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The report indicates that the PCB market experienced moderate growth in 2025, with IC substrates standing out as the brightest spot due to AI demand. For 2026, industry growth is expected to accelerate, fueled by AI infrastructure and automotive electronics. Technology will evolve toward higher density, new materials, and intelligent manufacturing.
This guide addresses core PCB challenges: signal distortion (controlled via impedance and spacing), power noise (managed through layered design and decoupling), and EMC/thermal issues (solved via loop reduction and heat dissipation).