From double-sided FR4 prototypes to 32-layer HDI, rigid-flex hybrids and ceramic power modules — one fabrication partner engineers, builds and tests every board technology your product needs. Nine dedicated manufacturing processes, a single ISO 9001 / IATF 16949 quality system, and one point of contact from first Gerber upload to final shipment.
The three fabrication processes that cover the majority of production programs — from everyday multilayer boards to the densest BGA-packed designs.
The foundation board technology for the majority of electronic products — from 2-layer prototypes to 32-layer high-speed server boards, built to IPC Class 2/3 workmanship.
Explore Rigid PCB →Stacked microvias and 2.5/2.5mil trace/space enable 0.35mm BGA fan-out and maximum routing density on boards up to 30 layers — for today's most advanced products.
Explore HDI PCB →Polyimide flex circuits with rolled-annealed copper, rated for millions of dynamic bend cycles — the go-to technology for wearables, cameras and folding assemblies.
Explore Flex PCB →Click any board type to see full specifications, materials and when it's the right fit for your application.
2–32 layers on FR4, High-Tg or Rogers laminate, built to IPC Class 2/3 — the foundation board for most electronic products.
View capabilityAny-layer HDI with stacked laser microvias to 0.10mm and 2.5/2.5mil trace/space, supporting 0.35mm BGA fan-out.
View capabilitySame-day 2-layer through 72-hour 16-layer builds, expedited CAM review and no minimum order quantity.
View capabilityPolyimide flex circuits with rolled-annealed copper, rated for millions of dynamic bend cycles at a 0.5mm bend radius.
View capabilityRigid and flex sections combined in a single board up to 20 layers, eliminating connectors and enabling true 3D packaging.
View capabilityAlumina and aluminium nitride substrates up to 170 W/m·K, stable from -55°C to +350°C, zero CTE mismatch with SiC/GaN.
View capabilityRogers, Taconic and PTFE laminates processed in-house for RF/microwave designs up to 110GHz, TDR + VNA verified.
View capabilityAluminum and copper-base boards with 1.0–8.0 W/m·K dielectric layers that pull heat away from the junction — the LED/power standard.
View capability3oz to 20oz+ copper with step-stencil differential plating, rated to IPC-2152 for 200A+ current capacity on boards up to 16 layers.
View capabilityIf you're unsure which board technology best fits your application, start with one of these three broad categories.
Whether your board is a two-layer FR4 prototype, a 32-layer HDI stack or a ceramic power module, our quality system, traceability, quoting and shipping process is identical — only the materials and process steps change to match your build.
Rigid, flex, ceramic or metal-core — every board that leaves our facility passes 100% automated optical and electrical test before it ships, no AQL sampling.
ISO 9001 and IATF 16949 certification governs every board technology we manufacture, from prototype run to production volume.
Every panel is serialized and traceable back to raw material lot, process step and operator, across all 9 board technologies we build.
Finished boards ship DDP worldwide with full documentation included, no matter which board technology or fabrication line produced them.
If your question isn't answered below, our engineering team is happy to talk through your specific board requirements.
HDI uses laser-drilled microvias down to 0.10mm and stacked via structures to achieve 2.5/2.5mil trace/space and 0.35mm BGA fan-out, in fewer layers than a standard multilayer build. Standard rigid multilayer (up to 32 layers) uses mechanically drilled through-holes and is the more cost-effective choice when extreme routing density isn't required. Designs needing advanced BGA/CSP fan-out or aggressive board thinning benefit from HDI; simpler high-layer-count designs are often better served by standard multilayer.
Choose flex PCB when your application only needs a bendable interconnect between rigid components mounted elsewhere in the system. Choose rigid-flex when you need integrated rigid mounting areas and flexible sections combined in a single board — up to 20 combined layers — eliminating connectors, cables and the failure points that come with them. Rigid-flex costs more upfront but often reduces total assembly cost and improves reliability in 3D-packaged or dynamically flexed products.
Metal core PCB (MCPCB) is the standard choice for LED and power-conversion modules, using an aluminum or copper base with a thermally conductive dielectric (1.0–8.0 W/m·K) to pull heat away from the junction. For higher power density or where SiC/GaN devices are involved, ceramic PCB delivers up to 170 W/m·K conductivity and near-zero CTE mismatch. Heavy copper PCB is the right fit when the constraint is current-carrying capacity (200A+) rather than thermal dissipation alone.
Yes. Quick-Turn PCB Prototyping runs same-day for simple 2-layer boards up to 72-hour turnaround on 16-layer builds, and expedited scheduling is available across rigid, HDI, flex, rigid-flex, metal-core and heavy copper technologies. Ceramic and high-frequency laminate builds have longer minimum lead times due to material sourcing, but can still be expedited — ask your account engineer for a specific quote.
Every board technology in this hub is manufactured under the same ISO 9001 and IATF 16949 certified quality management system, built to IPC-6012 Class 2/3 (Class 3 available on request) and tested to 100% AOI plus electrical test coverage before shipment. Metal core boards additionally carry UL 796 recognition.
Yes — send us your schematic, target layer stack, operating environment and any thermal or RF requirements, and our engineering team will recommend the board technology (or combination) that fits, along with a DFM review and no-obligation quote, typically within 8 working hours.
Whatever stage your project is at — engineering prototype or high-volume production — our team will return a DFM review and quote within 8 working hours, with the right board technology identified.
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