From solder paste printing and SPI to high-speed placement, nitrogen reflow and X-ray inspection — full-service SMT assembly engineered for ±25µm accuracy and >99% first-pass yield.
From vibration-resistant automotive modules to ultra-miniature wearables. Hover to explore.
Fine-pitch SMT for ADAS sensors, infotainment and BMS modules, placed and reflowed to withstand continuous vibration and thermal cycling.
01005-scale miniaturization and SPI-verified paste printing for wearable diagnostics and portable monitoring equipment.
Robust reflow profiles and 100% AOI for PLC, sensor and drive boards running continuous duty cycles on the factory floor.
High-volume double-sided SMT with fast changeover for wearables, smart home devices and audio products at competitive cost.
0.3–0.4mm pitch QFN and BGA placement for small-cell and mmWave RF modules, with 100% X-ray joint verification.
IPC Class 3 SMT assembly with X-ray verified BGA joints and full lot traceability for mission-critical electronics.
01005/0201 component miniaturization enabling compact sensor nodes, wearable modules and connected device form factors.
SMT assembly for power converter and inverter control boards, with reflow profiles tuned for reliable joints under thermal load.
Solder joint quality is decided before the board ever reaches the reflow oven. Our SMT line controls every variable, at every stage.
Laser-cut stainless steel stencils deposit solder paste onto every pad, followed inline by 3D Solder Paste Inspection (SPI) that verifies volume, height and area before a single component is placed — catching print defects before they become solder defects.
Laser-cut stencils · 3D SPI · inline verificationYamaha/Panasonic/Samsung-class placement platforms position components from 01005 chips to 45mm BGA/CSP packages at ±25µm accuracy, running multiple parallel lines to hold tight tolerances even on ultra-fine-pitch 0.3mm devices.
±25µm accuracy · 01005–BGA · up to 60,000 CPHMulti-zone nitrogen reflow ovens run tailored preheat, soak, reflow and cooling profiles for lead-free (RoHS) solder pastes — reducing oxidation and voiding on BGA and QFN joints while protecting temperature-sensitive components.
Nitrogen atmosphere · lead-free profiles · double-sided SMTEvery board passes through 100% Automated Optical Inspection after reflow, and BGA/QFN packages additionally receive 2D/3D X-ray inspection to confirm solder ball integrity and detect voiding or bridging invisible to the naked eye.
100% AOI · 2D/3D X-ray · void analysisPrecision router, laser or punch depaneling separates boards from the panel without stressing solder joints, followed by a final visual and functional check before packaging and shipment.
Precision depaneling · final visual QC · packagingEvery SMT process runs in-house — no critical step is outsourced.
Laser-cut stainless steel stencils and high-precision printers combine with 2D/3D SPI to verify every paste deposit before placement — the single biggest lever for consistent solder joint quality downstream.
Yamaha/Panasonic/Samsung-class placement platforms deliver ±25µm accuracy across component ranges from 01005 chips to 45mm BGA/CSP packages, with multiple parallel lines for high-mix, high-volume production without sacrificing tolerance.
8–12 zone nitrogen reflow ovens hold tight thermal profiles for lead-free solder pastes, minimizing voiding on BGA/QFN joints and supporting double-sided SMT builds without disturbing components on the first-reflowed side.
100% automated optical inspection runs after every reflow cycle, supplemented by 2D/3D X-ray inspection for BGA, QFN and other hidden-joint packages — confirming solder fill and flagging voids or bridging that visual inspection alone cannot catch.
Every parameter below is verified against IPC-A-610 Class 2/3 acceptance criteria. Full SPI, AOI and X-ray reports ship with every order on request.
| Параметр | SMT Assembly Spec | Статус |
|---|---|---|
| Component Size Range | 01005 (0201 metric) – 45×45mm BGA/CSP | Доступно |
| Точность размещения | ±25µm (±0.001") | Доступно |
| Fine-Pitch Capability | 0.3mm pitch CSP/BGA, 0.4mm QFN | Доступно |
| Package Types | BGA, CSP, QFN, QFP, SOIC, chip components | Доступно |
| Board Size Range | 50×50mm – 460×400mm (panel) | Доступно |
| Толщина доски | 0.4mm – 3.2mm | Доступно |
| Профиль для дожигания | Lead-free (RoHS) nitrogen reflow | Доступно |
| Placement Speed | Up to 60,000 CPH per line | Доступно |
| Solder Joint Standard | IPC J-STD-001 / IPC-A-610 Class 2/3 | Доступно |
| Lead Time | 24–72 hour prototype turn | Доступно |
| MOQ | No MOQ on prototype assembly | Доступно |
Every SMT run is documented from stencil print to final AOI/X-ray report. Our IPC-A-610 and J-STD-001 aligned process covers each stage, with full traceability available on request.
Real SMT assembly challenges — and how we solved them.
0.3mm pitch QFN and BGA components on a 5G small-cell RF board for a European telecom OEM. Nitrogen reflow and 100% X-ray required on every unit.
Zero voiding-related field failures across a 12,000-unit production run; the customer's incoming inspection now accepts our X-ray reports as final verification.
Ultra-miniature 01005 chip components on a 6-layer wearable diagnostic PCB. SPI-verified paste printing was critical to first-pass yield at this component scale.
Achieved 99.4% first-pass yield on the smallest component package in our production history, letting the customer shrink their wearable enclosure by 18%.
8-layer radar front-end board with a 0.4mm pitch BGA processor. 100% X-ray inspection confirmed solder ball integrity before shipment.
Zero BGA solder-joint defects across 6 production batches; the customer cited our X-ray documentation as key to their PPAP approval.
SMT assembly quality is decided before reflow ever starts. Our process controls print, placement and thermal profile at every stage — and verifies the result on every board.
Yamaha/Panasonic/Samsung-class placement equipment maintains tight accuracy across the full component range — from 01005 chip components to fine-pitch 0.3mm CSP/BGA packages.
Nitrogen reflow reduces oxidation during soldering, cutting void rates on BGA and QFN packages compared with standard air reflow — a measurable reliability gain on every board.
SPI, AOI and X-ray checks run on every board — not a sample. Print defects, placement shifts and hidden BGA voids are caught before the board ever leaves the line.
Dedicated prototype lines run 24–72 hour turnaround on standard SMT builds, without skipping SPI, AOI or the DFM review that catches issues before production.
Common questions about SMT assembly, component ranges and inspection.
Our placement lines handle 01005 (0201 metric) chip components down to ±25µm accuracy, and fine-pitch CSP/BGA packages at 0.3mm pitch. If your design uses ultra-miniature components, mention it at quote stage so we can confirm line availability and yield expectations.
Yes. We regularly build double-sided SMT boards, using adhesive or profile control to keep components on the first-reflowed side secure during the second reflow pass. Component placement is planned to balance thermal mass and avoid tombstoning on smaller passives.
Every board receives 100% AOI after reflow. BGA, QFN and other hidden-joint packages additionally receive 2D/3D X-ray inspection to verify solder ball integrity, confirm barrel fill and detect voiding or bridging that's invisible from the surface.
Yes — we run combined SMT + THT assembly in-house, using selective soldering to add through-hole components without disturbing nearby reflowed SMT joints. See our dedicated DIP / Through-Hole Assembly service for details on connector, transformer and power-component handling.
Standard SMT prototype turnaround is 24–72 hours from confirmed BOM, centroid file and Gerbers, depending on component sourcing and complexity. Production scheduling is quoted per order based on volume and panel size.
Nitrogen reflow is standard for lead-free BOMs and any board with BGA, QFN or other voiding-sensitive packages. For simpler boards without void-critical joints, air reflow is available as a lower-cost option — we'll recommend the right process at DFM review.
Our SMT engineering team will review your BOM and centroid file and return a full DFM report and quote within 24 working hours.
Введите данные ниже, и мы свяжемся с вами в ближайшее время.