Moving probes contact your test points directly from CAD, Gerber or ODB++ data — no bed-of-nails fixture, no tooling wait, no tooling cost. Full opens/shorts and component verification the same day your files arrive.
Every net and every test point on the board is verified against your design intent. Hover to explore.
Broken traces, cracked vias and cold solder joints that interrupt the intended signal path, located to exact XY coordinates.
Unintended bridging between adjacent nets caused by solder bridges, conductive debris or etch defects.
Resistor, capacitor, inductor and diode values measured in-circuit and compared against BOM tolerance.
Diodes, electrolytic capacitors and polarized ICs placed backwards during assembly, caught before power-up.
Components dropped or omitted during placement and reflow, verified net-by-net against the design netlist.
Fine-pitch IC and connector bridging on 0.10mm-pitch pads caught electrically, not just visually.
Isolation failures between power planes and adjacent circuits identified with configurable test voltages.
First-article netlist verification against CAD intent before you commit to volume production.
No fixture design, no tooling fabrication wait. Your test program is generated directly from the same data you used to build the board.
We import your design directly from ODB++, Gerber X2, IPC-2581 or native CAD netlist files — no manual re-entry, no transcription errors between design and test.
ODB++ · Gerber X2 · IPC-2581 · native CADSoftware automatically extracts every accessible test point and pad from the design, flagging any nets with insufficient physical access before program build begins.
Automated coverage analysisOur engineers generate and validate the flying probe test program the same day — no fixture design, no bed-of-nails fabrication, no 1–2 week tooling wait.
Typically 2–8 hoursUp to 8 independently-driven probe heads are calibrated against your Gerber coordinates, then scan every net simultaneously for continuity, isolation and component value.
4–8 probes · top & bottom accessEvery board ships with a detailed report pinpointing the exact XY location of any fault, so your team can rework fast or feed findings straight back into design revision.
Coordinate-level fault reportingPrecision motion control and CAD-driven programming, in-house, on every prototype and low-volume order.
Independently driven X/Y/Z probe heads with spring-loaded, gold-plated tips make direct electrical contact with test points — repositioned automatically for every net, with no physical fixture ever built.
Test software imports your native design data, eliminating the manual netlist re-entry errors common to older test methods. The result is a validated program ready the same day your files land.
Dual-sided probe systems access both faces of the board concurrently, cutting cycle time on dense double-sided assemblies and giving full electrical access to fine-pitch pads down to 0.10mm.
Every board is tested against its own netlist — no shared fixture, no compromise on coverage. Full test reports ship with every order.
| Parameter | Flying Probe Capability | Status |
|---|---|---|
| Probe Count | Up to 8 probes (4–8 configurable) | Available |
| Min. Test-Point Pitch | 0.10mm (4 mil) | Available |
| Board Size Range | 50×50mm – 510×460mm | Available |
| Program Generation Time | 2–8 hours from CAD / Gerber | Available |
| Test Speed | Up to 10 points/second per probe | Available |
| Top & Bottom Access | Simultaneous dual-sided testing | Available |
| Component Verification | R, C, L, diode & transistor value / polarity | Available |
| Continuity / Isolation Voltage | 5–50V DC, configurable | Available |
| Fixture Requirement | None — fully fixtureless | Available |
Every flying probe test run is logged against your netlist with full pass/fail traceability. Reports are ready to hand straight to your design or quality team.
Real prototype and NPI testing challenges — and how flying probe solved them.
15 design iterations across an 8-week NPI cycle, each tested via flying probe with zero fixture cost or tooling delay between revisions.
Design team iterated freely without waiting on fixture rebuilds. Two open-circuit defects caught before the first clinical sample shipped.
Low-volume pilot production tested 100% via flying probe rather than commissioning a bed-of-nails fixture that wouldn't be reused.
Customer saved an estimated $2,400 in fixture tooling cost while still achieving full net coverage across the entire pilot batch.
0.15mm-pitch flex-rigid wearable board with dense BOM tested same-day from CAD, well before the customer's fixture quote had even returned.
Full electrical verification delivered a full week ahead of the customer's original fixture-based test schedule.
Prototype and low-volume programs move fast. Our flying probe service is built to keep pace — no fixture lead time, no tooling invoice, full coverage on every revision.
No bed-of-nails to design, quote or fabricate. Your design can change between revisions without invalidating a fixture investment.
We build directly from ODB++, Gerber or native CAD files — no separate fixture design cycle sitting between you and a tested board.
Multiple independently-driven probe heads test top and bottom concurrently, keeping cycle times competitive even without a fixture.
Every accessible test point on every net is verified — the same completeness as a bed-of-nails fixture, without the 1–2 week wait.
Common questions about flying probe testing, program generation and how it compares to fixture-based methods.
Flying probe is ideal for prototypes, NPI and low-to-medium volume runs where the design may still change or the volume doesn't justify a fixture. Bed-of-nails ICT becomes more cost-effective once you're running consistent high volumes, because the per-unit test time is faster once the fixture is built. We're happy to advise which method fits your project stage.
The test program is built entirely from your CAD, Gerber or ODB++ data — no physical sample is required to generate it. We do a first-article calibration run on your actual assembled board to confirm probe alignment before full production testing begins.
Our systems access test points down to 0.10mm pitch, covering the great majority of standard component pads and vias. Fully-shrouded BGA balls with no probe-accessible via are typically covered through boundary scan or a combination of flying probe plus AOI/X-ray, which we can recommend during DFM review.
Every accessible net and test point on every board is tested — there is no statistical sampling. Coverage is limited only by physical probe access, which is analysed automatically during program generation and reported to you before testing begins.
Typical turnaround is 2–8 hours from receipt of your CAD/Gerber/ODB++ files, depending on board complexity and net count. This compares to 1–2 weeks and several hundred to several thousand dollars for a bed-of-nails fixture — the core reason flying probe suits fast-moving prototype and NPI schedules.
Yes. In addition to continuity and isolation checks, our probes measure resistor, capacitor, inductor and diode values in-circuit and compare them against your BOM tolerance, flagging out-of-spec parts and reversed-polarity components before the board leaves the line.
Send us your CAD, Gerber or ODB++ files and our test engineering team will return a coverage analysis and quote within 8 working hours.
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