From 48-hour HDI prototypes to full turnkey production — DFM on every order, IPC Class 2/3 default, DDP to 40+ countries.
From design to mass production, we support your entire product lifecycle
Professional PCB layout services for complex electronics. Our senior engineers deliver high-speed, RF and mixed-signal designs with full signal integrity analysis and DFM-ready output.
Precision PCB fabrication in our ISO 9001 certified facility. From prototypes to high-volume production, we deliver consistent quality across 2–32 layer boards in a variety of advanced materials.
Complete SMT and THT assembly services with AOI, X-ray inspection, and functional testing. From small prototypes to large production runs, all assemblies meet IPC Class II/III standards.
Complete end-to-end PCB solutions from design and component sourcing through final assembly and delivery. We manage everything so you can focus on your product, not your supply chain.
We combine deep technical expertise with end-to-end capability, rigorous quality, and fast execution — so your next PCB project moves from concept to volume without friction.
Get Instant Quote →Senior engineers with deep experience in HDI, high-speed, RF, and mixed-signal PCB design across demanding industries.
From 2-layer boards to 32-layer HDI, flexible, rigid-flex, and ceramic PCBs — all manufactured under one roof for full accountability.
ISO 9001 certified processes with AOI, X-ray, and flying-probe testing for every order. IPC Class II/III workmanship as standard.
48-hour prototypes and streamlined production workflows — we accelerate your time-to-market without compromising on quality.
Experienced engineers delivering reliable and high-performance PCB solutions
Our engineering team specializes in PCB design, manufacturing, and assembly, covering everything from simple boards to complex HDI and high-speed designs.
We combine engineering depth, in-house capacity and transparent process to deliver boards you can rely on — from prototype to production.
Get Instant Quote →Stack-up, trace width, impedance and DRC checked before production. Included with every order, no extra charge.
Direct access to SI, RF and DFM specialists. Real engineers, not ticket queues — response within 4 working hours.
Standard 5-day lead time. 48h express available. DDP shipping to 40+ countries — one less thing to manage.
Certified quality system. Every board 100% e-tested, AOI + X-ray inspected before it leaves our facility.
Diverse PCB solutions engineered for every application
Standard FR4 multilayer boards for industrial and consumer electronics. Supports 2–32 layers with controlled impedance.
View Details →Space-constrained applications with excellent bending and flex cycle performance. Ideal for wearables and robotics.
View Details →Hybrid rigid and flex sections for complex 3D packaging and space-saving assemblies in aerospace and medical.
View Details →High-density interconnect for advanced mobile, RF and semiconductor package substrates. Min line/space 2/2 mil.
View Details →Designed for 5G, RF and microwave applications using Rogers, PTFE and low-Dk materials for superior performance.
View Details →Excellent thermal management and electrical isolation for power electronics, LED modules and high-temperature applications.
View Details →Superior heat dissipation for high-power LED lighting and power electronics. Aluminum or copper substrate options.
View Details →Complex 6 to 32-layer boards with precision controlled impedance stackup for servers, telecom and networking gear.
View Details →Two plants in Shenzhen, vertically integrated from bare board fabrication to full SMT assembly and functional test — under ISO 9001 certified quality management.
Send your Gerber — we return a full DFM report within 8 hours, free of charge.
Transparent line-item quote. NDA signed on request — standard practice for all customers.
Stack-up, controlled impedance, bow & twist — all confirmed before board drops to fab.
In-house pressing, plating, SMT, AOI and X-ray — every board 100% electrically tested.
Shipped door-to-door worldwide. Engineering support continues after delivery — always.
PCB solutions engineered for diverse market applications
Advanced PCBs for ADAS, EV powertrain, infotainment, and body control modules with AEC-Q100 reliability.
High-reliability PCBs for imaging, diagnostics, patient monitoring and implantable devices with strict biocompatibility standards.
Robust control boards and PLCs for factory automation, motor drives, and Industrial IoT systems in harsh environments.
PCBs for smartphones, wearables, gaming consoles and smart home devices with miniaturization and cost optimization.
High-speed PCBs for 5G base stations, optical transceivers, routers and network infrastructure with tight impedance control.
Mission-critical PCBs with extreme reliability and environmental tolerance for avionics, satellites and defense systems.
Low-power PCBs for smart sensors, Zigbee/Z-Wave modules, and connected devices with BLE and Wi-Fi integration.
Power electronics PCBs for solar inverters, EV charging stations, UPS systems and energy storage with high current capacity.
Every process documented, audited and traceable — from incoming materials to final test.
Recognised by US and Canadian safety regulators. Required for many consumer and industrial end-products.
EU hazardous substance compliance. Full material declarations available for every board type.
Industry-standard acceptability criteria for PCBs. Class 3 available on request for aerospace and medical.
"HanSphere's DFM feedback alone saved us two full redesign cycles on our 16-layer HDI board. The engineering team caught via-in-pad issues our own review missed — and we still shipped on the original deadline."
"Consistent first-pass yield above 98% across three production runs. Communication is clear, professional and always in English. Two years in and they're still our go-to PCB partner."
"Our avionics boards require IPC Class III compliance and zero-defect tolerance. HanSphere met every specification and delivered ahead of schedule — something very few overseas suppliers can claim."
Practical guides and technical deep-dives for hardware engineers
PCB Design
Power integrity (PI) is critical in modern PCB design. Stable power delivery ensures reliable operation of high-speed devices and reduces noise issues. This article explains decoupling strategies, PDN design, and practical techniques to control power noise.
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Stackup design is a critical step in high-speed PCB development. The number of layers directly affects signal integrity, EMI, impedance control, and routing complexity. This article compares 6-layer, 8-layer, and 10-layer stackups and explains how engineers choose the right structure.
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Vias play an important role in multilayer PCB design, but in high-speed circuits they can introduce signal reflections and additional loss. This article explains via stubs, backdrilling, and how engineers design vias to maintain signal integrity.
Read MoreAnswers to common questions about our PCB services