043e\u0434\u0438\u043c\u044b\u043c.<\/p>","protected":false},"author":1,"featured_media":746,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[4],"tags":[63,62],"class_list":["post-742","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-bga","tag-x-ray"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB X-Ray Inspection for BGA and Hidden Solder Joints<\/title>\n<meta name=\"description\" content=\"how PCB X-ray inspection works for BGA, QFN, and 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Use X-Ray Early in NPI\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"During new product introduction:<br\/>. verify process stability<br\/>. identify hidden defects early\"}]}],\"inLanguage\":\"ru-RU\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"\u0420\u0435\u043d\u0442\u0433\u0435\u043d\u043e\u0432\u0441\u043a\u0438\u0439 \u043a\u043e\u043d\u0442\u0440\u043e\u043b\u044c \u043f\u0435\u0447\u0430\u0442\u043d\u044b\u0445 \u043f\u043b\u0430\u0442 \u0434\u043b\u044f BGA \u0438 \u0441\u043a\u0440\u044b\u0442\u044b\u0445 \u043f\u0430\u044f\u043d\u044b\u0445 \u0441\u043e\u0435\u0434\u0438\u043d\u0435\u043d\u0438\u0439","description":"how PCB X-ray inspection works for BGA, QFN, and hidden solder joints, including common defects detected and quality control 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