Schematic capture, layout and simulation from engineers who live in high-speed digital, RF and HDI design every day — every deliverable driven by manufacturability from the first draft.
From schematic to signed-off layout, our engineers cover every discipline modern boards demand. Hover to explore.
DDR4/DDR5 memory interfaces, PCIe Gen4/5 and SerDes routing with controlled length matching, impedance tuning and topology-aware layout.
Precision microstrip and stripline layout on low-loss laminates, with impedance-matched paths verified by EM simulation.
Power delivery network modeling, decoupling strategy and thermal-aware copper planning for stable, efficient power distribution.
Stacked and staggered microvia structures, via-in-pad design and fine-pitch BGA breakout for maximum density.
Stackup and grounding strategy, shielding layout and filtering placement engineered to meet global EMC/EMI standards.
Custom stackup design up to 32+ layers, balancing impedance control, manufacturability, cost and mechanical reliability.
Pre-layout and post-layout SI/PI simulation identifying reflection, crosstalk and resonance before fabrication.
Bend-radius-aware routing, dynamic flex zone planning and rigid-flex stackup design for compact, movement-tolerant assemblies.
Every design moves through five engineering-controlled stages, ensuring performance, reliability and manufacturability before it ever reaches the fab floor.
We start by deeply understanding your electrical, mechanical and performance requirements — reviewing specs, application context and constraints before a single trace is drawn.
Specs review · Application analysis · Feasibility checkAccurate circuit design with component selection, simulation and electrical validation, producing a clean, ERC-verified netlist ready for layout.
Component selection · ERC · Circuit simulationOptimized layout for signal integrity, power delivery and manufacturability — with high-speed routing, stackup planning and thermal management built in from the start.
High-speed routing · Power integrity · Stackup designComprehensive design rule, manufacturability and simulation checks ensure the board is production-ready before files are released — no surprises at the fab.
DRC · DFM · SI/PI simulationDelivery of complete, production-ready files and documentation — formatted exactly as your fab and assembly partners need them.
Gerber · BOM · Pick & PlaceWe work natively across all major EDA and simulation ecosystems — no format conversion, no lock-in.
We work natively across all major EDA ecosystems, so you're never locked into a single toolchain — deliverables integrate directly into your existing design flow.
Every high-speed and RF design is verified against full 3D EM and SI/PI simulation before layout is finalized — catching reflection, crosstalk and resonance issues early.
For antennas, filters and impedance-matched RF paths, we use dedicated microwave circuit and field simulation software to validate performance across the full frequency range.
Every design deliverable is verified against IPC-2221/2222 design rules and your target impedance profile. Full documentation ships with every completed design package.
| Parameter | Specification | Status |
|---|---|---|
| Layer Count | 2 – 32+ layers | Available |
| Min. Trace / Space (Designed) | 3 / 3 mil (0.075mm) | Available |
| Impedance Control Tolerance | ±10% standard · ±5% precision | Available |
| Board Thickness Range | 0.4mm – 6.0mm | Available |
| Max Panel / Board Size | Up to 500mm × 600mm | Available |
| Standard Turnaround | 5 – 7 working days | Available |
| Expedited Turnaround | 24 – 48 hours | Available |
| File Deliverables | Gerber RS-274X / ODB++ / BOM / Pick & Place / Assembly Drawing | Available |
Every design moves through structured, documented engineering checkpoints — from first schematic draft to final release package — ensuring accuracy, consistency and manufacturability at every stage.
Real PCB design engineering challenges — and how we solved them.
A 12-layer backplane supporting 25 Gbps SerDes lanes was suffering signal reflection at connector transitions. We re-engineered the stackup and via structure with full SI simulation.
Post-layout simulation confirmed clean eye diagrams across all lanes. Redesigned via backdrilling and stackup eliminated reflection-induced bit errors, passing signal compliance testing on first submission.
A 5G RF front-end module required precision-matched microstrip routing across multiple frequency bands on a compact multilayer Rogers substrate.
EM-simulation-verified microstrip geometry delivered consistent insertion loss across the full board population, with the module passing RF compliance testing without a single re-spin.
A continuous health-monitoring wearable needed a dramatic form-factor reduction without compromising reliability. We redesigned the layout around a microvia-in-pad HDI architecture.
The redesigned board reduced footprint by 40% while maintaining full electrical and mechanical reliability, enabling the client to move from prototype to production within a single design cycle.
PCB design isn't just layout — it's the engineering decisions that determine whether your product performs, ships on time and scales into production without costly respins.
Every schematic, layout and simulation is completed by our own senior engineers — not subcontracted overseas. You work with the same team from kickoff to release.
Every layout is checked against real fab process capability before release, catching issues that would otherwise surface as costly re-spins after tooling.
Because design and fabrication sit under one roof, manufacturability questions get answered in hours, not weeks — shortening your iteration cycle significantly.
Whether your team standardizes on Altium, Cadence, Mentor or KiCad, we integrate directly into your existing workflow — no format conversion headaches.
Common questions about PCB design pricing, project requirements and working with our engineering team.
PCB design cost depends on complexity, layer count and engineering requirements. Simple 2-4 layer boards may run a few hundred dollars, while high-speed, RF or HDI designs requiring full simulation and impedance control involve significantly more engineering effort — and are quoted accordingly.
Pricing is driven by layer count, board size, component density, impedance control requirements, RF/microwave content and the amount of simulation work needed (SI/PI, EM). Turnaround time also affects cost — expedited schedules carry a premium.
Yes. High-speed designs such as DDR4/5 memory interfaces, PCIe or SerDes links require signal integrity analysis, controlled-impedance routing and length-matching — all of which add engineering hours compared to a standard digital board.
Yes. Our engineers routinely optimize stackup, material selection and routing density to reduce layer count and manufacturing cost without compromising electrical performance — often identifying savings during the initial DFM review.
We typically quote on a project basis after reviewing your schematic and requirements, with flexible retainer options available for clients with ongoing or multi-board programs.
Please share your schematic (or a description of functional requirements if starting from scratch), target layer count, board size and any special requirements — high-speed interfaces, RF content, or specific EDA platform preferences.
We design boards from simple 2-layer circuits up to complex 32+ layer stackups, including HDI builds with multiple microvia stages. Layer count and stackup are selected together to hit your impedance, thermal and cost targets.
Yes. Every design package goes through a DFM review against real fabrication process capability before we release final files — checking trace/space, drill sizes, annular rings and copper balance so the board manufactures right the first time.
Our design engineering team will review your requirements and return a project scope and quote within 24 working hours.
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