Non-destructive 2D and 3D CT imaging reveals what optical inspection cannot — voids, bridging and open joints hidden beneath BGA, CSP, QFN and LGA packages.
Non-destructive imaging into every joint and structure that's invisible to the naked eye. Hover to explore.
Quantifies void percentage inside BGA and CSP solder balls against IPC-A-610 acceptance thresholds — critical for thermal and mechanical joint reliability.
Detects the characteristic non-wetted junction between solder ball and paste that AOI cannot see, common on BGA reflow with coplanarity issues.
Reveals solder bridges forming underneath fine-pitch BGA and QFN packages, invisible to any optical inspection method.
Cross-sectional imaging of plated through-hole barrels identifies voiding and incomplete fill that can compromise via reliability under thermal cycling.
High-magnification imaging inspects microvia fill quality and annular ring integrity on HDI boards, catching voids before they cause field failures.
3D CT reconstruction verifies internal layer alignment on multilayer PCBs, confirming registration accuracy that cannot be checked from the surface.
Internal die and lead-frame imaging confirms component authenticity against known-good references, flagging remarked or re-balled counterfeit parts.
Verifies thermal pad and ground-plane solder fill on QFN and LGA packages, where poor coverage directly impacts thermal performance and reliability.
A calibrated, repeatable sequence that quantifies defects against IPC-A-610 criteria — not a subjective visual pass/fail.
The board is loaded and positioned on the manipulator stage. The micro-focus X-ray tube and detector are calibrated for the target package type and board thickness before any imaging begins.
Manipulator stage · micro-focus tube · calibrated per packageReal-time 2D imaging scans the target solder joints, PTH barrels or via structures at magnification tuned to the feature size — the fast first pass for standard voiding and bridging checks.
Real-time 2D imaging · variable magnification · rapid screeningFor BGA, CSP and multilayer structures where 2D imaging cannot fully separate overlapping features, the board is rotated through a full CT scan and reconstructed into a 3D volumetric model.
Computed tomography · full rotational scan · 3D volumetric modelSoftware measures void area as a percentage of joint area and compares it against IPC-A-610 acceptance limits. An inspection engineer signs off borderline cases before a full report is generated.
Void % quantification · IPC-A-610 criteria · engineering sign-offAll imaging is performed in-house on production-grade equipment — nothing is outsourced.
High-speed 2D imaging for first-pass screening of solder joints, PTH barrels and via structures. Fast enough for high-volume production sampling while still resolving voids and bridging within standard acceptance criteria.
Full rotational computed tomography reconstructs a complete 3D volumetric model of the board — essential for separating overlapping BGA solder balls, verifying internal layer registration and confirming microvia integrity that 2D imaging alone cannot resolve.
A micro-focus X-ray source with a sub-micron focal spot enables magnification up to 2000x — resolving individual solder ball voids, fine microvia structures and die-level detail for counterfeit component verification.
Every parameter below reflects our production X-ray line, verified against IPC-A-610 void acceptance criteria. Void analysis reports and images ship with every relevant assembly order.
| Parameter | X-Ray Capability | Status |
|---|---|---|
| Magnification Range | Up to 2000x, micro-focus tube | Available |
| Void Detection Sensitivity | Down to 2% of joint area | Available |
| Max Board Thickness | Up to 10 mm | Available |
| Max Board Size | Up to 460 x 610 mm | Available |
| Tube Power | 90 kV micro-focus source | Available |
| Scan Time (2D) | ~30 seconds per board | Available |
| 3D CT Reconstruction | Available on request | Available |
| PTH Barrel Inspection | Cross-sectional void imaging | Available |
| IPC-A-610 Compliance | Class 2 / 3 void acceptance criteria | Available |
X-ray void analysis is documented against IPC-A-610 acceptance criteria for every relevant package. Our calibration records and inspection procedures are available for customer audit on request.
Real hidden-joint challenges — and how X-ray imaging caught them before shipment.
A battery management BGA package was showing elevated void rates on early production units. 3D CT scanning was used to isolate the root cause in the reflow profile.
3D CT imaging pinpointed voiding concentrated at the package center, traced to a reflow ramp-rate issue. After profile correction, void rates dropped well within IPC-A-610 limits.
A Class 3 implantable sensor board required 100% X-ray verification of QFN thermal pad solder fill, invisible to any optical inspection method.
X-ray inspection identified three units with insufficient thermal pad fill before they left the facility, preventing a potential field failure in an implantable device.
A high-density networking board required internal layer registration verification and microvia integrity confirmation before customer sign-off on a new stack-up.
Full CT reconstruction confirmed layer-to-layer registration within tolerance and microvia fill quality across the panel, giving the customer confidence to release the stack-up to production.
Hidden defects are the hardest to catch and the most costly to miss. Our X-ray program is built around calibrated equipment, documented criteria and engineers who know what they're looking at.
Our micro-focus systems detect voiding down to 2% of joint area — well below typical 25-30% IPC-A-610 rejection thresholds — giving early warning before a joint reaches marginal territory.
Micro-focus X-ray tubes with sub-micron focal spots resolve individual solder ball voids and microvia structures that lower-power systems simply cannot image clearly.
We don't rely on statistical sampling for hidden-joint risk. Every relevant package on every board is X-ray inspected as standard, not held back as a premium add-on.
Void percentage reports, defect images and engineering sign-off are delivered within 24 hours of inspection — so production and quality decisions aren't waiting on paperwork.
Common questions about X-ray inspection and how it fits into your assembly and quality process.
X-ray inspection provides non-destructive imaging of structures hidden from optical view — most importantly, solder joints underneath BGA, CSP, QFN and LGA packages. It's also used to inspect PTH barrel fill, microvia integrity, internal layer registration on multilayer boards, and to verify component authenticity via internal die and lead-frame imaging.
IPC-A-610 acceptance criteria vary by class and joint type, but BGA voiding is commonly evaluated against a 25-30% void area threshold per ball, with tighter limits applied on Class 3 and high-reliability designs. Our systems detect voiding down to 2% of joint area, giving clear margin below rejection thresholds and early warning of process drift.
Yes. With 3D CT reconstruction we can verify internal layer-to-layer registration, inspect PTH barrel and microvia fill quality, and confirm internal via structure on HDI and multilayer boards — independent of any solder joint inspection.
Both. 2D real-time imaging is used as the standard first-pass screen for most solder joint and via checks, since it's fast and covers the majority of defect types. 3D CT reconstruction is applied for complex BGA/CSP packages, layer registration verification, or whenever overlapping features can't be fully separated in a single 2D view.
Micro-focus X-ray imaging at high magnification reveals internal die size, bond wire pattern and lead-frame construction, which can be compared against known-good reference images for a given part number. Inconsistencies — different die size, mismatched bond wire count, re-balled packages — are strong indicators of counterfeit or remarked components.
For boards with BGA, CSP, QFN or LGA packages, we run 100% X-ray inspection on every relevant joint as standard, not statistical sampling. This is included in our assembly process for these package types; for boards without hidden-joint components, X-ray is available as an optional service, for example for counterfeit verification or via inspection.
Our engineering team will review your BOM and package types and return a full quote, including your X-ray inspection plan, within 8 working hours.
Fill in the details below and we'll get back to you shortly.