Han Sphere Blog

Explore the latest trends, technologies, and best practices in PCB design, manufacturing, and the electronics industry

PCB Reliability Testing: Thermal Cycling, Burn-In, and Vibration Test

PCB Reliability Testing: Thermal Cycling, Burn-In, and Vibration Test

PCB reliability testing helps verify long-term performance under harsh operating conditions. Methods such as thermal cycling, burn-in, and vibration testing are widely used in automotive, industrial, aerospace, and medical electronics.…

ICT vs Flying Probe Testing: Which PCB Test Is Better?

ICT vs Flying Probe Testing: Which PCB Test Is Better?

ICT and flying probe are two common PCB electrical testing methods used during PCB assembly. While both verify shorts, opens, and component values, they differ significantly in cost, speed, and…

PCB X-Ray Inspection for BGA and Hidden Solder Joints

PCB X-Ray Inspection for BGA and Hidden Solder Joints

PCB X-ray inspection is widely used to detect hidden solder joint defects that cannot be seen with optical inspection. It is especially important for BGA, QFN, and high-density PCB assemblies.…

AOI Inspection in PCB Assembly: What Can It Detect?

AOI Inspection in PCB Assembly: What Can It Detect?

Automated Optical Inspection (AOI) is one of the most widely used quality control methods in PCB assembly. It helps detect soldering and component placement defects early in production. This article…

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Han Sphere Blog shares the latest trends, technologies, and best practices in PCB design, manufacturing, and the electronics industry. Our expert team regularly shares their knowledge and experience.

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