From 5G base stations and optical transceivers to satellite communication and network infrastructure — high-frequency, high-reliability PCBs engineered for the demands of modern telecom.
Modern telecommunications infrastructure demands RF performance that standard PCB materials simply cannot deliver. We specialise in the boards that make it possible.
High-frequency RF boards on Rogers laminates for 77 GHz forward collision, lane departure and autonomous driving sensor fusion.
Heavy copper BMS boards for cell monitoring, thermal management and charge control in hybrid and full-electric vehicles.
High-temperature multilayer boards for ECU and TCU operating near the engine bay from -40°C to +150°C.
HDI multilayer boards for in-vehicle displays, connectivity, navigation and digital cluster platforms.
IPC Class 3 boards for ABS, ESP, airbag control and active suspension — zero tolerance for in-field failure.
Standard multilayer PCBs for door locks, window controls, lighting automation and central body electronics.
Metal-core and aluminium PCBs for matrix LED headlights and adaptive lighting systems.
Robust multilayer PCBs for climate control, seat adjustment and ambient environment management.
At millimetre-wave frequencies, the PCB is no longer just a circuit carrier — it is an active part of the RF system. Material choice, trace geometry and fabrication tolerance directly affect signal performance.
At 28 GHz, 39 GHz and 77 GHz, dielectric loss in standard FR4 renders the board electrically invisible to the RF signal. Rogers, Taconic and PTFE-based laminates are mandatory. Trace width tolerance must be held to ±0.5 mil to maintain consistent impedance within ±5%.
Rogers 4350B / PTFE · ±0.5 mil trace tolerance · ±5% impedanceModern network switches and base station radio units require 20–30 layer boards with dozens of controlled impedance structures — differential pairs, coplanar waveguides and microstrip lines — all routed without crosstalk or modal resonance.
up to 30 layers · differential pairs · crosstalk control5G power amplifier boards dissipate hundreds of watts per board in compact form factors. Thermal vias, embedded coin cooling and back-side thermal pads must be designed and fabricated to tight tolerances to keep junction temperatures within spec.
thermal via arrays · coin embedding · back-side padHigh-frequency performance begins with material selection. We stock and process the full range of RF-grade laminates.
Rogers 4350B, RO4003C, Taconic TLY and PTFE laminates for sub-6 GHz through 77 GHz applications. ENIG finish for consistent insertion loss. Controlled cavity milling for waveguide integration. TDR and VNA verification available.
20 to 30 layer sequential lamination boards for data centre switches and 400G / 800G line cards. Controlled impedance on all signal layers, back-drill for via stub removal, ENEPIG finish for press-fit connector compatibility.
Hybrid stackups combining RF-grade laminates on outer layers with standard FR4 cores for digital processing — delivering RF performance where it matters without the cost of all-Rogers construction.
Every parameter below is verified against IATF 16949 and IPC-A-600 Class 3 requirements. Full test reports and material traceability ship with every order.
| Parameter | Automotive Grade | Status |
|---|---|---|
| Layer Count | 2 – 30 layers with sequential lamination | Available |
| Min. Trace / Space | 2.5 / 2.5 mil | Available |
| Controlled Impedance | ±5% tolerance, TDR / VNA verified | Available |
| RF Laminates | Rogers 4350B / RO4003C / Taconic / PTFE | Available |
| Max Operating Frequency | Up to 77 GHz | Available |
| Surface Finish | ENIG / ENEPIG / Immersion Ag | Available |
| Back-Drill Capability | Via stub removal for high-speed signals | Available |
| Cavity Milling | Waveguide integration and heat spreader pockets | Available |
| Lot Traceability | Full lot documentation, material CoC | Available |
Telecom customers require more than visual inspection — they need RF-grade process control. Our TDR and impedance verification on every board, combined with ENIG finish consistency, ensure your RF performance specification is met before shipment.
Real automotive PCB challenges — and how we solved them.
12-layer hybrid Rogers 4350B / FR4 board for a 64T64R 5G massive MIMO radio unit. TDR-verified impedance on 128 antenna feed lines, cavity-milled patch antenna apertures.
All 128 antenna feed lines within ±4.2% impedance specification. RF performance at system test exceeded simulation by +0.8 dB gain. On-time delivery for 3 consecutive production quarters.
28-layer backplane board for a data centre ToR switch. Back-drilled vias for stub removal, ENEPIG finish for press-fit connectors, 112 Gbps PAM4 trace routing.
99% first-pass electrical yield at production entry. Crosstalk performance 3 dB better than competitive alternative supplier. Now sole-sourced for this platform.
16-layer Taconic TLY board for a LEO satellite Ka/Ku-band transceiver. Low-loss laminate, gold-plated RF connectors, radiation-screening-compatible construction.
Insertion loss 0.9 dB/m at 18 GHz — within 0.1 dB of simulation. Board passed thermal vacuum and vibration qualification on first attempt.
Automotive procurement teams need more than a PCB factory — they need a certified partner with documented processes, fast engineering response and the depth to solve problems before the production line.
We hold Rogers, Taconic and PTFE laminates in stock and process them in-house. Our RF process engineers understand how material choice, trace width and via geometry affect your link budget.
Every controlled-impedance board is measured with our in-house TDR before shipment. If a board doesn't meet spec, it doesn't ship — no exceptions, no negotiations.
Up to 30 layers with sequential lamination, back-drill and blind/buried vias. The fabrication complexity your base station or data centre boards demand, handled in-house.
Our RF engineers review your stackup, trace geometry, via placement and antenna feeds within 8 hours — catching RF performance issues before they become expensive respins.
Our telecommunications PCB engineering team will review your design and return a full DFM report and quote within 8 working hours.
Fill in the details below and we'll get back to you shortly.