From IP cameras and video analytics to access control, intrusion detection and smart locks — compact, high-performance PCBs engineered for continuous 24/7 security operation.
Modern security systems are intelligent, networked and operate continuously. Every camera, sensor and controller depends on a precisely engineered PCB.
High-frequency RF boards on Rogers laminates for 77 GHz forward collision, lane departure and autonomous driving sensor fusion.
Heavy copper BMS boards for cell monitoring, thermal management and charge control in hybrid and full-electric vehicles.
High-temperature multilayer boards for ECU and TCU operating near the engine bay from -40°C to +150°C.
HDI multilayer boards for in-vehicle displays, connectivity, navigation and digital cluster platforms.
IPC Class 3 boards for ABS, ESP, airbag control and active suspension — zero tolerance for in-field failure.
Standard multilayer PCBs for door locks, window controls, lighting automation and central body electronics.
Metal-core and aluminium PCBs for matrix LED headlights and adaptive lighting systems.
Robust multilayer PCBs for climate control, seat adjustment and ambient environment management.
Security products are deployed in millions of units worldwide — outdoors, indoors and in harsh environments — with an expectation of years of maintenance-free operation.
A 4K AI camera must fit a full SoC, DDR5, flash, PoE, ISP and IR illumination control onto a board smaller than 50 mm × 50 mm. Any-layer HDI with 2.5/2.5 mil capability is the only practical solution at today's camera feature densities.
any-layer HDI · 2.5/2.5 mil · 4K AI SoC · 50×50 mmSecurity cameras run continuously — often in direct sunlight, at temperatures up to +60°C — for 5–10 years without maintenance. Thermal management through copper fill, via-in-pad and stackup optimisation directly determines whether a camera survives its warranty period.
24/7 · +60°C outdoor · thermal via · 5-year lifeSecurity products ship into CE (EU), FCC (USA), RCM (Australia) and dozens of other regulatory zones. PCB material choices and RF trace routing affect EMC emissions test results. Getting it right at the board level avoids costly re-spins before product launch.
CE · FCC · RCM · EMC-optimised stackupFrom ultra-compact camera modules to server-grade NVR boards — we build the full stack.
Maximum routing density in the compact housings demanded by security cameras and access control terminals. Stacked microvias at 0.1 mm for 0.4 mm BGA routing, with thermal via-in-pad for AI SoC heat management. 48-hour express for rapid camera platform iteration.
Miniaturised rigid-flex boards for smart lock electronics, sensor nodes and wearable access badges. Dynamic flex for door hinge routing and ultra-thin form factors for flush-mounted security hardware.
Controlled impedance multilayer boards for NVR servers and video management computers handling PCIe 4.0 GPU, DDR5 and 10 GbE network interfaces simultaneously. Heavy copper for PTZ motor drive current.
Every parameter below is verified against IATF 16949 and IPC-A-600 Class 3 requirements. Full test reports and material traceability ship with every order.
| Parameter | Automotive Grade | Status |
|---|---|---|
| Anzahl der Schichten | 2 – 30 layers, any-layer HDI | Verfügbar |
| Min. Trace / Space | 2.5 / 2.5 mil | Verfügbar |
| Laser Via Diameter | 0.10 mm minimum | Verfügbar |
| Betriebstemperatur | -40°C to +85°C (outdoor camera grade) | Verfügbar |
| Oberfläche | ENIG / OSP / Immersion Ag | Verfügbar |
| Kontrollierte Impedanz | ±5% TDR verified | Verfügbar |
| Thermal Via-in-Pad | Available for AI SoC thermal management | Verfügbar |
| Prototype Turnaround | 48 hours express / 5 days standard | Verfügbar |
| Compliance Support | CE / FCC / RoHS / REACH materials | Verfügbar |
Security products ship in high volumes across global markets. A 1% field failure rate at volume creates enormous warranty costs and brand damage. Our DFM review, thermal analysis and 100% AOI prevent failures before mass production begins.
Real automotive PCB challenges — and how we solved them.
8-layer HDI board for a 4K AI network camera integrating Ambarella CV25 SoC, LPDDR5, eMMC, ISP, PoE PD, IR LED driver and Wi-Fi 6 in 48 mm × 42 mm board area.
First physical build fit camera housing without modification. AI inference performance 8% above target due to improved thermal management. 99.3% production yield at 50,000-unit lot entry.
10-layer HDI board for a fingerprint + face recognition access terminal. ARM Cortex-A55 cluster, 3D structured light sensor, BLE 5.3, NFC, OSDP and PoE in 90 mm × 55 mm.
EMC pre-compliance passed without board revision. CE marking achieved at first test submission. Product launched 4 weeks ahead of original schedule.
20-layer PCIe 4.0 board for a 64-channel 4K NVR with dual NVIDIA GPU, DDR5-6400, 10 GbE and PCIe RAID controller. TDR-verified impedance on all high-speed interfaces.
All signal integrity specifications met at production entry without SI rework. 10 GbE bit error rate 2× better than specification. Now the reference design for customer's entire NVR product line.
Automotive procurement teams need more than a PCB factory — they need a certified partner with documented processes, fast engineering response and the depth to solve problems before the production line.
Security camera platforms iterate every 12–18 months. Our 48-hour express prototype and 8-hour DFM review keep your hardware team competitive without supply chain delays.
Any-layer HDI with thermal via-in-pad enables full AI SoC integration in camera housings smaller than 50 mm. No thermal derating, no external heatsinks in sealed IP67 enclosures.
Our DFM review, 100% AOI and controlled impedance process deliver production-ready yield from lot 1. No ramp-in period, no burn-in PPM, no warranty surprises.
Security products ship to every market simultaneously. DDP delivery with full CE, FCC and RoHS documentation to your ODM or distribution centre worldwide.
Our security and surveillance PCB engineering team will review your design and return a full DFM report and quote within 8 working hours.
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