From 5G base stations and optical transceivers to satellite communication and network infrastructure — high-frequency, high-reliability PCBs engineered for the demands of modern telecom.
Modern telecommunications infrastructure demands RF performance that standard PCB materials simply cannot deliver. We specialise in the boards that make it possible.
Hybrid Rogers 4350B / FR4 boards with cavity-milled patch apertures and TDR-verified impedance on 100+ antenna feed lines for massive MIMO array modules.
12- to 20-layer hybrid RF/digital multilayer boards combining RF-grade outer layers with FR4 cores for cost-optimised 28/39 GHz small cell and macro radio electronics.
Thermal-via-array and embedded-coin constructions dissipating hundreds of watts per board, keeping junction temperatures in spec on high-power 5G PA modules.
20- to 30-layer sequential lamination boards with back-drilled vias and ENEPIG press-fit finish, routing 112 Gbps PAM4 lanes for 400G/800G line cards.
16-layer Taconic TLY low-loss laminate boards with gold-plated RF connectors for LEO and GEO satellite transceiver modules qualified to thermal vacuum standards.
Controlled-impedance HDI boards on Rogers RO4003C with tight ±0.5 mil trace tolerance, supporting high-speed electrical-to-optical signal conversion in pluggable modules.
Sequential-lamination backplanes up to 30 layers with dozens of differential-pair structures, routed to eliminate crosstalk and modal resonance across the chassis.
Hybrid Rogers/FR4 multilayer boards with TDR/VNA-verified ±5% impedance, packing sub-6 GHz and mmWave radios into compact outdoor CPE enclosures.
At millimetre-wave frequencies, the PCB is no longer just a circuit carrier — it is an active part of the RF system. Material choice, trace geometry and fabrication tolerance directly affect signal performance.
At 28 GHz, 39 GHz and 77 GHz, dielectric loss in standard FR4 renders the board electrically invisible to the RF signal. Rogers, Taconic and PTFE-based laminates are mandatory. Trace width tolerance must be held to ±0.5 mil to maintain consistent impedance within ±5%.
Rogers 4350B / PTFE · ±0.5 mil trace tolerance · ±5% impedanceModern network switches and base station radio units require 20–30 layer boards with dozens of controlled impedance structures — differential pairs, coplanar waveguides and microstrip lines — all routed without crosstalk or modal resonance.
up to 30 layers · differential pairs · crosstalk control5G power amplifier boards dissipate hundreds of watts per board in compact form factors. Thermal vias, embedded coin cooling and back-side thermal pads must be designed and fabricated to tight tolerances to keep junction temperatures within spec.
thermal via arrays · coin embedding · back-side padHigh-frequency performance begins with material selection. We stock and process the full range of RF-grade laminates.
Rogers 4350B, RO4003C, Taconic TLY and PTFE laminates for sub-6 GHz through 77 GHz applications. ENIG finish for consistent insertion loss. Controlled cavity milling for waveguide integration. TDR and VNA verification available.
20 to 30 layer sequential lamination boards for data centre switches and 400G / 800G line cards. Controlled impedance on all signal layers, back-drill for via stub removal, ENEPIG finish for press-fit connector compatibility.
Hybrid stackups combining RF-grade laminates on outer layers with standard FR4 cores for digital processing — delivering RF performance where it matters without the cost of all-Rogers construction.
Every parameter below is verified against IATF 16949 and IPC-A-600 Class 3 requirements. Full test reports and material traceability ship with every order.
| Parameter | Automotive Grade | Status |
|---|---|---|
| Layer Count | 2 – 30 layers with sequential lamination | Available |
| Min. Trace / Space | 2.5 / 2.5 mil | Available |
| Controlled Impedance | ±5% tolerance, TDR / VNA verified | Available |
| RF Laminates | Rogers 4350B / RO4003C / Taconic / PTFE | Available |
| Max Operating Frequency | Up to 77 GHz | Available |
| Surface Finish | ENIG / ENEPIG / Immersion Ag | Available |
| Back-Drill Capability | Via stub removal for high-speed signals | Available |
| Cavity Milling | Waveguide integration and heat spreader pockets | Available |
| Lot Traceability | Full lot documentation, material CoC | Available |
Telecom customers require more than visual inspection — they need RF-grade process control. Our TDR and impedance verification on every board, combined with ENIG finish consistency, ensure your RF performance specification is met before shipment.
Real automotive PCB challenges — and how we solved them.
12-layer hybrid Rogers 4350B / FR4 board for a 64T64R 5G massive MIMO radio unit. TDR-verified impedance on 128 antenna feed lines, cavity-milled patch antenna apertures.
All 128 antenna feed lines within ±4.2% impedance specification. RF performance at system test exceeded simulation by +0.8 dB gain. On-time delivery for 3 consecutive production quarters.
28-layer backplane board for a data centre ToR switch. Back-drilled vias for stub removal, ENEPIG finish for press-fit connectors, 112 Gbps PAM4 trace routing.
99% first-pass electrical yield at production entry. Crosstalk performance 3 dB better than competitive alternative supplier. Now sole-sourced for this platform.
16-layer Taconic TLY board for a LEO satellite Ka/Ku-band transceiver. Low-loss laminate, gold-plated RF connectors, radiation-screening-compatible construction.
Insertion loss 0.9 dB/m at 18 GHz — within 0.1 dB of simulation. Board passed thermal vacuum and vibration qualification on first attempt.
Automotive procurement teams need more than a PCB factory — they need a certified partner with documented processes, fast engineering response and the depth to solve problems before the production line.
We hold Rogers, Taconic and PTFE laminates in stock and process them in-house. Our RF process engineers understand how material choice, trace width and via geometry affect your link budget.
Every controlled-impedance board is measured with our in-house TDR before shipment. If a board doesn't meet spec, it doesn't ship — no exceptions, no negotiations.
Up to 30 layers with sequential lamination, back-drill and blind/buried vias. The fabrication complexity your base station or data centre boards demand, handled in-house.
Our RF engineers review your stackup, trace geometry, via placement and antenna feeds within 8 hours — catching RF performance issues before they become expensive respins.
Our telecommunications PCB engineering team will review your design and return a full DFM report and quote within 8 working hours.
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