5 dedicated test and inspection methods · 100% coverage on every order · one PCB partner. From first-article AOI scanning through final pre-shipment quality control, every board that leaves our facility passes the full testing stack appropriate to its build — no AQL sampling, no shortcuts, full traceability on every unit.
The three test disciplines that catch the highest-impact defects before a board ever reaches your assembly line or field deployment.
Automated optical inspection scans every board for missing or misaligned components, solder bridging, tombstoning, wrong polarity and insufficient solder — 100% of surface features, every panel.
Explore AOI Inspection →Non-destructive 2D and 3D CT X-ray imaging exposes hidden BGA, QFN and CSP solder joints, voiding levels, head-in-pillow defects, PTH barrel voids and internal layer registration.
Explore X-Ray Inspection →Bed-of-nails in-circuit test for high-volume production, boundary scan / JTAG for dense digital boards, hipot dielectric withstand testing and custom functional test against your spec.
Explore Electrical Testing →Click any service to see method details, defect coverage and when it's the right fit for your build.
Multi-camera optical scanning for placement, solder and silkscreen defects — 100% of every panel.
View capability2D/3D CT imaging for hidden BGA/QFN solder joints, voiding, head-in-pillow and PTH barrel voids.
View capabilityFixtureless electrical test direct from CAD/Gerber data — no tooling cost, no lead time, ideal for prototypes.
View capabilityBed-of-nails ICT for high-volume runs, boundary scan/JTAG, hipot testing and custom functional test.
View capabilityLast-stage unit-by-unit visual and dimensional inspection, packaging/MSL/ESD check and traceability bundling.
View capabilityIf you're unsure which inspection or test method best fits your build, start with one of these two broad categories.
Whether your board goes through optical scanning, X-ray imaging or bed-of-nails electrical test, our reporting, traceability, quoting and shipping process is identical — only the equipment and defect coverage change to match your build.
Every job — from a single flying-probe prototype to a full ICT production run — ships with a digital test report inside 24 hours of completion.
Every unit's test data is logged and traceable back to panel, lot and operator — applied across AOI, X-ray, electrical and final inspection alike.
Getting a test method recommendation and quote never requires committing to fixture, probe-bed or programming cost upfront — regardless of which method you need.
Tested boards ship DDP worldwide with the complete test report, traceability and compliance documentation package included, no matter which method was used.
If your question isn't answered below, our engineering team is happy to talk through your specific test requirements.
It depends on your volume, component mix and risk profile. Prototypes and low-volume runs typically use flying probe testing (no tooling, fast turnaround). High-volume production usually adds bed-of-nails ICT for speed and cost efficiency. Boards with BGA, QFN or CSP packages get X-ray inspection for hidden joints, and every board — regardless of volume — gets AOI and final inspection. Send us your BOM and Gerbers and we'll recommend the right combination at no charge.
Yes — this is standard practice, not an exception. A typical production order runs AOI on every panel, X-ray on any BGA/QFN/CSP assemblies, electrical test (flying probe or ICT depending on volume) on 100% of units, and a final visual/dimensional inspection before packaging. The combination is selected to match your design's risk areas.
AOI, final inspection and standard electrical continuity test are included in every quoted PCB price at no extra line item. X-ray inspection, boundary scan/JTAG, hipot dielectric withstand testing and custom functional test against a customer specification are quoted separately, since they depend on your BOM, fixture requirements and test coverage depth.
Every order ships with a digital test report package: AOI defect log, X-ray images where applicable, electrical test pass/fail data per unit, and a final inspection checklist. Serialized traceability data linking each unit back to its panel and test run is available on request, along with IPC-A-610 workmanship certification.
Yes — AOI, X-ray, flying probe, ICT and final inspection are all available as standalone services on boards or assemblies you supply, including consigned inventory. We'll need your Gerber/CAD data and BOM to program fixtureless test coverage, or your existing fixture if one is provided.
Yes — flying probe testing was built specifically for 1-up and low-volume prototype work since it requires no fixture or tooling lead time. As volume scales, we transition to bed-of-nails ICT for speed and per-unit cost efficiency. AOI, X-ray and final inspection run at 100% coverage regardless of order size.
Whatever stage your project is at — engineering prototype or high-volume production — our team will return a DFM/DFT review and quote within 8 working hours, with the right test method combination identified.
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