From fixture-based In-Circuit Test on high-volume runs to boundary scan on dense digital boards and custom functional test against your spec — full electrical verification before a board ever leaves our floor.
ICT, boundary scan, hipot and functional test each target different failure modes. Hover to explore.
Resistors, capacitors and inductors measured in-circuit at high speed to catch values that have drifted outside tolerance.
Full bed-of-nails net verification catches broken connections and unintended bridging across every test point at production speed.
Hipot and insulation resistance testing identifies weak isolation between power planes before a board ever sees line voltage.
Powered-up functional test against your spec catches failures that pass net-level testing but don't perform in real operation.
JTAG chain testing exposes interconnect faults on BGA and dense digital boards with no physical probe access.
Functional test verifies rail voltages, regulation and load response against the customer's power budget spec.
Custom functional jigs exercise real signal I/O to confirm the board performs its intended function end-to-end.
Extended burn-in cycling under load screens out infant-mortality failures before boards reach the customer.
Whether you need a bed-of-nails fixture for high-volume ICT or a custom functional jig against your test spec, the process is engineered for repeatability and traceable data.
Our test engineers review your test specification, netlist and BOM to define the right method — ICT, boundary scan, functional, hipot, or a combination — and design the fixture or program accordingly.
Method selection · fixture designFor ICT, a custom bed-of-nails fixture is built to your board's test-point layout. For boundary scan and functional test, we build and validate the test program and I/O simulation against your spec.
5–10 day typical ICT fixture buildThe new fixture or program is run against known-good and known-bad reference boards to confirm it correctly passes good units and fails defective ones before production begins.
Known-good / known-bad correlationBoards are run through ICT and/or functional test at production speed, powering up the assembly and verifying it performs its intended function against your test spec — rails, I/O, load response and timing.
Up to 600 boards/hourEvery test result is logged automatically. Statistical process control tracks yield trends and flags drift early, with reports available at lot, batch or serial-number level.
Real-time SPC · yield trend reportingFrom bed-of-nails fixtures to boundary scan and custom functional jigs — matched to your volume and test spec.
A custom fixture with hundreds of spring-loaded pins contacts every test pad simultaneously, verifying component values, orientation and opens/shorts in seconds — the fastest per-unit test method once volume justifies the tooling.
IEEE 1149.1-compliant boundary scan chains test interconnects on components with no physical probe access — essential for BGA, QFN and other fine-pitch digital packages where ICT probe access is limited or impossible.
AC/DC hipot and insulation resistance testing verifies dielectric withstand and safety isolation on power-carrying and safety-critical boards, per UL and IEC test methods — essential wherever mains or high-voltage isolation is safety-critical.
Custom jigs simulate real-world inputs, loads and signal conditions, powering up the assembled board and verifying it performs its intended electrical function against your test spec — including extended burn-in for early failure screening.
ICT, boundary scan, hipot and functional test parameters, matched to your volume and reliability requirements. Full test reports and SPC data ship with every production run.
| المعلمة | Electrical Test Capability | الحالة |
|---|---|---|
| ICT Fixture Turnaround | 5–10 working days typical | متوفرة |
| Test Coverage | Up to 98% net / component coverage | متوفرة |
| Production Throughput | 200–600 boards/hour (volume dependent) | متوفرة |
| Voltage Test Range | 0–1,000V DC · up to 4,000VAC hipot | متوفرة |
| Current Test Range | µA leakage to 30A functional load | متوفرة |
| Boundary Scan Coverage | Up to 95% on JTAG-compliant nets | متوفرة |
| Burn-In Duration | 24–168 hours, configurable | متوفرة |
| الاختبار الوظيفي | Custom fixture built per customer spec | متوفرة |
| Data & Yield Reporting | Real-time SPC, lot / serial-level logging | متوفرة |
Every production test run is logged with lot-level traceability. First-article correlation, SPC trend data and yield reports are available on request for every batch.
Real production electrical test challenges — and how we solved them.
Custom bed-of-nails fixture built for a 12-layer ECU board running at high volume, with full IATF-aligned SPC data logging on every batch.
Zero field failures across the first annual production cycle. SPC trend data flagged a probe wear issue early, avoiding a yield dip.
Dense digital board with multiple fully-shrouded BGAs, tested via boundary scan where physical probe access wasn't possible.
Boundary scan caught two interconnect opens under BGA packages that ICT alone could not have physically accessed.
Safety-critical power module requiring dielectric withstand testing plus a custom functional jig simulating real load conditions.
Custom functional fixture and 72-hour burn-in screened out two early-life failures before the units shipped to the customer.
Volume production needs more than a probe — it needs repeatable fixtures, real coverage data and a partner who can flag drift before it becomes a field failure.
We combine test methods so components with no physical probe access are still verified — coverage isn't limited to what a bed-of-nails alone can reach.
Custom bed-of-nails fixtures test hundreds of boards per hour at production speed, keeping electrical verification off your critical path.
Every test result feeds SPC trend charts, so drift in yield or a specific fault type is flagged and addressed before it becomes a field problem.
Isolation and dielectric withstand testing is run to UL and IEC test methods for boards where electrical safety compliance is non-negotiable.
Common questions about ICT, boundary scan, hipot and functional test, and how to choose between them.
ICT verifies individual components and net connections — values, orientation, opens/shorts — with the board unpowered or lightly biased. Functional test powers the board up and exercises it as it would run in the field, verifying that it actually performs its intended function against your test spec. Most production programs use both: ICT to catch build defects, functional test to confirm end-to-end performance.
ICT fixtures typically pay for themselves once you're running consistent volumes — the per-unit test time is much faster than flying probe once the fixture exists. If your design is still changing or your volume is low-to-medium, flying probe usually makes more economic sense since it avoids the 5–10 day fixture lead time and tooling cost entirely.
Boundary scan uses the IEEE 1149.1 JTAG standard built into many digital ICs to test interconnects without a physical probe touching the pin. It's essential for BGA, QFN and other fine-pitch packages where mechanical probe access simply isn't possible, and we typically run it alongside ICT to close the coverage gap on dense digital boards.
Hipot testing applies a high AC or DC test voltage between isolated conductors — typically mains-to-secondary or power-to-chassis — to confirm the insulation can withstand normal operating stress without breaking down. We measure leakage current and insulation resistance against your target spec, which is standard on any board where electrical safety isolation matters.
Yes. Burn-in runs assembled boards under load at elevated temperature for a configurable period — typically 24 to 168 hours — to accelerate and screen out infant-mortality failures before shipment. It's commonly specified for automotive, industrial and safety-critical programs where field failures carry a high cost.
Every board's test result is logged automatically — pass/fail, fault type and location where applicable — and rolled up into SPC yield trend reports at lot, batch or serial-number level. Reports are available on request for every production run, and we'll flag any yield drift proactively rather than waiting for a formal review.
Send us your netlist, BOM and test spec and our test engineering team will recommend the right method mix and return a quote within 8 working hours.
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