From connected sensors and smart speakers to energy monitors and home automation hubs — compact, low-power PCBs with multi-protocol RF performance built for mass production.
Every smart home device starts with a compact, reliable PCB. We specialise in the high-volume, multi-protocol boards that power them.
High-frequency RF boards on Rogers laminates for 77 GHz forward collision, lane departure and autonomous driving sensor fusion.
Heavy copper BMS boards for cell monitoring, thermal management and charge control in hybrid and full-electric vehicles.
High-temperature multilayer boards for ECU and TCU operating near the engine bay from -40°C to +150°C.
HDI multilayer boards for in-vehicle displays, connectivity, navigation and digital cluster platforms.
IPC Class 3 boards for ABS, ESP, airbag control and active suspension — zero tolerance for in-field failure.
Standard multilayer PCBs for door locks, window controls, lighting automation and central body electronics.
Metal-core and aluminium PCBs for matrix LED headlights and adaptive lighting systems.
Robust multilayer PCBs for climate control, seat adjustment and ambient environment management.
IoT devices must be cheap, tiny, power-sipping and RF-transparent simultaneously — while meeting global regulatory requirements in dozens of markets.
A single smart home device may integrate Wi-Fi 6, Bluetooth 5.3, Zigbee and Thread on one board. Managing RF coexistence, antenna isolation and shared spectrum without desensitisation requires careful stackup design, antenna placement and impedance control.
Wi-Fi 6 · BT 5.3 · Zigbee · Thread · 2.4 GHz coexistenceIoT sensor nodes must run for years on a coin cell. Board design choices — trace resistance, parasitic capacitance, ground plane continuity — directly affect standby current by orders of magnitude. Getting the PCB right saves battery specification decisions downstream.
sub-µA sleep · parasitic minimisation · ground plane designIoT products ship to CE (EU), FCC (USA), TELEC (Japan) and dozens of other regulatory zones. PCB stackup, RF trace routing and shielding cavity design affect emissions and immunity test outcomes. Getting it right at PCB level avoids costly chamber re-tests.
CE · FCC · TELEC · emissions-optimised stackupSmall board area, multi-protocol RF and low power demand specific PCB technologies.
Any-layer HDI for maximum routing density in compact IoT hub form factors. Integrated RF-optimised stackup with antenna clearance zones, controlled impedance Wi-Fi and Bluetooth traces, and ENIG finish for consistent RF connector performance.
Ultra-thin polyimide flex and rigid-flex for IoT wearables and body-worn sensors. Biocompatible solder mask, dynamic flex capability and form factors as small as 5 mm × 10 mm boards with BLE SoC integration.
Double-insulation multilayer PCBs for mains-connected IoT devices — smart plugs, energy monitors and demand-response controllers. IPC-compliant creepage and clearance distances, flammability V-0 laminates, ENIG finish for relay contacts.
Every parameter below is verified against IATF 16949 and IPC-A-600 Class 3 requirements. Full test reports and material traceability ship with every order.
| Parameter | Automotive Grade | Status |
|---|---|---|
| Layer Count | 2 – 30 layers, any-layer HDI | Available |
| Min. Trace / Space | 2.5 / 2.5 mil | Available |
| Laser Via Diameter | 0.10 mm minimum | Available |
| Surface Finish | ENIG / OSP / Immersion Ag | Available |
| Board Thickness | 0.3 mm – 3.2 mm | Available |
| Controlled Impedance | ±5% TDR verified | Available |
| RF-Optimised Stackup | Wi-Fi / BT / Zigbee prequalified | Available |
| Prototype Turnaround | 48 hours express / 5 days standard | Available |
| Compliance Support | CE / FCC / RoHS / REACH materials | Available |
IoT products ship in hundreds of thousands. A 1% board failure at volume creates massive warranty and logistics costs. Our DFM review, 100% AOI and controlled RF stackup design prevent field failures before mass production starts.
Real automotive PCB challenges — and how we solved them.
10-layer HDI board integrating Wi-Fi 6, BT 5.3, Zigbee and Thread simultaneously. RF coexistence stackup, controlled antenna feed impedance, ENIG finish throughout.
All four protocols achieved regulatory compliance at first chamber test. Product shipped 8 weeks ahead of schedule. Manufacturing yield 98.4% at first production lot entry.
4-layer HDI board for a LoRaWAN / BLE environmental sensor. Sub-2 µA sleep current, 5 cm × 3 cm board area, CR2032 battery target of 5-year life.
Achieved 1.8 µA measured sleep current — beating target spec. 5-year battery life confirmed by accelerated drain testing. Zero board-level failures in 1M units shipped.
8-layer isolated multilayer board for a smart plug with real-time energy monitoring. IEC 60950 clearances, V-0 laminate, Wi-Fi + BT dual-band, CT sensor interface.
CE and FCC certification achieved at first submission. Energy measurement accuracy ±0.8% across full rated current range. 500,000-unit volume run with 99.6% production yield.
Automotive procurement teams need more than a PCB factory — they need a certified partner with documented processes, fast engineering response and the depth to solve problems before the production line.
IoT product development moves fast. Our 48-hour express prototype service and 8-hour DFM review keep your engineering team moving without waiting on the supply chain.
We maintain prequalified RF stackups for 2.4 GHz multi-protocol, 5 GHz Wi-Fi and sub-GHz LoRa/Z-Wave applications — reducing your time from schematic to FCC/CE-ready prototype.
Any-layer HDI with 0.10 mm laser vias allows you to pack more capability into the small form factors that smart home products demand — without compromising signal integrity.
From engineering samples to million-unit production. DDP delivery to contract manufacturers and distribution centres worldwide. RoHS/REACH documentation ready for CE marking.
Our IoT and smart home PCB engineering team will review your design and return a full DFM report and quote within 8 working hours.
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